Patents by Inventor Akihiro Endo
Akihiro Endo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240002663Abstract: An anti-fouling silicone composite sheet including: a substrate layer containing a fluororesin; and a silicone adhesive layer stacked on one surface of the substrate layer, having a hardness of 5 or less as measured with an Asker C hardness tester, and having an adhesive force with respect to a mortar test piece of 5 N/25 mm or more, wherein the substrate layer has a surface on which the silicone adhesive layer is stacked and the other surface is an anti-fouling surface. By the above configuration, the present invention provides an anti-fouling silicone composite sheet capable of exhibiting anti-fouling performance, washability, easiness of washing, and wear resistance stably for a long period, easily attachable to an adherend, and conformable even to cracking and shifting on the application surface; and a method for performing a prevention of graffiti by using the anti-fouling silicone composite sheet.Type: ApplicationFiled: November 22, 2021Publication date: January 4, 2024Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Keiji IMAIZUMI, Akihiro ENDO, Masaki MOTEKI
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Publication number: 20230144516Abstract: An anti-fouling silicone composite sheet includes a substrate layer, and a silicone adhesive layer stacked on one surface of the substrate layer, and has a hardness of 5 or less measured with an Asker C hardness tester and an adhesive force of 5 N/25 mm or more with respect to a mortar test piece, in which a surface of the substrate layer which is located on a side opposite to the surface where the silicone adhesive layer is stacked is a surface anti-fouling-treated with a silicone hard coating agent containing a fluorine-containing silicone compound. An anti-fouling silicone composite sheet is capable of exhibiting anti-fouling performance and washability stably for a long period, easily attachable to an adherend, and followable even to cracking and shifting on the application surface; and a method for preventing graffiti by using the anti-fouling silicone composite sheet.Type: ApplicationFiled: February 10, 2021Publication date: May 11, 2023Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akihiro ENDO, Keiji IMAIZUMI, Masahiro YODA
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Patent number: 11608419Abstract: A thermally conductive sheet in which a cured layer of a thermally conductive silicone composition is laminated on one or both sides of a synthetic resin film layer of aromatic polyimide, etc. having excellent heat resistance, electrical insulation, and mechanical strength, wherein good thermal conductivity, good insulation, and strong interlayer adhesion are provided because the thermally conductive silicone composition includes 250 to 600 wt. % of an aspherical thermally conductive filler material, which contains no more than 80 ml/100 g of a DOP oil absorption amount and an organic silicon compound component including an adhesion imparting agent, relative to 100 wt. % of the organic silicon compound component, and moreover the thermally conductive sheet with no brittleness during use can be made using continuous molding.Type: GrantFiled: January 16, 2018Date of Patent: March 21, 2023Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akihiro Endo, Yasuhisa Ishihara, Hisaharu Yamaguchi, Masahiro Moteki
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Publication number: 20230047058Abstract: One of the objects of the present invention is to provide a thermally conductive silicone resin composition which has good thermal conductivity, a light weight (namely, a light weight per unit volume), and good reliability in high humidity, and a molded body thereof. The present invention provides a thermally conductive silicone resin composition comprising the following components (A) to (E): (A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom in an amount of 100 parts by mass, (B) an organohydrogen polysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that a ratio of the number of the hydrogen atom bonded to a silicon atom relative to the number of the alkenyl group in component (A) is 0.1 to 2, (C) a thermally conductive filler in an amount of 2500 to 6000 parts by mass, (D) a catalytic amount of an addition reaction catalyst, and (E) an addition-reaction controlling agent in an amount of 0.Type: ApplicationFiled: December 8, 2020Publication date: February 16, 2023Inventors: Takanori Ito, Akihiro Endo, Junichi Tsukada
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Publication number: 20220403113Abstract: Provided is a thermally conductive silicone composition that can be turned into a lightweight cured product superior in thermal conductivity, and is easily processable due to its low viscosity. The composition contains: (A) an organopolysiloxane having at least two alkenyl groups per each molecule; (B) an organohydrogenpolysiloxane having, per each molecule, at least two hydrogen atoms directly bonded to silicon atoms; (C) a thermally conductive filler containing magnesium oxide (20 to 40% by mass), aluminum oxide (40 to 60% by mass) and aluminum hydroxide (10 to 30% by mass); (D) a dimethylpolysiloxane with one end of the molecular chain thereof being blocked by a trialkoxy group; (E) a platinum group metal-based curing catalyst; and (F) an addition reaction control agent.Type: ApplicationFiled: October 27, 2020Publication date: December 22, 2022Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Junichi TSUKADA, Takanori ITO, Akihiro ENDO, Megumi MIYANO
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Publication number: 20220234335Abstract: A thermal conductive composite silicone rubber sheet includes a thermal conductive silicone rubber sheet and a thermosoftening silicone resin layer with a thickness of 0.5 to 10 ?m on one side of the thermal conductive silicone rubber sheet, the thermosoftening silicone resin layer having an viscosity at 70° C. of 700 Pa·s or lower, where the thermosoftening silicone resin layer has adhesion of 0.5 N/25 mm or higher at a normal temperature and the thermal conductive composite silicone rubber sheet has a thermal resistance lower than a value obtained by adding 0.3 cm2·K/W per one layer of one side of the thermosoftening silicone resin layer to a thermal resistance of the thermal conductive silicone rubber sheet. A thermal conductive composite silicone rubber sheet provided with an adhesive layer on one side of a thermal conductive silicone rubber sheet, makes it possible to impart adhesion without sacrificing thermal conductivity.Type: ApplicationFiled: April 15, 2020Publication date: July 28, 2022Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Yasuhisa ISHIHARA, Akihiro ENDO
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Publication number: 20220220354Abstract: The present invention is a cured material of a thermal conductive silicone composition, the composition containing: 6 to 40 volume % of an organopolysiloxane as a component (A), and 60 to 94 volume % of a heat conductive filler as a component (B), the heat conductive filler containing; (B-i) unsintered crushed aluminum nitride having an average particle size of 40 ?m or more and having 1 mass % or less of a fine powder with a particle size of 5 ?m or less, and (B-ii) a heat conductive material other than the unsintered crushed aluminum nitride having an average particle size of 1 ?m or more, where the component (B-ii) content is 30 to 65 volume %. This provides a cured material of a thermal conductive silicone composition excellent in handling properties and having a high thermal conductivity.Type: ApplicationFiled: October 30, 2019Publication date: July 14, 2022Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Yasuhisa ISHIHARA, Akihiro ENDO, Katsuyuki TANAKA
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Publication number: 20220220311Abstract: The purpose of the present invention is therefore to provide a thermally conductive composite tape which is in a form of sheet and, therefore, easy to handle, excellent in strength and electrical insulation, easily stick to an element or heat release-member, and shows strong adhesion to the heat-release member.Type: ApplicationFiled: April 20, 2020Publication date: July 14, 2022Inventors: Takanori Ito, Akihiro Endo
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Patent number: 11359111Abstract: Provided is a thermally conductive thin-film cured product constituted by a cured product of a handleable silicone composition, the cured product having good transferability to a member and good post-debonding handling properties, and exhibiting good bond strength to a heat-generating element, even at elevated temperatures. The thermally conductive thin-film cured product is obtained by curing a silicone composition containing: (a) 100 parts by mass of an organopolysiloxane comprising two or more alkenyl groups per molecule; 200-2,000 parts by mass, inclusive, of a thermally conductive filler; (c) an amount of an organohydrodiene polysiloxane comprising two or more hydrogen atoms directly bonded to a silicon atom per molecule such that Si—H/alkenyl groups is 0.5-50.0, inclusive; (d) an amount of a platinum group metal compound equal to 0.Type: GrantFiled: January 8, 2019Date of Patent: June 14, 2022Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Takanori Ito, Akihiro Endo, Yuki Tanaka
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Publication number: 20220127500Abstract: One of the purposes of the present invention is to provide a composite heat-release sheet which is excellent in thermal conductivity and electrical insulation property and, at the same time, has all of sufficient adhesion to an actual machine, low thermal resistance, reworkability, and reliable adhesive strength. Another purpose is to provide a more convenient production process for the heat-release sheet.Type: ApplicationFiled: February 4, 2020Publication date: April 28, 2022Inventors: Takanori Ito, Akihiro Endo
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Patent number: 11248154Abstract: A thermoconductive silicone composition which has (A) an organopolysiloxane as a base polymer and includes (B) a thermoconductive filler, wherein the thermoconductive filler is 60-85 vol % of the thermoconductive silicone composition, and 40-60 vol % of the thermoconductive filler is aluminum nitride having an average particle diameter of at least 50 ?m.Type: GrantFiled: October 5, 2017Date of Patent: February 15, 2022Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Yasuhisa Ishihara, Akihiro Endo
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Patent number: 11214721Abstract: Provided is a thermally conductive composite silicone rubber sheet formed by laminating an acrylic pressure-sensitive adhesive layer on one side of a non-pressure-sensitive adhesive/high-hardness thermally conductive silicone rubber sheet, wherein the acrylic pressure-sensitive adhesive layer is a cured product of an acrylic pressure-sensitive adhesive composition containing: an acrylic pressure-sensitive adhesive made of a polymer of a monomer mixture in which 5-50 mol % of hydroxyl group-containing monomers are contained in all of the constituent monomers; and 0.05-5 parts by mass of a chelate-based curing agent with respect to 100 parts by mass of the acrylic pressure-sensitive adhesive, and the thermally conductive silicone rubber sheet has a thermally conductive silicone rubber layer which, as a cured product of a thermally conductive silicone composition containing a thermally conductive filler, has a durometer A hardness of 60-96.Type: GrantFiled: October 6, 2017Date of Patent: January 4, 2022Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Takanori Ito, Akihiro Endo, Yasuhisa Ishihara
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Patent number: 11077647Abstract: Provided is an inexpensive thermally conductive silicone rubber composite sheet. The thermally conductive silicone rubber composite sheet of the invention includes a laminated structure body comprised of an intermediate layer and an outer layer laminated on both surfaces of the intermediate layer, in which (A) the intermediate layer is an electrical insulating synthetic resin film layer having a thermal conductivity of not lower than 0.20 W/m·K and a tensile elastic modulus of not lower than 5 GPa, and (B) the outer layer is a silicone rubber layer of a cured product of a composition containing: (a) an organopolysiloxane; (b) a curing agent; (c) a thermally conductive filler; and (d) a silicon compound-based adhesion imparting agent having at least one kind of group selected from the group consisting of an epoxy group, an alkoxy group, a methyl group, a vinyl group and a Si—H group.Type: GrantFiled: July 12, 2017Date of Patent: August 3, 2021Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akihiro Endo, Yuki Tanaka
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Publication number: 20210130561Abstract: A thermally conductive sheet in which a cured layer of a thermally conductive silicone composition is laminated on one or both sides of a synthetic resin film layer of aromatic polyimide, etc. having excellent heat resistance, electrical insulation, and mechanical strength, wherein good thermal conductivity, good insulation, and strong interlayer adhesion are provided because the thermally conductive silicone composition includes 250 to 600 wt. % of an aspherical thermally conductive filler material, which contains no more than 80 ml/100 g of a DOP oil absorption amount and an organic silicon compound component including an adhesion imparting agent, relative to 100 wt. % of the organic silicon compound component, and moreover the thermally conductive sheet with no brittleness during use can be made using continuous molding.Type: ApplicationFiled: January 16, 2018Publication date: May 6, 2021Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akihiro ENDO, Yasuhisa ISHIHARA, Hisaharu YAMAGUCHI, Masahiro MOTEKI
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Publication number: 20200354526Abstract: Provided is a thermally conductive thin-film cured product constituted by a cured product of a handleable silicone composition, the cured product having good transferability to a member and good post-debonding handling properties, and exhibiting good bond strength to a heat-generating element, even at elevated temperatures. The thermally conductive thin-film cured product is obtained by curing a silicone composition containing: (a) 100 parts by mass of an organopolysiloxane comprising two or more alkenyl groups per molecule; 200-2,000 parts by mass, inclusive, of a thermally conductive filler; (c) an amount of an organohydrodiene polysiloxane comprising two or more hydrogen atoms directly bonded to a silicon atom per molecule such that Si—H/alkenyl groups is 0.5-50.0, inclusive; (d) an amount of a platinum group metal compound equal to 0.Type: ApplicationFiled: January 8, 2019Publication date: November 12, 2020Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Takanori ITO, Akihiro ENDO, Yuki TANAKA
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Publication number: 20200181334Abstract: An organic silicon compound represented by the following general formula (1). An organic silicon compound that can fill a heat conductive filler at the high density and can be used in a curable thermal conductive silicone composition capable of suppressing the strength degradation of the curable thermal conductive silicone composition even when the heat conductive filler is densely filled. (In the formula, R1 represents an alkyl group having 1 to 6 carbon atoms, R2 represents independently a hydrogen atom or a nonsubstituted or substituted monovalent hydrocarbon group, R3 and R4 each represents independently a nonsubstituted or substituted monovalent hydrocarbon group, and R5 represents a hydrogen atom or an alkenyl group, and m represents an integer of 1 to 30, and n represents an integer of 3 to 4.Type: ApplicationFiled: June 22, 2018Publication date: June 11, 2020Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Yasuhisa ISHIHARA, Takumi FUKAMACHI, Toshiyuki OZAI, Akihiro ENDO
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Patent number: 10676587Abstract: A heat conductive sheet comprising a cured product layer of a heat conductive silicone composition on one or both surfaces of a glass cloth sealed using a cured product of a heat conductive resin composition. The heat conductive silicone composition includes an organic silicon compound component and an aspherical heat conductive filler. The amount of the heat conductive filler is 250 to 600 parts by mass with respect to 100 parts by mass of the organic silicon compound component, and the heat conductive filler has a DOP oil absorption of not more than 80 ml/100 g. The heat conductive sheet can be continuously manufactured by coating molding and wound into a roll even with the use of an inexpensive aspherical heat conductive filler, and has high heat conductivity, low thermal contact resistance, and high insulating properties.Type: GrantFiled: June 9, 2017Date of Patent: June 9, 2020Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akihiro Endo, Yasuhisa Ishihara, Toru Tsuchiya, Hisaharu Yamaguchi, Masahiro Moteki, Takahiro Maruyama
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Publication number: 20200123427Abstract: Provided is an inexpensive thermally conductive silicone rubber composite sheet. The thermally conductive silicone rubber composite sheet of the invention includes a laminated structure body comprised of an intermediate layer and an outer layer laminated on both surfaces of the intermediate layer, in which (A) the intermediate layer is an electrical insulating synthetic resin film layer having a thermal conductivity of not lower than 0.20 W/m·K and a tensile elastic modulus of not lower than 5 GPa, and (B) the outer layer is a silicone rubber layer of a cured product of a composition containing: (a) an organopolysiloxane; (b) a curing agent; (c) a thermally conductive filler; and (d) a silicon compound-based adhesion imparting agent having at least one kind of group selected from the group consisting of an epoxy group, an alkoxy group, a methyl group, a vinyl group and a Si—H group.Type: ApplicationFiled: July 12, 2017Publication date: April 23, 2020Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Akihiro ENDO, Yuki TANAKA
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Publication number: 20190316018Abstract: Provided is a thermally conductive composite silicone rubber sheet formed by laminating an acrylic pressure-sensitive adhesive layer on one side of a non-pressure-sensitive adhesive/high-hardness thermally conductive silicone rubber sheet, wherein the acrylic pressure-sensitive adhesive layer is a cured product of an acrylic pressure-sensitive adhesive composition containing: an acrylic pressure-sensitive adhesive made of a polymer of a monomer mixture in which 5-50 mol % of hydroxyl group-containing monomers are contained in all of the constituent monomers; and 0.05-5 parts by mass of a chelate-based curing agent with respect to 100 parts by mass of the acrylic pressure-sensitive adhesive, and the thermally conductive silicone rubber sheet has a thermally conductive silicone rubber layer which, as a cured product of a thermally conductive silicone composition containing a thermally conductive filler, has a durometer A hardness of 60-96.Type: ApplicationFiled: October 6, 2017Publication date: October 17, 2019Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Takanori ITO, Akihiro ENDO, Yasuhisa ISHIHARA
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Publication number: 20190256756Abstract: A thermoconductive silicone composition which has (A) an organopolysiloxane as a base polymer and includes (B) a thermoconductive filler, wherein the thermoconductive filler is 60-85 vol % of the thermoconductive silicone composition, and 40-60 vol % of the thermoconductive filler is aluminum nitride having an average particle diameter of at least 50 ?m.Type: ApplicationFiled: October 5, 2017Publication date: August 22, 2019Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Yasuhisa ISHIHARA, Akihiro ENDO