Abstract: Provided is a heat treatment apparatus in which a large-sized substrate can be rapidly heated and rapidly cooled with high uniformity, and a heat treatment method using the heat treatment apparatus. The heat treatment apparatus includes: a first chamber of which one side is opened; a second chamber of which one side is opened; a device for moving the first and the second chambers; a heating device; a gas introduction port; a gas exhaust port; and a jig for longitudinally fixing a substrate, in which the substrate is rapidly heated while the first and the second chambers are connected, and rapidly cooled by separating the chambers to move the substrate away from a heat storage portion of the heating device or the like. Further, the heat treatment method includes the heat treatment apparatus, and a method for manufacturing a semiconductor device using an oxide semiconductor is included.

Abstract: Provided is a heat treatment apparatus in which a large-sized substrate can be rapidly heated and rapidly cooled with high uniformity, and a heat treatment method using the heat treatment apparatus. The heat treatment apparatus includes: a first chamber of which one side is opened; a second chamber of which one side is opened; a device for moving the first and the second chambers; a heating device; a gas introduction port; a gas exhaust port; and a jig for longitudinally fixing a substrate, in which the substrate is rapidly heated while the first and the second chambers are connected, and rapidly cooled by separating the chambers to move the substrate away from a heat storage portion of the heating device or the like. Further, the heat treatment method includes the heat treatment apparatus, and a method for manufacturing a semiconductor device using an oxide semiconductor is included.

Abstract: A new structure of a communication apparatus allowing cables to be arranged, extra space to be eliminated, and allowing easy operation, is disclosed. A body housing has a flat and cylindrical shape and is provided with connectors at the bottom thereof. The body housing stably stands upright on a stand with the bottom portion thereof being accommodated in the stand. Cables connected to the connectors run through a cable restraint provided in the back side of the stand. The center portion of a front surface of the body housing 100 is slightly recessed allowing easy operation. Also, plural heat-dissipating openings are arranged longitudinally along the both side walls of the body housing.

Abstract: A new structure of a communication apparatus allowing cables to be arranged, extra space to be eliminated, and allowing easy operation, is disclosed. A body housing has a flat and cylindrical shape and is provided with connectors at the bottom thereof. The body housing stably stands upright on a stand with the bottom portion thereof being accommodated in the stand. Cables connected to the connectors run through a cable restraint provided in the back side of the stand. The center portion of a front surface of the body housing 100 is slightly recessed allowing easy operation. Also, plural heat-dissipating openings are arranged longitudinally along the both side walls of the body housing.