Patents by Inventor Akihisa Eimori

Akihisa Eimori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame semiconductor device
    Patent number: 8928136
    Abstract: A lead frame includes: a chip-mounting region provided on a front surface; a lead region including a plurality of concave and convex sections arranged in an in-plane direction of the chip-mounting region; and a terminal arranged in the concave section. A thickness of the lead region from the front surface is smaller than a thickness of the terminal from the front surface.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: January 6, 2015
    Assignee: Sony Corporation
    Inventors: Shinji Watanabe, Akihisa Eimori
  • LEAD FRAME SEMICONDUCTOR DEVICE
    Publication number: 20130105957
    Abstract: A lead frame includes: a chip-mounting region provided on a front surface; a lead region including a plurality of concave and convex sections arranged in an in-plane direction of the chip-mounting region; and a terminal arranged in the concave section. A thickness of the lead region from the front surface is smaller than a thickness of the terminal from the front surface.
    Type: Application
    Filed: October 24, 2012
    Publication date: May 2, 2013
    Applicant: Sony Corporation
    Inventors: Shinji Watanabe, Akihisa Eimori