Patents by Inventor Akhmadi Eko Wardoyo

Akhmadi Eko Wardoyo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8753562
    Abstract: [Problem] This invention aims to provide a production method of a fine grain polycrystalline diamond compact which is suitable for finishing cutting tool materials and/or ultra-precision machining tool materials. In the method, a freeze-drying process for preventing the growth of secondary particle formation is unnecessary, and an aid does not need to be mixed in advance. [Means for Resolution] Disclosed is a following production method of a fine grain polycrystalline diamond compact. Each of carbonate and a C—H based organic compound which is a solid at room temperature, is sandwiched between diamond powder layers to stack them up in layers in a Ta capsule. Particle size of the diamond powder is 4 ?m or less in average; and the organic compound is preferably one or more selected from among polyethylene, polypropylene and polystyrene. The layers in the capsule are sintered under the conditions of a pressure of 7.7 GPa or higher and a temperature of 2000° C. or higher.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: June 17, 2014
    Assignee: Mitsubishi Materials Corporation
    Inventors: Akhmadi Eko Wardoyo, Itsurou Tajima
  • Patent number: 8657893
    Abstract: A method for producing a highly uniform and highly dense sintered cubic boron nitride compact having high hardness by sintering at a milder condition without a binder, is provided. The method includes deflocculating secondary particles in cubic boron nitride starting powders by dispersing the starting powders in a solution of a deflocculant; molding the green compact after removing the solution of the deflocculant from the starting powders; and then sintering the green compact in the presence of a supercritical fluid source in a supercritical state by pressing and heating the green compact together with the supercritical fluid source. The supercritical fluid source can be one or more selected from a group consisted of polyvinylidene chloride, polyvinyl chloride, polyethylene, polypropylene, polystyrene, a polyester and an ABS resin. In the sintering, the pressure is 5 GPa or higher, and the temperature is 1400° C. or higher.
    Type: Grant
    Filed: February 8, 2011
    Date of Patent: February 25, 2014
    Assignee: Mitsubishi Materials Corporation
    Inventors: Akhmadi Eko Wardoyo, Itsurou Tajima, Minoru Akaishi
  • Publication number: 20120152625
    Abstract: A cutting tip for a drilling tool includes a cemented carbide cutting base, a diamond element supported by the cutting base, and a bonding layer formed between the cutting base and the diamond element in order to bond them. The bonding layer includes diffusion layers and in which one or two or more metals selected from a group consisting of Fe, Ni, Co, Ti, Zr, W, V, Nb, Ta, Cr, Mo, and Hf diffuses into at least one of the diamond or the cement carbide.
    Type: Application
    Filed: February 9, 2012
    Publication date: June 21, 2012
    Applicant: Mitsubishi Materials Corporation
    Inventors: Kazuo Yamamoto, Tadakazu Ohashi, Akhmadi Eko Wardoyo
  • Patent number: 8043533
    Abstract: The present invention is to provide a diamond sintered compact having good conductivity together with the characteristics, such as hardness, thermal conductivity, thermal resistance, chemical stability, almost equal to those of a natural diamond. A boron-doped diamond sintered compact having good conductivity and high thermal resistance is produced by a sintering process, in which 90 to 99.9 wt. % of a boron-doped diamond powder and 0.1 to 10% wt. % of a powder comprising, one or more of carbonates including Mg, Ca, Sr or Ba, and/or one or more of composite carbonates composed by two or more of these elements, as a bonding phase component, are sintered together under Ht/HP conditions, and the bonding phase component melts and then fills into the space between the boron-doped diamond powder particles.
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: October 25, 2011
    Assignee: Mitsubishi Materials Corporation
    Inventors: Itsuro Tajima, Akhmadi Eko Wardoyo, Osamu Fukunaga
  • Publication number: 20110241266
    Abstract: [Problem] This invention aims to provide a production method of a fine grain polycrystalline diamond compact which is suitable for finishing cutting tool materials and/or ultra-precision machining tool materials. In the method, a freeze-drying process for preventing the growth of secondary particle formation is unnecessary, and an aid does not need to be mixed in advance. [Means for Resolution] Disclosed is a following production method of a fine grain polycrystalline diamond compact. Each of carbonate and a C—H based organic compound which is a solid at room temperature, is sandwiched between diamond powder layers to stack them up in layers in a Ta capsule. Particle size of the diamond powder is 4 ?m or less in average; and the organic compound is preferably one or more selected from among polyethylene, polypropylene and polystyrene. The layers in the capsule are sintered under the conditions of a pressure of 7.7 GPa or higher and a temperature of 2000° C. or higher.
    Type: Application
    Filed: March 28, 2011
    Publication date: October 6, 2011
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Akhmadi Eko Wardoyo, Itsurou Tajima
  • Publication number: 20110192093
    Abstract: A method for producing a highly uniform and highly dense sintered cubic boron nitride compact having high hardness by sintering at a milder condition without a binder, is provided. The method includes deflocculating secondary particles in cubic boron nitride starting powders by dispersing the starting powders in a solution of a deflocculant; molding the green compact after removing the solution of the deflocculant from the starting powders; and then sintering the green compact in the presence of a supercritical fluid source in a supercritical state by pressing and heating the green compact together with the supercritical fluid source. The supercritical fluid source can be one or more selected from a group consisted of polyvinylidene chloride, polyvinyl chloride, polyethylene, polypropylene, polystyrene, a polyester and an ABS resin. In the sintering, the pressure is 5 GPa or higher, and the temperature is 1400° C. or higher.
    Type: Application
    Filed: February 8, 2011
    Publication date: August 11, 2011
    Applicant: Mitsubishi Materials Corporation
    Inventors: Akhmadi Eko Wardoyo, Itsurou Tajima, Minoru Akaishi
  • Publication number: 20100320423
    Abstract: The present invention is to provide a diamond sintered compact having good conductivity together with the characteristics, such as hardness, thermal conductivity, thermal resistance, chemical stability, almost equal to those of a natural diamond. A boron-doped diamond sintered compact having good conductivity and high thermal resistance is produced by a sintering process, in which 90 to 99.9 wt. % of a boron-doped diamond powder and 0.1 to 10% wt. % of a powder comprising, one or more of carbonates including Mg, Ca, Sr or Ba, and/or one or more of composite carbonates composed by two or more of these elements, as a bonding phase component, are sintered together under Ht/HP conditions, and the bonding phase component melts and then fills into the space between the boron-doped diamond powder particles.
    Type: Application
    Filed: October 26, 2007
    Publication date: December 23, 2010
    Applicant: Mitsubishi Materials Corporation
    Inventors: Itsuro Tajima, Akhmadi Eko Wardoyo, Osamu Fukunaga
  • Publication number: 20100019017
    Abstract: A cutting tip for a drilling tool includes a cemented carbide cutting base, a diamond element supported by the cutting base, and a bonding layer formed between the cutting base and the diamond element in order to bond them. The bonding layer includes diffusion layers and in which one or two or more metals selected from a group consisting of Fe, Ni, Co, Ti, Zr, W, V, Nb, Ta, Cr, Mo, and Hf diffuses into at least one of the diamond or the cement carbide.
    Type: Application
    Filed: October 7, 2009
    Publication date: January 28, 2010
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kazuo Yamamoto, Tadakazu Ohashi, Akhmadi Eko Wardoyo
  • Patent number: 7261753
    Abstract: A cutting tip for a drilling tool includes a cemented carbide cutting base 11, a diamond element 12 supported by the cutting base 11, and a bonding layer formed between the cutting base 11 and the diamond element 12 in order to bond them. The bonding layer 13 includes diffusion layers S1 and S2 in which one or two or more metals selected from a group consisting of Fe, Ni, Co, Ti, Zr, W, V, Nb, Ta, Cr, Mo, and Hf diffuses into at least one of the cemented carbide or the diamond.
    Type: Grant
    Filed: July 25, 2003
    Date of Patent: August 28, 2007
    Assignee: Mitsubishi Materials Corporation
    Inventors: Kazuo Yamamoto, Tadakazu Ohashi, Akhmadi Eko Wardoyo