Abstract: Each of branch pipes has an internal space into which an atmosphere flows from a main pipe. A downstream damper is provided on the downstream side of an upstream damper in each of the branch pipes, and opens/closes the branch pipe. An upstream switching member switches a state of an upstream space between a state where the upstream space permits an inflow of an external atmosphere and a state where the upstream space prohibits the inflow of the external atmosphere. A downstream switching member switches a state of a downstream space between a state where the downstream space permits an inflow of the external atmosphere and a state where the downstream space prohibits the inflow of the external atmosphere.

Abstract: A substrate processing device includes a substrate holding table, an ultraviolet irradiator, a tubular member, a first gas supplying unit, and a second gas supplying unit. The ultraviolet irradiator is disposed facing to the substrate through an active space and configured to irradiate the substrate with ultraviolet light. The tubular member includes an inner surface surrounding a side surface of the substrate holding table, and at least one opening at a position facing to the side surface on the inner surface. The first gas supplying unit supplies gas to a space between the side surface of the substrate holding table and the inner surface of the tubular member through the at least one opening. The second gas supplying unit supplies gas to an active space between the substrate and the ultraviolet irradiator.

Abstract: A substrate processing apparatus includes a driving magnet that is disposed correspondingly to a movable pin and that has a predetermined polar direction with respect to a radial direction of a rotary table, a pressing magnet that has a magnetic pole that gives an attractive magnetic force or a repulsive magnetic force between the driving magnet and the pressing magnet and that presses a support portion against a peripheral edge of a substrate by urging the support portion toward a contact position by means of the attractive magnetic force or the repulsive magnetic force, and a pressing-force changing unit that changes a magnitude of a pressing force against the peripheral edge of the substrate pressed by the support portion while keeping the magnitude higher than zero in response to rotation of the rotary table.

Abstract: A substrate processing apparatus includes a driving magnet that is disposed correspondingly to a movable pin and that has a predetermined polar direction with respect to a radial direction of a rotary table, a pressing magnet that has a magnetic pole that gives an attractive magnetic force or a repulsive magnetic force between the driving magnet and the pressing magnet and that presses a support portion against a peripheral edge of a substrate by urging the support portion toward a contact position by means of the attractive magnetic force or the repulsive magnetic force, and a pressing-force changing unit that changes a magnitude of a pressing force against the peripheral edge of the substrate pressed by the support portion while keeping the magnitude higher than zero in response to rotation of the rotary table.

Abstract: A substrate processing apparatus includes a driving magnet that is disposed correspondingly to a movable pin and that has a predetermined polar direction with respect to a radial direction of a rotary table, a pressing magnet that has a magnetic pole that gives an attractive magnetic force or a repulsive magnetic force between the driving magnet and the pressing magnet and that presses a support portion against a peripheral edge of a substrate by urging the support portion toward a contact position by means of the attractive magnetic force or the repulsive magnetic force, and a pressing-force changing unit that changes a magnitude of a pressing force against the peripheral edge of the substrate pressed by the support portion while keeping the magnitude higher than zero in response to rotation of the rotary table.

Abstract: A substrate processing method including a center portion discharging step of discharging a low-surface-tension liquid from a first low-surface-tension liquid nozzle disposed above a substrate toward the center portion of an upper surface, an inert gas supplying step of supplying inert gas to above the substrate in parallel with the center portion discharging step in order to form a gas flow flowing along the upper surface, and a peripheral edge portion discharging and supplying step of discharging the low-surface-tension liquid from a second low-surface-tension liquid nozzle disposed above the substrate toward a peripheral edge portion of the upper surface in parallel with the center portion discharging step and the inert gas supplying step.

Abstract: A substrate processing method is a substrate processing method which applies sequentially common etching processing which is common to each of a plurality of substrates. The common etching processing has an etching step and a high-temperature liquid discharge step. The substrate processing method further includes a piping heating step in which, of the plurality of common etching processings applied to the plurality of substrates, before the initial common etching processing, the pipe wall of the common piping is raised in temperature up to a predetermined second liquid temperature higher than a first liquid temperature and in each of the common etching processings, after each of high-temperature liquid discharge steps and before each of next etching steps, there is not performed a step in which the pipe wall of the common piping is lowered in temperature.

Abstract: A substrate holding/rotating device includes an urging unit, urging support portions of movable pins to either an open position or a hold position, first and second driving magnets, mounted in correspondence to respective movable pins of respective first and second movable pin groups and having mutually opposite magnetic pole directions, a first moving magnet, for urging the support portions of the first movable pin group to the other of either the open position or the hold position, and a second moving magnet, for urging the support portions of the second movable pin group to the other of either the open position or the hold position.

Abstract: A substrate processing method including a center portion discharging step of discharging a low-surface-tension liquid from a first low-surface-tension liquid nozzle disposed above a substrate toward the center portion of an upper surface, an inert gas supplying step of supplying inert gas to above the substrate in parallel with the center portion discharging step in order to form a gas flow flowing along the upper surface, and a peripheral edge portion discharging and supplying step of discharging the low-surface-tension liquid from a second low-surface-tension liquid nozzle disposed above the substrate toward a peripheral edge portion of the upper surface in parallel with the center portion discharging step and the inert gas supplying step.

Abstract: A substrate processing device includes a substrate holding table, an ultraviolet irradiator, a tubular member, a first gas supplying unit, and a second gas supplying unit. The ultraviolet irradiator is disposed facing to the substrate through an active space and configured to irradiate the substrate with ultraviolet light. The tubular member includes an inner surface surrounding a side surface of the substrate holding table, and at least one opening at a position facing to the side surface on the inner surface. The first gas supplying unit supplies gas to a space between the side surface of the substrate holding table and the inner surface of the tubular member through the at least one opening. The second gas supplying unit supplies gas to an active space between the substrate and the ultraviolet irradiator.

Abstract: A substrate processing method is a substrate processing method which applies sequentially common etching processing which is common to each of a plurality of substrates. The common etching processing has an etching step and a high-temperature liquid discharge step. The substrate processing method further includes a piping heating step in which, of the plurality of common etching processings applied to the plurality of substrates, before the initial common etching processing, the pipe wall of the common piping is raised in temperature up to a predetermined second liquid temperature higher than a first liquid temperature and in each of the common etching processings, after each of high-temperature liquid discharge steps and before each of next etching steps, there is not performed a step in which the pipe wall of the common piping is lowered in temperature.

Abstract: This substrate holding/rotating device includes an opening magnet forming a predetermined magnetic field generation region through which each movable pin rotating in response to rotation of the rotary table is capable of passing, the magnetic field generation region disposed so as to be eccentric with respect to a rotation direction of the rotary table and so as to allow only driving magnets corresponding to part of the plurality of movable pins to pass through the magnetic field generation region, the opening magnet giving a repulsive force or an attractive force to the driving magnet of the movable pin passing through the magnetic field generation region, the opening magnet generating a force that enables the support portion of the movable pin urged to the hold position by the urging unit to move toward the open position against an urging force of the urging unit.

Abstract: A substrate processing apparatus includes a driving magnet that is disposed correspondingly to a movable pin and that has a predetermined polar direction with respect to a radial direction of a rotary table, a pressing magnet that has a magnetic pole that gives an attractive magnetic force or a repulsive magnetic force between the driving magnet and the pressing magnet and that presses a support portion against a peripheral edge of a substrate by urging the support portion toward a contact position by means of the attractive magnetic force or the repulsive magnetic force, and a pressing-force changing unit that changes a magnitude of a pressing force against the peripheral edge of the substrate pressed by the support portion while keeping the magnitude higher than zero in response to rotation of the rotary table.

Abstract: This substrate holding/rotating device includes an opening magnet forming a predetermined magnetic field generation region through which each movable pin rotating in response to rotation of the rotary table is capable of passing, the magnetic field generation region disposed so as to be eccentric with respect to a rotation direction of the rotary table and so as to allow only driving magnets corresponding to part of the plurality of movable pins to pass through the magnetic field generation region, the opening magnet giving a repulsive force or an attractive force to the driving magnet of the movable pin passing through the magnetic field generation region, the opening magnet generating a force that enables the support portion of the movable pin urged to the hold position by the urging unit to move toward the open position against an urging force of the urging unit.

Abstract: A substrate holding/rotating device includes an urging unit, urging support portions of movable pins to either an open position or a hold position, first and second driving magnets, mounted in correspondence to respective movable pins of respective first and second movable pin groups and having mutually opposite magnetic pole directions, a first moving magnet, for urging the support portions of the first movable pin group to the other of either the open position or the hold position, and a second moving magnet, for urging the support portions of the second movable pin group to the other of either the open position or the hold position.

Abstract: A substrate processing apparatus supplies a resist stripping solution, formed by mixing sulfuric acid and a hydrogen peroxide solution, to a surface of a substrate. The substrate processing apparatus includes a nozzle that discharges the resist stripping solution toward the substrate, a hydrogen peroxide solution supply passage through which the hydrogen peroxide solution flows toward the nozzle, a plurality of sulfuric acid supply passages respectively connected to a plurality of mixing positions along the hydrogen peroxide solution supply passage that differ in flow passage length to the nozzle, and a sulfuric acid supply passage selecting unit that introduces the sulfuric acid from a sulfuric acid supply source to a sulfuric acid supply passage selected from among the plurality of sulfuric acid supply passages.