Patents by Inventor Akihiro Nishimura
Akihiro Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6831092Abstract: A pesticidal composition comprising at least one specific imidazole and at least one fungicide selected from the group consisting of (S)-5-methyl-2-methylthio-5-phenyl-3-phenylamino-3,5-dihydroimidazole-4-one, isopropyl 2-methyl-1-[(1-p-tolylethyl)carbamoyl]-(S)-propylcarbamate, 3,5-dichloro-N-(3-chloro-1-ethyl-1-methyl-2-oxopropyl)-4-methyl-benzamide and N-(&agr;-cyano-2-thienyl)-4-ethyl-2-(ethylamino)-5-thiazole carboxyamide, as active ingredients.Type: GrantFiled: February 20, 2003Date of Patent: December 14, 2004Assignee: Ishihara Sangyo Kaisha, Ltd.Inventors: Munekazu Ogawa, Akihiro Nishimura
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Patent number: 6770662Abstract: The present invention relates to a fungicide containing a novel benzoylpyridine derivative or its salt. The present invention provides a fungicide containing a benzoylpyridine derivative represented by the formula (I) or its salt: wherein X is a halogen atom, a nitro group, a substitutable alkoxy group, a substitutable aryloxy group, a substitutable cycloalkoxy group, a hydroxyl group, a substitutable hydrocarbon group, a substitutable alkylthio group, a cyano group, a carboxyl group which may be esterified or amidated, or a substitutable amino group; n is 1, 2, 3 or 4; R1 is a substitutable alkyl group; R2 is a substitutable alkyl group, a substitutable alkoxy group, a substitutable aryloxy group, a substitutable cycloalkoxy group or a hydroxyl group; and m is 1, 2, 3 or 4, provided that when m is at least 2, R2 may contain an oxygen atom to form a condensed ring.Type: GrantFiled: December 23, 2002Date of Patent: August 3, 2004Assignee: Ishihara Sangyo Kaisha, Ltd.Inventors: Hisaya Nishide, Munekazu Ogawa, Hidemasa Kominami, Koji Higuchi, Akihiro Nishimura
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Publication number: 20030216444Abstract: The present invention relates to a fungicide containing a novel benzoylpyridine derivaitive or its salt. The present invention provides a fungicide containing a benzoylpyridine derivative represented by formula (I) or its salt: wherein X is a halogen atom, a nitro group, a substitutable alkoxy group, a substitutable aryloxy group, a substitutable cyclo(alkoxy group, a hydroxyl group, a substitutable hydrocarbon group, a substitutable alkylthio group, a cyano group, a carboxyl group which may he esterified or amidated, or at substitutable amino group; n is 1, 2, 3 or 4; R1 is a substitutable alkyl group, R2 is a substitutable alkyl group, it substitutable alkoxy group, a substitutable aryloxy group, a substitutable cycloalkoxy group or a hydroxyl group; and m is 1, 2, 3 or 4, provided that when m is at least 2, R2 may contain an oxygen atom to form a condensed ring.Type: ApplicationFiled: December 23, 2002Publication date: November 20, 2003Inventors: Hisaya Nishide, Munekazu Ogawa, Hidemasa Kominami, Koji Higuchi, Akihiro Nishimura
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Publication number: 20030106342Abstract: An apparatus is provided for producing continuous glass filaments by spinning molten glass through nozzles of a bushing and cooling the thus-spun filaments with fins joined to one or more cooled manifolds and arranged in a proximity of the nozzles. Each manifold is provided at at least three locations thereof with at least one inlet port and at least one outlet port for coolant, respectively, with a proviso that the total number of the inlet and outlet ports is the same as the number of the locations of the manifold. Without using a complex construction, this invention makes it possible to provide the fins with improved durability and to produce the glass filaments with improved quality. In particular, the present invention can be applied to large bushings each of which is equipped with a number of nozzles.Type: ApplicationFiled: January 27, 2003Publication date: June 12, 2003Inventor: Akihiro Nishimura
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Patent number: 6550136Abstract: The present invention aims to provide a method of fabricating a printed wiring board characterized in that a printed wiring board is fabricated by perforating a slot by a router bit at a central part of a substrate. The method further includes cutting a wiring portion for electric plating by the router bit. According to the method, the occurrence of cut burr on the surfaces of the wiring pattern, caused by electric plating, is prevented, the product yield is promoted and the operational efficiency is improved. The invention also discloses a method of fabricating a printed wiring board by forming a conductor circuit by patterning a metal coating formed on a surface of an insulating substrate, successively subjecting the conductor circuit to a surface treatment by electric plating and thereafter perforating a slot by a router bit. The slot connects the substrate to a semiconductor chip at a central portion thereof by bonding wires.Type: GrantFiled: February 23, 2000Date of Patent: April 22, 2003Assignee: Sumitomo Metal Mining Co., LTDInventors: Hiroki Hata, Kenichi Yamane, Akihiro Nishimura, Noriaki Taneko
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Patent number: 6431140Abstract: An object of the present invention is to restrict a part of intake flow which is apt to flow in a direction opposite to a counter swirl flow after colliding against a valve stem, and to produce an intense swirl while controlling a worsening of flow coefficient. A valve seat supporting annular stepped surface(14) is formed on an intake port outlet portion of a cylinder head (1), its inner peripheral edge is formed into a shape having an inner peripheral edge (4a) of a valve stem (4)for serving as a base circle, and a extending portion (15) projecting toward a side of a valve stem (11) is provided on a radial intake port inlet side portion. The extending portion (15) is formed into a mountain-like shape which widens from a top portion projecting toward the valve stem side to both peripheral sides and connects to the base circle at its foot ends; or into an arc-like shape; or into a trapezoidal shape.Type: GrantFiled: February 22, 2001Date of Patent: August 13, 2002Assignee: Yanmar Diesel Engine Co., Ltd.Inventors: Akihiro Nishimura, Hiroshi Omote
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Patent number: 5617271Abstract: A cassette loading apparatus of the present invention is capable of loading a plurality of tape cassettes different in size from each other, while achieving the following effects. Tape damage or tape breakage when the lids of the tape cassette are opened/closed can be prevented. The opening height of a rear lid when the lids are opened can be maintained constant, and at the same time, a gap is not produced between the lids when the lids are closed, thereby preventing an increase of drop-outs due to the invasion of dust or the like into the gap. Damage of a rear lid opener or the rear lid when the lids are opened/closed can be prevented. These effects are accomplished by providing the tape cassettes with rear lids each having a laterally extending protruding portion and a bottom end located below the protruding portion. The cassette loading apparatus has the rear lid opener positioned and configured to advantageously abut against the protruding portion of the rear lid in order to open the rear lid.Type: GrantFiled: November 14, 1994Date of Patent: April 1, 1997Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Akihiro Nishimura, Masahiro Yao
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Patent number: 5525649Abstract: Disclosed herein in are a magnetic paint composed of a kneaded composition comprising fine magnetic iron based alloy particles, acicular fine magnetic iron oxide particles or plate-like fine magnetic ferrite particles, a binder resin and an organic solvent, the solid content of the fine magnetic iron based alloy particles, the acicular fine magnetic iron oxide particles or plate-like fine magnetic ferrite particles and the binder resin in the kneaded composition being from 65 to 85% by weight, the binder resin being from 5 to 30% by weight based on the fine magnetic iron based alloy particles, the acicular fine magnetic iron oxide particles or plate-like fine magnetic ferrite particles, and a gloss at 45.degree. after dispersion for 6 hours being not less than 120% when formed into a coating film; and a method of preparing the same.Type: GrantFiled: May 17, 1995Date of Patent: June 11, 1996Assignee: Toda Kogyo Corp.Inventors: Akihiro Nishimura, Kazuyuki Hayashi, Keisuke Iwasaki, Yasuyuki Tanaka, Hiroko Itamochi
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Patent number: 5443679Abstract: A tab tape bonder including a bonding device which bonds semiconductor chips, etc. to a tab tape, a first roller driver which feeds the tab tape into the bonding device, a detector which detects holes or perforations formed in the tab tape fed by the first roller driver, and a controller which controls the feeding pitch of the tab tape by the first roller driver in accordance with the detection results obtained by the detector.Type: GrantFiled: August 2, 1993Date of Patent: August 22, 1995Assignee: Kabushiki Kaisha ShinkawaInventors: Akihiro Nishimura, Koji Sato
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Patent number: 5390057Abstract: A cassette loading apparatus of the present invention is capable of loading a plurality of tape cassettes different in size from each other, while achieving the following effects: A tape damage or a tape break when the lids of the tape cassette are opened/closed can be prevented; the opening height of a rear lid when the lids are opened can be maintained constant, and at the same time, a gap is not produced between the lids when the lids are closed, thereby preventing an increase of drop-outs due to the invasion of dust or the like into the gap; and damage of a rear lid opener or the rear lid when the lids are open/closed can be prevented.Type: GrantFiled: December 27, 1990Date of Patent: February 14, 1995Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Akihiro Nishimura, Masahiro Yao
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Patent number: 5268420Abstract: An aqueoous polyester comprising a polybasic acid component containing not less than 5 mol%, based on the total amount of the acid component, of phenylindanedicarboxylic acid. An easily bondable polyester film wherein a thin layer of the aqueous polyester is coated on at least one side of the polyester film.Type: GrantFiled: November 10, 1992Date of Patent: December 7, 1993Assignee: Teijin LimitedInventors: Akihiro Nishimura, Sadayoshi Miura, Tetsuo Ichihashi
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Patent number: 5259155Abstract: In a bonder tool cleaning mechanism in a bonding machine, a coarse grindstone, a finishing grindstone and a wire brush are provided on a cleaning section, and when a bonding tool is moved above the cleaning section and then moved down to come into contact with the grindstones and brush, the cleaning section oscillates horizontally so that grindstones and brush clean the bonding tool.Type: GrantFiled: May 7, 1992Date of Patent: November 9, 1993Assignee: Kabushiki Kaisha ShinkawaInventors: Hisao Ishida, Akihiro Nishimura, Koji Sato
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Patent number: 5240200Abstract: A set of tape cassettes of successively larger sizes, each cassette having a housing elongated in a longitudinal direction and having a front face with a tape accommodating opening symmetrical about a center line extending in a lateral direction transverse to the longitudinal direction and midway between side faces of the housing, the housing further having a bottom face with a plurality of cassette guide grooves therein parallel to each other and extending transversely of the housing and engagable with guide projections on a cassette holder for guiding the cassette into the cassette holder.Type: GrantFiled: March 29, 1991Date of Patent: August 31, 1993Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Akihiro Nishimura, Toru Ichimura, Shuji Uematsu, Yoshinori Shiomi, Kenji Iwano
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Patent number: 5223063Abstract: Method for bonding inner leads installed on a tab tape, which is fed in one direction in a bonding line, to electrodes of semiconductor elements via ultrasonic vibrations applied to a bonding tool mounted at one end of horn is performed in such a manner that the direction in which the ultrasonic vibrations are applied to the bonding tool is in the range of 30 to 60 degrees, preferably 45 degrees, with respect to the direction in which the tab tape is fed so that the bonding tool oscillates in such angles.Type: GrantFiled: June 17, 1992Date of Patent: June 29, 1993Assignee: Kabushiki Kaisha ShinkawaInventors: Nobuto Yamazaki, Akihiro Nishimura
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Patent number: 5181153Abstract: A tape cassette which includes a cassette shell housing in which reels wound with a magnetic tape are incorporated, a depressing member for depressing an upper surface of each reel, and a reel displacing amount reducing member having its one end engaged with the depressing member, and its other end, exposed on an upper surface of the cassette shell housing through a through-hole formed in the cassette shell housing. The amount of displacement of the reels is reduced by restricting displacement of the exposed portion of the reel displacing amount reducing member.Type: GrantFiled: February 21, 1991Date of Patent: January 19, 1993Assignee: Matsushita Electric Industrial Co., Ltd.Inventor: Akihiro Nishimura
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Patent number: 5061570Abstract: A magnetic recording medium comprising a substrate, and a magnetic recording layer composed of a coating composition containing a binder resin and magnetic particles, the binder resin being a polyester having an iminosulfonyl group, is disclosed. The magnetic recording medium has excellent magnetic characteristics.Type: GrantFiled: October 9, 1990Date of Patent: October 29, 1991Assignee: Toda Kogyo Corp.Inventors: Akihiro Nishimura, Kazuyuki Hayashi, Keisuke Iwasaki, Yasuyuki Tanaka, Hiroko Itamochi
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Patent number: 5058798Abstract: Method of forming bumps out of wire on the electrode of a semiconductor element is executed by setting a tip end underneath a vertically movable wedge, lowering the wedge to press the tip end of the wire against the semiconductor element, securely connecting the tip end to the electrode, and then pulling the wire away from the electrode to cut the wire, leaving the tip end on the electrode.Type: GrantFiled: April 16, 1990Date of Patent: October 22, 1991Assignee: Kabushiki Kaisha ShinkawaInventors: Nobuto Yamazaki, Akihiro Nishimura
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Patent number: 5056217Abstract: Method of manufacturing semiconductor elements equipped with leads which are connected to electrodes and formed of wires including the steps of positioning each semiconductor element on a bonding stage, feeding a tip end of the wire under a bonding tool so that the bonding tool presses the tip end against the electrode to bond it to the electrode, shifting the bonding tool to away from the tip end and pressing the wire against wire-cutting section of the bonding stage, and pulling the wire away from the bonding tool to cut the wire.Type: GrantFiled: April 16, 1990Date of Patent: October 15, 1991Assignee: Kabushiki Kaisha ShinkawaInventors: Nobuto Yamazaki, Akihiro Nishimura
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Patent number: 5040293Abstract: A bonding method for bonding inner leads on a film to electrodes of semiconductor elements is performed by the steps of: individually positioning the film and semiconductor elements at a predetermined bonding position; individually recognizing the positions of the inner leads and electrodes; selecting a combination of one inner lead and one electrode which are positionally shifted relative to each other; correcting relative position of the inner lead and electrode which are positionally shifted so that the inner lead and electrode are aligned; the inner lead and electrode are bonded; relative positions of remaining inner leads and elctrodes are aligned; and the inner leads and elctrodes are individually connected by bonding.Type: GrantFiled: May 14, 1990Date of Patent: August 20, 1991Assignee: Kabushiki Kaisha ShinkawaInventors: Nobuto Yamazaki, Akihiro Nishimura
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Patent number: D375305Type: GrantFiled: January 16, 1996Date of Patent: November 5, 1996Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Takashi Hiraoka, Kazuhiro Ueda, Sadayoshi Azuma, Akio Ohno, Hiroyuki Matsumoto, Kunihiko Kaneda, Akihiro Nishimura