Abstract: Arrangement for cleaning circuit cards particularly for removing soldering and resin remnants arising when soldering components on the card. The arrangement comprises a frame (FR) arranged in a container for a liquid cleaner. The frame carrying steering and driving wheels (DH) for two cleaning bands (T1, T2) running in a loop and in parallel with each other. The frame is provided with a guiding groove (R) for parallel guidance of the cleaning bands at such a distance from each other that it is possible to insert a circuit card between the bands. The bands are provided with bristles (B) of a determined height on their surfaces turned towards the cicuit card, in the chosen case 3 mm as a maximum, and the distance between the surface of the circuit card and the groove is such a way that the bristle fibres are bent at an angle of 45 degrees as a maximum when passing the card.