Abstract: An electronic device includes a chip component, a conductive terminal, a case, and a fixation part. The chip component includes a terminal electrode on an end surface of the chip component. The conductive terminal is connected to the terminal electrode. The case includes an accommodation recess for accommodating the chip component. The fixation part fixes the case to an installation portion.

Abstract: An electronic device 10 comprises chip capacitors 20a and 20b, an accommodation recess 62 accommodating the chip capacitors 20a and 20b, and a case 60 including a protrusion 64 partitioning the accommodation recess 62 into a first accommodation space 62a and a second accommodation space 62b along the X-axis direction. The protrusion 64 includes a first protrusion 64a and a second protrusion 64b disposed away from the first protrusion 64a along the Y-axis direction. The first protrusion 64a and the second protrusion 64b are disposed with a communication space 69 provided between the first protrusion 64a and the second protrusion 64b, so that the first accommodation space 62a and the second accommodation space 62b communicate.

Abstract: An image processing device for a projection system includes an image generation unit and a brightness acquisition unit, and the image generation unit generates data for projecting the specific image, as a first portion in the first data for display, which corresponds to the first superimposed region, generates a second portion in the first data for display, which corresponds to the first non-superimposed region based on first input image data in the data of the projection target image, which corresponds to the first non-superimposed region, and the second brightness, and generates a third portion in the second data for display, which corresponds to the second superimposed region based on second input image data in the data of the projection target image, which corresponds to the second superimposed region, and the first brightness.

Abstract: A method of manufacturing a bonded substrate includes: preparing one or plurality of products to be bonded, each including a brazing material layer and a copper plate laminated on both main surfaces of a ceramic substrate, laminating, one or a plurality of products bonded and a pair of clamping members that clamp them while providing a mold releasing layer between each thereof, heating the one or the plurality of products while pressing the one or the plurality of products in the pair of clamping members to obtain the one or the plurality of bonded substrates in which the ceramic substrate and the copper plate are bonded with a bonding layer, and removing the mold releasing layer from the bonded substrate by dissolving a portion in contact with the mold releasing layer of the copper plate included in the bonded substrate by wet etching.

Abstract: A projection apparatus includes a projection portion that performs irradiation with projection light, and a moving mechanism that moves a projection range of the projection light. In a state where the projection range is maintained, the projection apparatus displays an image showing a movement destination of the projection range in response to a first operation by the projection portion. The projection apparatus moves the projection range to the movement destination by the moving mechanism.

Abstract: The drive route generation device according to the present disclosure is configured to execute a process of acquiring a designated point, a process of acquiring a designation condition for a drive route to be generated, a process of selecting one or a plurality of specific spots from a plurality of spots based on the position information and the designation condition for the plurality of spots, and a process of generating, as a drive route, a circulation route that comes back to a designated point via one or a plurality of specific spots using the designated point as a departure point.

Abstract: A switching control circuit is included in a boost direct current to direct current (DC-DC) converter generating an analog power supply voltage to be supplied to a source driver. The switching control circuit supplies a switching pulse to a control terminal of a switching element varying an inductor current such that an operation mode transitions to a current continuation mode during a first predetermined period that is at least a portion of a time duration that continues from a moment when the operation mode transitions from the current continuation mode to a current discontinuation mode in response to transitioning from an efficient video period to a vertical blanking period to a moment when the vertical blanking period transitions to the effective video period.

Abstract: An order reception system according to the present disclosure includes one or more processors. The one or more processors are configured to perform receiving a reservation from a user to provide a dish to a dish providing place, receiving the reservation to provide a dish, calculating a lead time required for providing the dish and an arrival time at which the user arrives at the dish providing place, and instructing the dish providing place to start preparing to provide the dish based on the arrival time and the lead time.

Abstract: A vehicle according to the present disclosure includes a first riding space and a second riding space, each of which is a riding position on one side and the other side of a right side and a left side with respect to a front-rear direction, respectively, and is configured to: acquire a traveling route; identify a side where a landscape viewed from the vehicle is good from among the right side and the left side with respect to a traveling direction; identify a preferential space in which a degree of preferential treatment of a passenger riding in the first riding space or the second riding space is high; and determine the forward direction and the backward direction when the vehicle travels on the traveling route such that the preferential space is set to the side where the landscape viewed from the vehicle is good.

Abstract: An electronic device comprises a chip component including a terminal electrode, a case having an accommodation recess accommodating the chip component, a conductive terminal attached to the case and connected to the terminal electrode, and a case cover disposed on an opening-edge surface of the case so as to cover the accommodation recess. The opening-edge surface has an opening-edge recess at least partly covered by the case cover. The opening-edge recess and the case cover have a space therebetween. The space is filled with a resin.

Abstract: The electronic device includes: a case including a recessed portion and an opening edge portion of the recessed portion; a ceramic element arranged in the recessed portion, having a first main surface and a second main surface facing each other, and including a first electrode portion formed on the first main surface and a second electrode portion formed on the second main surface; a first metal terminal including a first mounting portion, arranged in the opening edge portion and approximately horizontal with respect to the first main surface and the second main surface, and a first electrode connection portion connected to the first electrode portion; and a second metal terminal including a second mounting portion, arranged in the opening edge portion and approximately horizontal with respect to the first main surface and the second main surface, and a second electrode connection portion connected to the second electrode portion.

Abstract: An electronic device includes: a ceramic element including a first electrode portion and a second electrode portion; a first metal terminal including a first external connection portion and a first electrode connection portion connected to the first electrode portion through solder; and a second metal terminal including a second external connection portion and a second electrode connection portion connected to the second electrode portion through solder. The first electrode connection portion includes a first solder stopper formed by undulation of at least a part of a facing surface of the first electrode connection portion facing the first electrode portion to control a range of an adhesion region of solder to the first electrode portion. The second electrode connection portion includes a second solder stopper that is formed by undulation of at least a part of a facing surface of the second electrode connection portion facing the second electrode portion.

Abstract: An electronic device includes a chip component, a case, a resin, and a conductive terminal. The chip component includes a terminal electrode. The case includes an accommodation recess for accommodating the chip component. The resin is filled in the accommodation recess. The conductive terminal is attachable to the case. The conductive terminal includes an inner electrode portion disposed in the accommodation recess and connected to the terminal electrode. The inner electrode portion includes a space formation portion forming a filling space for a conductive agent with an outer surface of the chip component at a position closer to a bottom surface than to an opening of the accommodation recess.

Abstract: A ceramic electronic component including: a ceramic element body including an end surface extending along a first axis, and a side surface extending along a second axis and intersecting the end surface; an end-face electrode formed on the end surface of the ceramic element body; and a lead terminal connected to the end-face electrode by soldering. The lead terminal includes: an adjacent part overlapping the end-face electrode in a side view from the second axis; and an extension part extending from an end of the adjacent part in a direction away from a plane including the side surface. A first recess is formed at the extension part and is recessed in a direction away from a plane including the end surface, and the first recess exists at a position close to the end of the adjacent part.

Abstract: An electronic device includes chip components, a case, conductive terminals, and a fuse. The chip components each include a terminal electrode. The case includes accommodation recesses for accommodating the chip components. The conductive terminals are fixed to the case and respectively connected to the terminal electrodes of the chip components. The fuse electrically connects the chip components.

Abstract: An electronic component having a case including an accommodation part having an opening; a ceramic element in the accommodation part with first and second main faces facing each other, a first and second electrode formed to the first and second main face, respectively; a first metal terminal including a first electrode connecting part connecting to the first electrode, a first mounting part exposed out of the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part and the first mounting part; a second metal terminal including a second electrode connecting part connecting to the second electrode, a second mounting part exposed out of the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part and the second mounting part; and an insulation member between the first electrode and the second terminal arm part.

Abstract: An electronic component including a case including an accommodation part having an opening; a ceramic element arranged in the accommodation part; a metal terminal including an electrode connecting part connecting to the ceramic element, a mounting part exposed out of the accommodation part, and a terminal arm part connecting the electrode connecting part and the mounting part; a case cover including a closing plate part covering the opening, and a case cover lateral side portion extending in a depth direction of the accommodation part from a circumference of the closing plate part and at least partially facing against an accommodation side wall of the accommodation part; and a mold resin filling the accommodation part.

Abstract: An electronic device includes first and second capacitors, a case, a coil, and first to fourth conductive terminals. The first capacitor includes first and second terminal electrodes. The second capacitor includes third and fourth terminal electrodes. The case includes an accommodation recess for accommodating the first and second capacitors. The coil is separated from the first and second capacitors by a part of the case and disposed outside the accommodation recess. The first terminal is connected to the first electrode and partly disposed on a mounting-side bottom surface of the case. The second terminal is connected to one end of the coil and the second electrode and partly disposed on the surface. The third terminal is connected to the other end of the coil and the third electrode and partly disposed on the surface. The fourth terminal is connected to the fourth electrode and partly disposed on the surface.

Abstract: A ceramic electronic device includes a ceramic element body, a terminal electrode, and a lead terminal. The ceramic element body has an end surface and a lateral surface. The terminal electrode is formed on from the end surface to a part of the lateral surface of the ceramic element body. The lead terminal is connected to the terminal electrode by a connection member. The lead terminal includes an electrode facing portion disposed correspondingly to an end-surface electrode of the terminal electrode, an extension unit extending downward from a lower end of the electrode facing portion, and a step surface located between the electrode facing portion and the extension unit. The electrode facing portion has a recess dented in a direction away from the terminal electrode. A center of the recess is located below a center of the electrode facing portion in a height direction.

Abstract: An electronic device includes a case, a ceramic element, a first metal terminal, and a second metal terminal. The case includes a recess and its opening edge. The ceramic element is disposed in the recess and includes a first main surface and a second main surface opposing to each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface. The first metal terminal includes a first mounting portion disposed on the opening edge and being substantially perpendicular to the first and second main surfaces and a first electrode connection portion connected to the first electrode portion. The second metal terminal includes a second mounting portion disposed on the opening edge and being substantially perpendicular to the first and second main surfaces and a second electrode connection portion connected to the second electrode portion.