Patents by Inventor Akemi Koketsu

Akemi Koketsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050222322
    Abstract: To provide a floor polish composition which has excellent gloss, black heel mark (BHM) resistance, scuff resistance, and storage stability, which in particular has removability, adhesive properties, stain resistance, and water resistance, which uses no aromatic vinyl monomers in an aqueous resin dispersion for floors and thus has no effects such as sick house syndrome, and which also uses no metal crosslinking and is thus excellent in environmental safety. An aqueous resin dispersion for floors in which a copolymer comprising the monomer units (a), (b), and (c) as the structural units is dispersed in water, wherein the content ratios of each monomer in said aqueous resin dispersion for floors, based on the total amount of all the monomers, are: (a) 1 to 70 wt. % vinyl monomer units with an alicyclic structure; (b) 5 to 50 wt. % vinyl monomer units with carboxyl groups; and (c) 5 to 90 wt. % non-aromatic vinyl monomer units other than (a) and (b) above; as well as a floor polish comprising the dispersion.
    Type: Application
    Filed: July 17, 2003
    Publication date: October 6, 2005
    Inventors: Akemi Koketsu, Hidenori Funaki, Tamio Nakamura
  • Publication number: 20040171732
    Abstract: A water-based resin dispersion, a method for producing the water-based resin dispersion, and its applications. The water-based resin dispersion of the invention is excellent in permeability, leveling property and chemical stability. The water-based resin dispersion is produced by causing reaction of macromonomer composition and a vinyl monomer in an aqueous medium. The macromonomer composition is obtained by polymerization of a monomer mixture in a temperature range between 160° C. and 350° C., wherein a monomer mixture contains, with respect to the total amount of all monomers provided for the production of the macromonomer composition, for example: a vinyl monomer having alkyl group in the &agr;-position at 10 to 80 weight %; a non-aromatic vinyl monomer having hydrogen atom in the &agr;-position at 90 weight % or less; and styrene at 30 weight % or less. The macromonomer composition includes a hydrophilic monomer unit and a hydrophobic monomer unit.
    Type: Application
    Filed: December 15, 2003
    Publication date: September 2, 2004
    Inventors: Hideo Matsuzaki, Hiroaki Ishii, Kotaro Yoneda, Michihiro Kaai, Akemi Koketsu
  • Patent number: 6302994
    Abstract: A process for producing an article with a label, which comprises attaching, to an article, a heat-sensitive and pressure-sensitive adhesive label having an adhesive layer composed of a pressure-sensitive adhesive composition, which is an aqueous emulsion type composition comprising: (A) a water-soluble resin obtained by neutralizing a resin having an acid value of 1 meq/g or more, with a base, and (B) a polymer having an acid value of 0.6 meq/g or less and a glass transition temperature of −20° C. or lower, obtained by emulsion polymerization of a radical-polymerizable monomer, and which, when made into an aqueous film and dried at a temperature lower than 60° C., becomes a film (1) of two-phase structure wherein particles composed of the component (B) are dispersed in a continuous phase composed of the component (A) and, when the film (1) is heated to a temperature of 60° C.
    Type: Grant
    Filed: February 8, 1999
    Date of Patent: October 16, 2001
    Assignee: Toagosei Co., Ltd.
    Inventors: Daisuke Kamiya, Kiyokazu Mizutani, Yoichi Kirito, Akemi Koketsu, Makoto Niwa, Kotaro Yoneda, Hiroshi Iesako, Hitoshi Kato
  • Patent number: 6156378
    Abstract: A process for producing a pressure-sensitive adhesive sheet using an aqueous resin emulsion is disclosed. The aqueous resin emulsion is an aqueous resin emulsion that dispersed particles have a weight average particle diameter of 0.3 .mu.m or smaller and a ratio of the weight average particle diameter thereof to an arithmetic average particle diameter thereof [(weight average particle diameter)/(arithmetic average particle diameter)] is 1.0 to 1.5. The resin contained in the aqueous resin emulsion preferably comprises an alkyl (meth)acrylate monomer unit (a) having 4 to 12 carbon atoms in the alkyl moiety, an .alpha.,.beta.-ethylenically unsaturated carboxylic acid monomer unit (b), and a radically polymerizable monomer unit (c) having a cyclic structure, other than the monomer units (a) and (b), the proportions of the monomer unit (a), the monomer unit (b), and the monomer unit (c) being 45 to 97% by weight, 0.1 to 10% by weight, and 2.
    Type: Grant
    Filed: August 4, 1999
    Date of Patent: December 5, 2000
    Assignee: Toagosei Co., Ltd.
    Inventors: Akemi Koketsu, Minoru Tanaka, Hiroshi Iesako