Abstract: The object of the present invention is to provide a process for producing a high-quality polymer microparticle having uniform particle size of the order of several micrometers to tens of micrometers by inverse suspension polymerization at high productivity while keeping excellent dispersion stability without causing aggregation among particles. The process is one for the production of polymer microparticles by inverse polymerization of a vinyl monomer and is characterized in that the inverse suspension polymerization is conducted dividing at least two steps, an oil-soluble oxidizing agent and a water-soluble reducing agent are used as a polymerization initiator, and the oil-soluble oxidizing agent is fed after the water-soluble reducing agent is fed.

Abstract: The object of the present invention is to provide a process for producing high-quality polymer microparticles having uniform particle size of the order of several micrometers to tens of micrometers by inverse suspension polymerization at high productivity while keeping excellent dispersion stability without causing aggregation among particles. The process is one for the production of polymer microparticles by inverse suspension polymerization of a vinyl monomer and includes steps of preparing in a dispersing tank a water-in-oil (W/O) type emulsion in which an organic solvent is a continuous phase and an aqueous solution of a vinyl-based monomer is a dispersing phase, and conducting the inverse suspension polymerization while feeding the water-in-oil (W/O) type emulsion to a continuous stirred tank reactor.

Abstract: A process for producing polymer microparticles by suspension polymerization of a vinyl-based monomer in which, when polymer microparticles are produced by suspension polymerization of a vinyl-based monomer, a macromonomer having a radically polymerizable unsaturated group at a terminus of a vinyl-based monomer-derived polymer is used as a dispersion stabilizer.

Abstract: An electronic device including: a circuit board with an electronic circuit; a heat conductor to conduct heat generated in the electronic circuit; an electronic element to be used under an ambient temperature lower than a temperature of the heat conductor heated by heat generated in the electronic circuit; and a support to support the circuit board, the heat conductor, and the electronic element, wherein the support is positioned between the heat conductor and the electronic element so that a first plane of projection of the heat conductor on the support and a second plane of projection of the heat conductor on the support do not overlap with each other.

Abstract: Disclosed is an electronic device comprising an electronic element which generates heat during operation and another electronic element to be used under an ambient temperature lower than a temperature caused by heat irradiated from the heat generating element, wherein the electronic device comprises a support means to support a housing of the electronic device, and a heat conducting means being arranged between the support means and the heat generating element to conduct heat irradiated from the heat generating element.