Patents by Inventor Akihiro Tamba
Akihiro Tamba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7983044Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.Type: GrantFiled: January 8, 2010Date of Patent: July 19, 2011Assignee: Hitachi, Ltd.Inventors: Takayoshi Nakamura, Akihiro Tamba, Ryuichi Saito, Atsuo Nishihara
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Patent number: 7928587Abstract: A power semiconductor module having a surface of the power semiconductor chip and an external circuit pattern connected by an aluminum wire, and sealed with an epoxy resin, wherein wire diameter of the aluminum wire is 0.4±0.05 mm?, and coefficient of linear expansion of the epoxy resin in a rated temperature range of a module is from 15 to 20 ppm/K.Type: GrantFiled: April 18, 2008Date of Patent: April 19, 2011Assignee: Hitachi, Ltd.Inventors: Akihiro Tamba, Kazuhiro Suzuki, Koji Sasaki, Shinji Hiramitsu, Hirokazu Inoue
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Publication number: 20100139997Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.Type: ApplicationFiled: January 8, 2010Publication date: June 10, 2010Applicant: HITACHI, LTD.Inventors: Takayoshi NAKAMURA, Akihiro TAMBA, Ryuichi SAITO, Atsuo NISHIHARA
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Patent number: 7660122Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.Type: GrantFiled: June 20, 2007Date of Patent: February 9, 2010Assignee: Hitachi, Ltd.Inventors: Takayoshi Nakamura, Akihiro Tamba, Ryuichi Saito, Atsuo Nishihara
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Publication number: 20080258316Abstract: A power semiconductor module having a surface of the power semiconductor chip and an external circuit pattern connected by an aluminum wire, and sealed with an epoxy resin, wherein wire diameter of the aluminum wire is 0.4±0.05 mm?, and coefficient of linear expansion of the epoxy resin in a rated temperature range of a module is from 15 to 20 ppm/K.Type: ApplicationFiled: April 18, 2008Publication date: October 23, 2008Inventors: Akihiro Tamba, Kazuhiro Suzuki, Koji Sasaki, Shinji Hiramitsu, Hirokazu Inoue
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Publication number: 20070242435Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.Type: ApplicationFiled: June 20, 2007Publication date: October 18, 2007Applicant: HITACHI, LTD.Inventors: Takayoshi NAKAMURA, Akihiro TAMBA, Ryuichi SAITO, Atsuo NISHIHARA
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Patent number: 7252167Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.Type: GrantFiled: June 29, 2006Date of Patent: August 7, 2007Assignee: Hitachi, Ltd.Inventors: Takayoshi Nakamura, Akihiro Tamba, Ryuichi Saito, Atsuo Nishihara
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Publication number: 20060243504Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.Type: ApplicationFiled: June 29, 2006Publication date: November 2, 2006Applicant: HITACHI, LTD.Inventors: Takayoshi Nakamura, Akihiro Tamba, Ryuichi Saito, Atsuo Nishihara
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Patent number: 7090044Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.Type: GrantFiled: March 19, 2004Date of Patent: August 15, 2006Assignee: Hitachi, Ltd.Inventors: Takayoshi Nakamura, Akihiro Tamba, Ryuichi Saito, Atsuo Nishihara
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Patent number: 6978856Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.Type: GrantFiled: April 17, 2003Date of Patent: December 27, 2005Assignee: Hitachi, Ltd.Inventors: Takayoshi Nakamura, Akihiro Tamba, Ryuichi Saito, Atsuo Nishihara
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Publication number: 20040173392Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.Type: ApplicationFiled: March 19, 2004Publication date: September 9, 2004Applicant: Hitachi, Ltd.Inventors: Takayoshi Nakamura, Akihiro Tamba, Ryuichi Saito, Atsuo Nishihara
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Patent number: 6784538Abstract: The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said electric insulating material is a bismuth glass layer.Type: GrantFiled: July 30, 2002Date of Patent: August 31, 2004Assignee: Hitachi, Ltd.Inventors: Takayoshi Nakamura, Ryuichi Saito, Akihiro Tamba, Takashi Naitou, Hiroki Yamamoto, Takashi Namekawa
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Patent number: 6768193Abstract: The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said electric insulating material is a bismuth glass layer.Type: GrantFiled: March 18, 2002Date of Patent: July 27, 2004Assignee: Hitachi, Ltd.Inventors: Takayoshi Nakamura, Ryuichi Saito, Akihiro Tamba, Takashi Naitou, Hiroki Yamamoto, Takashi Namekawa
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Publication number: 20040020231Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.Type: ApplicationFiled: April 17, 2003Publication date: February 5, 2004Inventors: Takayoshi Nakamura, Akihiro Tamba, Ryuichi Saito, Atsuo Nishihara
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Patent number: 6661659Abstract: According to the invention, there is provided a water cooled inverter structure forming a plurality of shallow cavities and deep cavities in a housing, fixing a bottom surface of power semiconductor modules to shallow cavities to form a shallow water channel and directly cooling the power semiconductor modules using this shallow water channel. Since cooling water flows fast in the shallow water channel, it is possible to improve a cooling efficiency and also reduce pressure loss using a deep water channel with deep cavities. Furthermore, providing a plurality of cavities makes it possible to reduce a size of the power semiconductor modules and provide a plurality of power semiconductor modules, thus improving reliability. It is possible to place a control board below the water channel to thermally cut off the control board from the power semiconductor modules, which makes it possible to reduce temperature of a control circuit.Type: GrantFiled: March 19, 2002Date of Patent: December 9, 2003Assignee: Hitachi, Ltd.Inventors: Akihiro Tamba, Takayoshi Nakamura, Ryuichi Saito, Naohiro Momma
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Patent number: 6621701Abstract: According to the invention, there is provided a water cooled inverter structure forming a plurality of shallow cavities and deep cavities in a housing, fixing a bottom surface of power semiconductor modules to shallow cavities to form a shallow water channel and directly cooling the power semiconductor modules using this shallow water channel. Since cooling water flows fast in the shallow water channel, it is possible to improve a cooling efficiency and also reduce pressure loss using a deep water channel with deep cavities. Furthermore, providing a plurality of cavities makes it possible to reduce a size of the power semiconductor modules and provide a plurality of power semiconductor modules, thus improving reliability. It is possible to place a control board below the water channel to thermally cut off the control board from the power semiconductor modules, which makes it possible to reduce temperature of a control circuit.Type: GrantFiled: July 16, 2002Date of Patent: September 16, 2003Assignee: Hitachi, Ltd.Inventors: Akihiro Tamba, Takayoshi Nakamura, Ryuichi Saito, Naohiro Momma
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Patent number: 6594149Abstract: A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.Type: GrantFiled: March 19, 2002Date of Patent: July 15, 2003Assignee: Hitachi, Ltd.Inventors: Kazuji Yamada, Akihiro Tamba, Takayoshi Nakamura, Ryuichi Saito, Toshio Ogawa, Hisanori Okamura
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Patent number: 6588647Abstract: A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.Type: GrantFiled: August 27, 2002Date of Patent: July 8, 2003Assignee: Hitachi, Ltd.Inventors: Kazuji Yamada, Akihiro Tamba, Takayoshi Nakamura, Ryuichi Saito, Toshio Ogawa, Hisanori Okamura
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Publication number: 20030067749Abstract: According to the invention, there is provided a water cooled inverter structure forming a plurality of shallow cavities and deep cavities in a housing, fixing a bottom surface of power semiconductor modules to shallow cavities to form a shallow water channel and directly cooling the power semiconductor modules using this shallow water channel. Since cooling water flows fast in the shallow water channel, it is possible to improve a cooling efficiency and also reduce pressure loss using a deep water channel with deep cavities. Furthermore, providing a plurality of cavities makes it possible to reduce a size of the power semiconductor modules and provide a plurality of power semiconductor modules, thus improving reliability. It is possible to place a control board below the water channel to thermally cut off the control board from the power semiconductor modules, which makes it possible to reduce temperature of a control circuit.Type: ApplicationFiled: July 16, 2002Publication date: April 10, 2003Applicant: Hitachi, Ltd.Inventors: Akihiro Tamba, Takayoshi Nakamura, Ryuichi Saito, Naohiro Momma
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Publication number: 20030067748Abstract: According to the invention, there is provided a water cooled inverter structure forming a plurality of shallow cavities and deep cavities in a housing, fixing a bottom surface of power semiconductor modules to shallow cavities to form a shallow water channel and directly cooling the power semiconductor modules using this shallow water channel. Since cooling water flows fast in the shallow water channel, it is possible to improve a cooling efficiency and also reduce pressure loss using a deep water channel with deep cavities. Furthermore, providing a plurality of cavities makes it possible to reduce a size of the power semiconductor modules and provide a plurality of power semiconductor modules, thus improving reliability. It is possible to place a control board below the water channel to thermally cut off the control board from the power semiconductor modules, which makes it possible to reduce temperature of a control circuit.Type: ApplicationFiled: March 19, 2002Publication date: April 10, 2003Applicant: Hitachi Ltd.Inventors: Akihiro Tamba, Takayoshi Nakamura, Ryuichi Saito, Naohiro Momma