Abstract: An apparatus (1) includes a supporting base material (12) that supports an element (11), a heat-dissipating member (13) on which the supporting base material (12) is installed, and an adhesive layer (14) disposed between the heat-dissipating member (13) and the supporting base material (12). The glass transition temperature of the adhesive layer (14) is equal to or lower than ?30° C.

Abstract: A resin composition used to prepare a sheet-like prepreg by impregnating a substrate with the resin composition includes an epoxy resin that contains a naphthalene-modified epoxy resin, and a triazine-modified novolac resin. A sheet-like prepreg is formed by impregnating a substrate with the resin composition. A laminate formed using the prepreg exhibits excellent flame retardancy, solder heat resistance, and lead-free heat resistance, has a small coefficient of linear expansion in the thickness direction, and has excellent adhesion to a conductor circuit.

Abstract: An object of the present invention is to provide a resin composition having excellent impregnation property into a base material and capable of producing a prepreg, metal-clad laminate and printed wiring board excellent in properties such as low warpage, flame resistance, low thermal expansion properties, drill processability and desmear resistance. A first resin composition comprises an epoxy resin, an irregular-shaped first inorganic filler and a second inorganic filler having an average particle diameter of 10 to 100 nm which is different from that of the first inorganic filler. A second resin composition comprises an epoxy resin, silicone rubber particles having an average particle diameter of 1 ?m to 10 ?m, boehmite particles having an average particle diameter of 0.2 ?m to 5 ?m, and silica nanoparticles having an average particle diameter of 10 nm to 100 nm.

Abstract: The present invention relates generally to resin compositions having a generally halogen-free epoxy resin that can encompass a novolak epoxy resin, a curing agent and a non-halogen flame-retardant material. For some embodiments, the curing agent can be dicyandiamide and the flame retardant can be 10-benzyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide. Embodiments of the current invention also relate generally to prepregs prepared from such resin compositions; and laminates prepared from such prepregs.

Abstract: The invention offers a method of manufacturing a prepreg capable of impregnating a fiber substrate with a liquid resin with a high degree of impregnation, and a prepreg obtained by this method. The invention is a method of manufacturing a prepreg by impregnating a long fiber substrate with a liquid resin using a kiss roller whose bottom portion is immersed in a liquid resin, including a step of impregnating the fiber substrate with a liquid resin from one surface thereof, by conveying the fiber substrate while maintaining contact with a circumferential surface of the kiss roller which is not immersed in resin, and performing this step at least twice in succession, and a prepreg obtained by this manufacturing method.

Abstract: A resin composition used to prepare a sheet-like prepreg by impregnating a substrate with the resin composition includes an epoxy resin that contains a naphthalene-modified epoxy resin, and a triazine-modified novolac resin. A sheet-like prepreg is formed by impregnating a substrate with the resin composition. A laminate formed using the prepreg exhibits excellent flame retardancy, solder heat resistance, and lead-free heat resistance, has a small coefficient of linear expansion in the thickness direction, and has excellent adhesion to a conductor circuit.

Abstract: The present invention relates generally to resin compositions having a generally halogen-free epoxy resin that can encompass a novolak epoxy resin, a curing agent and a non-halogen flame-retardant material. For some embodiments, the curing agent can be dicyandiamide and the flame retardant can be 10-benzyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide. Embodiments of the current invention also relate generally to prepregs prepared from such resin compositions; and laminates prepared from such prepregs.

Abstract: The present invention provides a resin composition having excellent flame retardancy without using any halogen-containing flame retardant, and prepregs and laminates using such a resin composition. More specifically, the present invention provides a flame-retardant resin composition comprising as essential components (A) an epoxy resin, (B) a curing agent and (C) a phosphorus compound containing at least as part thereof a phosphine oxide compound, a prepreg produced by impregnating this flame-retardant resin composition in a fiber base, and a laminate produced by hot-pressing a single sheet or a pile of two or more sheets of the prepreg.

Abstract: The present invention provides a flame-retardant resin composition having high flame retardancy without using any halogen compound and suited for printed circuit boards. Specifically, it provides a flame-retardant resin composition containing as its essential constituents: (A) a novolak epoxy resin, (B) a novolak resin, and (C) a phosphorus compound reactable with said epoxy resin or novolak resin, and also provides prepregs and laminates or copper-clad laminates using this resin composition.

Abstract: A flame-retardant resin composition which comprises (A) 100 parts by weight of an unhalogenated epoxy resin having at least two epoxy groups in one molecule, (B) 20 to 205 parts by weight of a maleimide compound having at least one maleimido group in one molecule, (C) 20 to 65 parts by weight of a curing agent having an amino group and (D) a phosphorus compound in a proportion of 0.5 to 4.5 parts by weight in terms of phosphorus element per 100 parts by weight of a total of the components (A), (B) and (C), provided that the proportion of nitrogen element contained in the composition is 2.0 to 10.0 parts by weight per 100 parts by weight of the total composition. The above flame-retardant resin composition has a high flame retardance without adding a halogen compound and does not deteriorate the characteristics of commercial products.