Patents by Inventor Akihiro Muramoto

Akihiro Muramoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power module and manufacturing method thereof
    Patent number: 8723320
    Abstract: A power module includes a substrate having a surface on which a plurality of wiring patterns are formed, a semiconductor device mounted on the substrate and electrically connected to a part of the plurality of wiring patterns, and a terminal portion with a lead electrically connected to the other part of the plurality of wiring patterns, and is configured that the lead of the terminal portion is formed by laminating a plurality of metal members which contain a material substantially the same as or softer than the material for forming the other part of wiring patterns, and the material of the plurality of metal members, which is the same as or softer than the material for forming the other part of wiring patterns is electrically connected to the other part of wiring patterns through ultrasonic bonding.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: May 13, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Isamu Yoshida, Michiaki Hiyoshi, Takehide Yokozuka, Akihiro Muramoto
  • Power Module and Manufacturing Method Thereof
    Publication number: 20130049201
    Abstract: A power module includes a substrate having a surface on which a plurality of wiring patterns are formed, a semiconductor device mounted on the substrate and electrically connected to a part of the plurality of wiring patterns, and a terminal portion with a lead electrically connected to the other part of the plurality of wiring patterns, and is configured that the lead of the terminal portion is formed by laminating a plurality of metal members which contain a material substantially the same as or softer than the material for forming the other part of wiring patterns, and the material of the plurality of metal members, which is the same as or softer than the material for forming the other part of wiring patterns is electrically connected to the other part of wiring patterns through ultrasonic bonding.
    Type: Application
    Filed: June 29, 2012
    Publication date: February 28, 2013
    Applicant: Hitachi, Ltd.
    Inventors: Isamu YOSHIDA, Michiaki Hiyoshi, Takehide Yokozuka, Akihiro Muramoto