Patents by Inventor Akihiko Haga

Akihiko Haga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5191697
    Abstract: There is provided a method of manufacturing a loudspeaker damper having the steps of attaching a conductive material to a damper raw material at the top or bottom surface thereof, the damper raw material being made of a woven or unwoven cloth impregnated with thermosetting resin such as phenol resin and being made in a semi-dry state, and thermally molding the damper raw material with the conductive material to form concentric corrugation along which conductive material used as a conductive wire for a voice signal is formed, wherein the method further including the steps of: after attaching the conductive material to the damper raw material, coating creamy solder to the conductive material at a predetermined area, melting the creamy solder by the heat at the thermal molding step, detaching the damper raw material from a metal mold to cool and harden the creamy sodler, and forming preparatory solder at the end portion of the conductive material.
    Type: Grant
    Filed: October 4, 1991
    Date of Patent: March 9, 1993
    Assignees: Kabushiki Kaisha Kenwood, Mogami Denki Kabushiki Kaisha
    Inventors: Yoshio Sakamoto, Akihiko Haga
  • Patent number: 5125473
    Abstract: Conductive members are sewed and mounted to a damper main body. The conductive members are made of a woven wire which is formed by winding double conductive foils. The shape of the corrugations of the damper increases as the position approaches from the inner periphery to the outer periphery.
    Type: Grant
    Filed: March 25, 1991
    Date of Patent: June 30, 1992
    Assignees: Kabushiki Kaisha Kenwood, Mogami Denki Kabushiki Kaisha
    Inventors: Yoshio Sakamoto, Akihiko Haga
  • Patent number: 4674592
    Abstract: A diaphragm for use in an electro-acoustic transducer comprises a diaphragm main body only or mainly composed of natural fibers, a layer formed by laminating thereover a polyamide resin and a synthetic resin coating layer further formed to the surface of the laminate layer. The diaphragm is free from pin holes, exhibits satisfactory water proofness and excellent physical properties such as sonic propagation velocity inherent to the natural fibers. It can be fabricated with ease at a good yield and can reduce the fabrication cost.
    Type: Grant
    Filed: November 12, 1985
    Date of Patent: June 23, 1987
    Assignee: Alpine Electronics Inc.
    Inventors: Shuichi Aoki, Katsuyoshi Kumagai, Akihiko Haga, Minoru Ito