Patents by Inventor Akifumi Takashima

Akifumi Takashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automatic reflow soldering apparatus
    Patent number: 5242096
    Abstract: An automatic reflow soldering apparatus for soldering a printed circuit board having a plurality of electronic elements mounted thereon to be soldered while the printed circuit is heated, wherein transporting means transports a carrier carrying the printed circuit board to be soldered, positioning means arranged on the carrier position the printed circuit board on the carrier and support means arranged on the carrier support the printed circuit board to prevent the latter from being warped when heated to be soldered. The printed circuit board is transported through all of the soldering processes from a heating process to a cooling process while the printed circuit board is thus positioned and supported. Further provided is means which is automatically operated to position and support the printed circuit board on the carrier.
    Type: Grant
    Filed: July 30, 1992
    Date of Patent: September 7, 1993
    Assignees: NEC Corporation, EIGHTECH TECTRON Co., Ltd.
    Inventors: Masashi Tsunabuchi, Taihei Takeshita, Tadanori Ishikura, Akifumi Takashima