Patents by Inventor Akihiko Kasahara
Akihiko Kasahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11245164Abstract: An invention comprises: a circular waveguide that has a cylindrical section having a circular pipe conduit with a circular shaped cross section, and side wall sections joined to the both sides in an axial direction of the cylindrical section; a first rectangular waveguide that has a first rectangular pipe conduit with a rectangular shaped cross section and that is joined to one of the side wall sections so that the first rectangular pipe conduit communicates with the circular pipe conduit; a second rectangular waveguide that has a second rectangular pipe conduit with a rectangular shaped cross section and that is joined to the other of the side wall sections so that the second rectangular pipe conduit communicates with the circular pipe conduit; and a dielectric plate that is configured as a plate shape, is disposed in the circular pipe conduit, and is airtightly held to the cylindrical section, wherein the circular waveguide has a plastically deformable section that is plastically deformable so that at leastType: GrantFiled: March 23, 2018Date of Patent: February 8, 2022Assignee: NEC Network and Sensor Systems, Ltd.Inventors: Akihiko Kasahara, Takashi Nakano
-
Publication number: 20200020999Abstract: An invention comprises: a circular waveguide that has a cylindrical section having a circular pipe conduit with a circular shaped cross section, and side wall sections joined to the both sides in an axial direction of the cylindrical section; a first rectangular waveguide that has a first rectangular pipe conduit with a rectangular shaped cross section and that is joined to one of the side wall sections so that the first rectangular pipe conduit communicates with the circular pipe conduit; a second rectangular waveguide that has a second rectangular pipe conduit with a rectangular shaped cross section and that is joined to the other of the side wall sections so that the second rectangular pipe conduit communicates with the circular pipe conduit; and a dielectric plate that is configured as a plate shape, is disposed in the circular pipe conduit, and is airtightly held to the cylindrical section, wherein the circular waveguide has a plastically deformable section that is plastically deformable so that at leastType: ApplicationFiled: March 23, 2018Publication date: January 16, 2020Applicant: NEC Network and Sensor Systems, Ltd.Inventors: Akihiko KASAHARA, Takashi NAKANO
-
Patent number: 9196448Abstract: An electron tube includes a shell that encloses a helix inside, and a plurality of support rods that support and fix the helix inside the shell, a part of each support rod that is in contact with an inner wall of the shell being covered with a conductive material, another part of each support rod that is in contact with the helix being covered with a dielectric material. The widths of conductive material of one end and another end of each support rod in a longitudinal direction are different, the side surface not being in contact with the shell nor the helix.Type: GrantFiled: March 28, 2014Date of Patent: November 24, 2015Assignee: NEC Network and Sensor Systems, Ltd.Inventor: Akihiko Kasahara
-
Publication number: 20140292190Abstract: An electron tube includes a shell that encloses a helix inside, and a plurality of support rods that support and fix the helix inside the shell, a part of each support rod that is in contact with an inner wall of the shell being covered with a conductive material, another part of each support rod that is in contact with the helix being covered with a dielectric material. The widths of conductive material of one end and another end of each support rod in a longitudinal direction are different, the side surface not being in contact with the shell nor the helix.Type: ApplicationFiled: March 28, 2014Publication date: October 2, 2014Applicant: NETCOMSEC CO., LTD.Inventor: Akihiko KASAHARA
-
Publication number: 20060097669Abstract: An electron tube is provided with a plurality of supports, a portion of the support covered with conductive material abuts the inner wall of the shell, and another portion of the support covered with dielectric abuts the helix. The helix which is used as a high-frequency circuit for bringing about interaction between an electron beam and a high-frequency signal is supported and fixed within the shell by plurality of supports.Type: ApplicationFiled: October 31, 2005Publication date: May 11, 2006Applicant: NEC MICROWAVE TUBE, LTD.Inventors: Satoru Teshima, Akihiko Kasahara
-
Patent number: 5904287Abstract: The method for bonding graphite to metal, includes the steps of forming a metal carbide layer on a surface of the graphite, the metal being to be bonded to said graphite, and brazing the graphite to the metal with an active alloy brazing material. The present invention is based on the fact discovered by the inventor that if a metal carbide layer is in advance formed on a surface of a graphite, an active metal such as Ti could more easily react on the metal carbide layer to thereby bond the metal to the graphite, rather than the case in which a graphite member is made to directly react on an active metal to thereby bond the graphite member to the metal.Type: GrantFiled: July 29, 1994Date of Patent: May 18, 1999Assignee: NEC CorporationInventors: Minoru Tashiro, Akihiko Kasahara
-
Patent number: 5403558Abstract: A metallic carrier composed of an end face portion formed in at least one of the axial end portions of a honeycomb body and an outer circumferential reinforcing layer in which foils in a range from the outermost layer to a quarter of the total number of layers are joined together in the axial intermediate portion. Thus, the metallic carrier is flexible in expansion and shrinkage. Further, the honeycomb body and a jacket are joined to each other mainly at the outer circumference of the outer circumferential reinforcing layer of the honeycomb body, to reduce thermal stress developed between the honeycomb body and jacket while maintaining the strength against a high temperature, to thereby prevent the metallic carrier from being ruptured.Type: GrantFiled: July 6, 1993Date of Patent: April 4, 1995Assignees: Nippon Steel Corporation, Toyota Jidosha Kabushiki Kaisha, Nippon Kinzoku Co., Ltd.Inventors: Takuo Kono, Mikio Yamanaka, Takashi Tanaka, Yasushi Ishikawa, Yutaka Sadano, Masao Yashiro, Tatuo Sugiura, Tadanobu Komai, Shinichi Matsumoto, Toshihiro Takada, Shinji Shibata, Hikaru Aoyagi, Masaaki Ohashi, Yoshio Nishizawa, Akihiko Kasahara
-
Patent number: 5082167Abstract: When soldering a honeycomb body formed by alternately piling flat foils (plates) and corrugated foils (plates), a binder liquid is sucked up from the end face of the honeycomb body to form a binder streak in a space defined by contacting portions of the flat foil (plate) and corrugated foil (plate), a solder is scattered and applied onto the binder streak, and the honeycomb body is then dried and heated to effect a soldering of the honeycomb body. According to this method, soldering can be accomplished only in the vicinity of the contacting portions of the flat foil (plate) and corrugated foil (plate), with a desired soldering structure.Type: GrantFiled: September 17, 1990Date of Patent: January 21, 1992Assignees: Nippon Steel Corporation, Toyota Jidosha Kabushiki Kaisha, Nippon Kinzoku Co., Ltd.Inventors: Yutaka Sadano, Yuuji Nakashima, Takashi Tanaka, Takatoshi Kawasaki, Shinji Shibata, Hikaru Aoyagi, Yoshio Nishizawa, Akihiko Kasahara
-
Patent number: 5045404Abstract: A heat-resistant stainless steel foil for a catalyst-carrier of combustion exhaust gas purifiers, consisting essentially in weight percentage of:more than 0.06 up to 0.15 of Ln, the Ln being a mixture of La, Ce, Pr and Nd;from 8x(%Ln+0.015) /45 to 0.1 of P;from 4.5 to 6.5 of Al;from 13 to 25 of Cr;not more than 0.025 of C;not more than 0.02 of N;not more than 0.03 of C+N; andthe balance consisting of Fe and unavoidable impurities.Type: GrantFiled: September 26, 1990Date of Patent: September 3, 1991Assignees: Nippon Steel Corporation, Toyota Jidosha Kabushiki Kaisha, Nippon Kinzoku Co., Ltd.Inventors: Keiichi Ohmura, Miko Yamanaka, Fumio Fudanoki, Masayuki Tendoh, Kenji Hirashima, Masaaki Kobayashi, Shinji Shibata, Tomoyuki Sugino, Toshihiro Takada, Yoshio Nishizawa, Akihiko Kasahara
-
Patent number: 4870046Abstract: A rolled high Al stainless steel foil for use as a substrate for a catalyst carrier, which comprises more than 12 wt % up to 20 wt % of Al, from 5 to 25 wt % of Cr, from 0.05 to 2 wt %, in total, of at least one element selected from the group consisting of Ti, Nb, Zr, and Hf, and the remainder substantially consisting of Fe and unavoidable elements. The stainless steel foil has an excellent resistance to oxidation in an engine exhaust gas at a temperature of 1150.degree. C. or higher, can be obtained by foil-rolling, and enables a reduction of the exhaust back-pressure and weight of automobile catalyst converters.Type: GrantFiled: April 21, 1988Date of Patent: September 26, 1989Assignees: Nippon Steel Corporation, Toyota Jidosha Kabushiki Kaisha, Nippon Kinzoku Co., Ltd.Inventors: Mikio Yamanaka, Keiichi Ohmura, Shinichi Matsumoto, Shinji Shibata, Toshiyuki Yashiro, Akihiko Kasahara
-
Patent number: 4867811Abstract: A process for producing a metallic catalyst-carrier, comprising the steps of: preparing a steel sheet containing 9.0 to 25.0 wt % Cr and 0.01 to 6.0 wt % Al, plating the steel sheet with Ni at an amount of from 0.3 to 10.0 g/m.sup.2, then plating with Al or Al-alloy at a plated amount defined by the formula; ##EQU1## and with a provision that the thickness of an Al-Fe alloyed layer is controlled to a thickness of 10 .mu.m or less, cold rolling to a rolled thickness of 0.1 mm or less, working to a body of a required form, and heat-treating the body.Type: GrantFiled: July 27, 1988Date of Patent: September 19, 1989Assignees: Nippon Steel Corporation, Toyota Jidosha Kabushiki Kaisha, Nippon Kinzoku Co., Ltd.Inventors: Hiroo Wakiyama, Hisashi Baba, Mikio Yamanaka, Keiichi Ohmura, Shinichi Matsumoto, Toshihiro Takada, Shigetoshi Sugimoto, Shinzi Shibata, Toshiyuki Yashiro, Akihiko Kasahara
-
Patent number: RE35063Abstract: When soldering a honeycomb body formed by alternately piling flat foils (plates) and corrugated foils (plates), a binder liquid is sucked up from the end face of tile honeycomb body to form a binder streak in a space defined by contacting portions of the flat foil (plate) and corrugated foil (plate), a solder is scattered and applied onto the binder streak, and the honeycomb body is then dried and heated to effect a soldering of the honeycomb body. According to this method, soldering can be accomplished only in the vicinity of the contacting portions of the flat foil (plate) and corrugated foil (plate), with a desired soldering structure.Type: GrantFiled: January 21, 1994Date of Patent: October 17, 1995Assignees: Nippon Steel Corporation, Toyota Jidosha Kabushiki Kaisha, Nippon Kinzoku Co., Ltd.Inventors: Yutaka Sadano, Yuuji Nakashima, Takashi Tanaka, Takatoshi Kawasaki, Shinji Shibata, Hikaru Aoyagi, Yoshio Nishizawa, Akihiko Kasahara