Patents by Inventor Akihiro Miyazawa
Akihiro Miyazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10328534Abstract: A bonding material of a silver paste includes: fine silver particles having an average primary particle diameter of 1 to 50 nanometers, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as hexanoic acid; silver particles having an average primary particle diameter of 0.5 to 4 micrometers, each of the silver particles being coated with an organic compound, such as oleic acid; a solvent containing 3 to 7% by weight of an alcohol and 0.3 to 1% by weight of a triol; a dispersant containing 0.5 to 2% by weight of an acid dispersant and 0.01 to 0.1% by weight of phosphate ester dispersant; and 0.01 to 0.Type: GrantFiled: June 19, 2014Date of Patent: June 25, 2019Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Keiichi Endoh, Minami Nagaoka, Satoru Kurita, Hiromasa Miyoshi, Yoshiko Kohno, Akihiro Miyazawa
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Patent number: 10090275Abstract: A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.Type: GrantFiled: December 11, 2015Date of Patent: October 2, 2018Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Hirata, Toshihiko Ueyama
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Patent number: 10008471Abstract: A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and performing firing. A diameter of a crystallite of the bonded product on a (111) plane of Ag when heated at 250° C. for 10 minutes in an inert atmosphere is 65 nm or larger.Type: GrantFiled: December 11, 2015Date of Patent: June 26, 2018Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Hirata, Toshihiko Ueyama
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Publication number: 20160172328Abstract: A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.Type: ApplicationFiled: December 11, 2015Publication date: June 16, 2016Applicant: DOWA Electronics Materials Co., Ltd.Inventors: Keiichi ENDOH, Yutaka HISAEDA, Akihiro MIYAZAWA, Aiko NAGAHARA, Toshihiko UEYAMA
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Publication number: 20160136763Abstract: A bonding material of a silver paste includes: fine silver particles having an average primary particle diameter of 1 to 50 nanometers, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as hexanoic acid; silver particles having an average primary particle diameter of 0.5 to 4 micrometers, each of the silver particles being coated with an organic compound, such as oleic acid; a solvent containing 3 to 7% by weight of an alcohol and 0.3 to 1% by weight of a triol; a dispersant containing 0.5 to 2% by weight of an acid dispersant and 0.01 to 0.1% by weight of phosphate ester dispersant; and 0.01 to 0.Type: ApplicationFiled: June 19, 2014Publication date: May 19, 2016Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Keiichi Endoh, Minami Nagaoka, Satoru Kurita, Hiromasa Miyoshi, Yoshiko Kohno, Akihiro Miyazawa
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Publication number: 20160099087Abstract: A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and performing firing. A diameter of a crystallite of the bonded product on a (111) plane of Ag when heated at 250° C. for 10 minutes in an inert atmosphere is 65 nm or larger.Type: ApplicationFiled: December 11, 2015Publication date: April 7, 2016Applicant: DOWA Electronics Materials Co., Ltd.Inventors: Keiichi ENDOH, Yutaka HISAEDA, Akihiro MIYAZAWA, Aiko NAGAHARA, Toshihiko UEYAMA
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Patent number: 9240256Abstract: A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300° C. or lower.Type: GrantFiled: April 23, 2010Date of Patent: January 19, 2016Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama
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Patent number: 8641929Abstract: Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.Type: GrantFiled: June 10, 2011Date of Patent: February 4, 2014Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama
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Publication number: 20130081759Abstract: Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.Type: ApplicationFiled: June 10, 2011Publication date: April 4, 2013Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama
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Publication number: 20120298009Abstract: A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300° C. or lower.Type: ApplicationFiled: April 23, 2010Publication date: November 29, 2012Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama