Abstract: A semiconductor device includes: a transmission line including a capacitor section and an inductor section arranged on a semiconductor substrate, and a junction of the semiconductor substrate and one of the capacitor section and the inductance section, wherein a transmission characteristic of the transmission line is determined by a voltage applied to the junction.

Abstract: A three-dimensional integrated device includes at least two integrated circuit substrates laminated to each other, each of the integrated circuit substrates having at least one ground plane, at least one aperture provided at a desired location in the ground plane, the end of a microstrip line formed in a pair with the ground plane and placed in the aperture, and a transmitter and/or a receiver that is connected to the microstrip line and transmits and/or receives signals at a frequency substantially corresponding to the perimeter ? of the aperture. Each of the apertures in each of the integrated circuit substrates is superimposed on at least one of the apertures in the other integrated circuit substrates in the direction perpendicular to the ground planes, and the signals are transported in a contactless manner between the integrated circuit substrates through the apertures at a frequency substantially corresponding to the perimeter ? of the apertures.

Abstract: A semiconductor device includes: a transmission line including a capacitor section and an inductor section arranged on a semiconductor substrate, and a junction of the semiconductor substrate and one of the capacitor section and the inductance section, wherein a transmission characteristic of the transmission line is determined by a voltage applied to the junction.

Abstract: This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit (2) in which first to third unit wiring layers (5) to (7), each having a capacitor (12) or the like at a part, are stacked and formed on flattened one surface of a dummy board (30) so that a third pattern wiring is exposed from a connection surface (2a) of an uppermost layer is mounted on a mounting surface (3a) of a base board (3) where an input/output terminal part (18) is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.

Abstract: A high-frequency module having a communication function is provided which includes a base substrate block (2) formed from organic substrates (11, 12), the organic substrate (11) having wiring layers (14, 15) formed on main sides, respectively, thereof while the organic substrate (12) has wiring layers (16, 17) formed on main sides, respectively, thereof, the base substrate block (2) having a buildup surface formed by flattening an uppermost layer, and an elements block (3) formed from organic insulative layers (26, 28) formed on the buildup surface of the base substrate block (2) and in which a plurality of conductive parts (19, 20, 32) forming passive elements and distributed parameter elements, which transmit a high-frequency signal, are formed along with wiring layers (27, 29). The conductive parts (19, 20, 32) in the elements block (3) are formed correspondingly to portions of the organic substrate (11) in the base substrate block (2) where no woven glass fabric is laid.

Abstract: The present invention is directed to a high frequency module used for wireless communication module, and comprises a first organic substrate (11) in which conductive pattern or patterns are formed on the principal surface thereof and one element body (7) or more are mounted, and a second organic substrate (12) in which a recessed portion (22) is formed in correspondence with the area where the element body or bodies (7) are mounted at the connecting surface to the first organic substrate (11). In the state where the second organic substrate (12) is connected to the first organic substrate (11), an element body accommodating portion (24) which seals the element body or bodies (7) is constituted by the recessed portion (22), wherein the element body accommodating portion (24) is adapted so that moisture resistance characteristic and oxidation resistance characteristic are maintained.

Abstract: The present invention is directed to a high frequency module used for wireless communication module, and comprises a first organic substrate (11) in which conductive pattern or patterns are formed on the principal surface thereof and one element body (7) or more are mounted, and a second organic substrate (12) in which a recessed portion (22) is formed in correspondence with the area where the element body or bodies (7) are mounted at the connecting surface to the first organic substrate (11). In the state where the second organic substrate (12) is connected to the first organic substrate (11), an element body accommodating portion (24) which seals the element body or bodies (7) is constituted by the recessed portion (22), wherein the element body accommodating portion (24) is adapted so that moisture resistance characteristic and oxidation resistance characteristic are maintained.

Abstract: The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose main surface is formed as a build-up surface (2a) and a high frequency circuit part (3) formed on the build-up surface of the base board (2) and having passive elements formed. The base board (2) has an area (29) in which wiring is not formed in a lower layer from a fourth wiring layer (8b). The high frequency circuit part (3) has an upper electrode part (36) and a lower electrode part (35) in positions corresponding to the area (29) in which the wiring is not formed. Thus, since a capacitance (18) is provided just above the area (29) in which the wiring is not formed, a parasitic capacity that the capacitance (18) receives from ground patterns (14) is reduced. Accordingly, the characteristics of the capacitance (18) can be improved.

Abstract: A photoelectronic device capable of maintaining the degree of freedom in designing for dealing with design changes and responding to producing a variety of kinds in a small amount, and the production method are provided: wherein a light emitting element for emitting a light to be a clock signal, a semiconductor chip provided with light receiving portions for receiving the light, and an optical waveguide sheet formed to be a sheet, wherein an outer circumference of a core is covered with a clad, adhered to said semiconductor chip are provided; and the optical waveguide sheet is configured to be irradiated at a light incident portion of a core with a light from the light emitting element and includes one or more T-shaped branch having a vertical opening portion having a vertical inner wall, which is vertical with respect to the direction within a surface of the optical waveguide sheet and becomes a mirror surface for dividing and reflecting the light, and a sloping opening portion having a sloping inner wall, w

Abstract: An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit board, an optical waveguide path arranged on the multilayer circuit board, a light receiving element, IC chips, and a light emitting element, the optical waveguide path formed on a transparent substrate excellent in flatness and transferred to the multilayer circuit board. The light propagation loss becomes small, and a signal to be transmitted at a high speed being transmitted as a light signal and a signal which can be transmitted at a relatively low speed being transmitted as an electrical signal, whereby the signal propagation delay which becomes the problem when a signal is transmitted by only electrical wiring is overcome, and the influence of electromagnetic noise becomes small.

Abstract: A three-dimensional integrated device includes at least two integrated circuit substrates laminated to each other, each of the integrated circuit substrates having at least one ground plane, at least one aperture provided at a desired location in the ground plane, the end of a microstrip line formed in a pair with the ground plane and placed in the aperture, and a transmitter and/or a receiver that is connected to the microstrip line and transmits and/or receives signals at a frequency substantially corresponding to the perimeter ? of the aperture. Each of the apertures in each of the integrated circuit substrates is superimposed on at least one of the apertures in the other integrated circuit substrates in the direction perpendicular to the ground planes, and the signals are transported in a contactless manner between the integrated circuit substrates through the apertures at a frequency substantially corresponding to the perimeter ? of the apertures.

Abstract: This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit (2) in which first to third unit wiring layers (5) to (7), each having a capacitor (12) or the like at a part, are stacked and formed on flattened one surface of a dummy board (30) so that a third pattern wiring is exposed from a connection surface (2a) of an uppermost layer is mounted on a mounting surface (3a) of a base board (3) where an input/output terminal part (18) is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.

Abstract: The present invention provides a high frequency module having a base substrate unit (2) which has its uppermost layer planarized to form a buildup-forming surface (16), a high frequency circuit unit (3) having multiple wiring layers which are formed on the base substrate unit (2), each of which layers has a wiring pattern and film elements formed on a dielectric insulating layer thereof, whose uppermost wiring layer (17) has plural lands (22) and ground patterns (20) formed thereon together with the wiring pattern and inductor elements (19), and a semiconductor chip (4) mounted on the wiring layer (17) of the high frequency circuit unit (3). Transmission lines (24) to connect the inductor elements (19) and lands (22) which are formed on the wiring layer (17) are directed within hollowed pattern regions (20c) formed at the ground pattern (20) to constitute coplanar type transmission lines.

Abstract: A photoelectronic device providing design freedom and providing for the production of a variety of designs in small quantities. The device includes a light emitting element for emitting a light to be used as a clock signal, a semiconductor chip with light receiving portions, and an optical waveguide sheet having an outer circumference of a core covered with a clad. The optical waveguide sheet is irradiated at a light incident portion of the core with a light from the light emitting element and includes one or more T-shaped branches. At each T-shaped branch, a vertical opening portion has a vertical inner wall serving as a mirrored structure for dividing and reflecting the light. The optical waveguide sheet includes a sloping opening portion with a sloping inner wall serving as a mirrored surface for reflecting the incident light in a direction out of a surface of the optical waveguide sheet.

Abstract: This invention is a circuit board device having a filter element. It has a base board (4), a circuit part (2) mounted on the base board (4), a filter element (5) arranged between the circuit part (2) and the base board (4), and a semiconductor component (3) mounted on the same plate as the circuit part (2) on the base board (4). The semiconductor component (3) is mounted on a thin plate region (17) that is thinner than a thick plate region (16) having its thickness increased by mounting the circuit part (2) on the base board (4). Thus, the thickness of the whole circuit board device is reduced and the filter element (5) is covered with a sufficiently thick dielectric insulating material so as to prevent deterioration in filter characteristic.

Abstract: A photoelectronic device capable of maintaining the degree of freedom in designing for dealing with design changes and responding to producing a variety of kinds in a small amount, and the production method are provided: wherein a light emitting element for emitting a light to be a clock signal, a semiconductor chip provided with light receiving portions for receiving the light, and an optical waveguide sheet formed to be a sheet, wherein an outer circumference of a core is covered with a clad, adhered to said semiconductor chip are provided; and the optical waveguide sheet is configured to be irradiated at a light incident portion of a core with a light from the light emitting element and includes one or more T-shaped branch having a vertical opening portion having a vertical inner wall, which is vertical with respect to the direction within a surface of the optical waveguide sheet and becomes a mirror surface for dividing and reflecting the light, and a sloping opening portion having a sloping inner wall, w

Abstract: This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit (2) in which first to third unit wiring layers (5) to (7), each having a capacitor (12) or the like at a part, are stacked and formed on flattened one surface of a dummy board (30) so that a third pattern wiring is exposed from a connection surface (2a) of an uppermost layer is mounted on a mounting surface (3a) of a base board (3) where an input/output terminal part (18) is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured.

Abstract: To provide a semiconductor device configured that a micro device having a device substrate, a function element provided on the device substrate and having an oscillator or a movable part, first lands provided on a surface of the device substrate by being arranged on its outer circumference portion of the function element, and bumps provided to the first lands is mounted on the circuit board having second lands formed to correspond to the bumps, from the bump formation surface side, so that the bumps and the second lands are electrically connected; on which a sealing resin layer is formed to go round the outer circumference portion of the function element to fix connection portions of the bumps and the second lands, and to seal a clearance between the device substrate and the circuit board; and a cavity portion is formed between the function element and the circuit board.

Abstract: An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit board, an optical waveguide path arranged on the multilayer circuit board, a light receiving element, IC chips, and a light emitting element, the optical waveguide path formed on a transparent substrate excellent in flatness and transferred to the multilayer circuit board. The light propagation loss becomes small, and a signal to be transmitted at a high speed being transmitted as a light signal and a signal which can be transmitted at a relatively low speed being transmitted as an electrical signal, whereby the signal propagation delay which becomes the problem when a signal is transmitted by only electrical wiring is overcome, and the influence of electromagnetic noise becomes small.

Abstract: A photoelectronic device capable of maintaining the degree of freedom in designing for dealing with design changes and responding to producing a variety of kinds in a small amount, and the production method are provided: wherein a light emitting element for emitting a light to be a clock signal, a semiconductor chip provided with light receiving portions for receiving the light, and an optical waveguide sheet formed to be a sheet, wherein an outer circumference of a core is covered with a clad, adhered to said semiconductor chip are provided; and the optical waveguide sheet is configured to be irradiated at a light incident portion of a core with a light from the light emitting element and includes one or more T-shaped branch having a vertical opening portion having a vertical inner wall, which is vertical with respect to the direction within a surface of the optical waveguide sheet and becomes a mirror surface for dividing and reflecting the light, and a sloping opening portion having a sloping inner wall, w