Patents by Inventor Akihisa Miura

Akihisa Miura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970390
    Abstract: The present disclosure provides a method for producing a microchannel device, which can form a channel that has high hydrophobicity, high solvent resistance as well, and also resistance to heat and damage, on demand with high accuracy, and produces the microchannel device at a low cost, while having high productivity. The method for producing a microchannel device includes: forming a channel pattern from a hydrophobic resin on a porous substrate by an electrophotographic method; melting the channel pattern by heat to allow the channel pattern to permeate into the porous substrate, thereby forming a channel in the inside of the porous substrate.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: April 30, 2024
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takeshi Yamamoto, Jun Miura, Keiji Miyazaki, Hiroki Tanaka, Makoto Fukatsu, Akihisa Matsukawa, Takayuki Kanazawa, Keigo Mizusawa, Masanori Seki, Masanori Tanaka
  • Publication number: 20070012509
    Abstract: An object of the invention is to provide a damping material resin composition which is great in loss tangent, exhibits outstanding damping properties and enables a damping material to retain its own shape. The invention provides a damping material resin composition comprising 100 parts by weight of a thermoplastic resin having a chlorine content of 20 to 70 wt. % and a weight average molecular weight of at least 400,000, and 100 to 1000 parts by weight of a chlorinated paraffin having a chlorine content of 30 to 75 wt. % and 12 to 50 carbon atoms. (Preferably, the chlorinated paraffin contains 10 to 70 wt. % of a chlorinated paraffin having a chlorine content of at least 70 wt. %.
    Type: Application
    Filed: July 5, 2006
    Publication date: January 18, 2007
    Inventors: Masaki Shimada, Takeo Morikawa, Hiroyuki Abe, Akihisa Miura, Takashi Oguchi, Takeo Kuroda
  • Patent number: 7041377
    Abstract: The object of the invention is to provide sound insulating members exhibiting both high vibration damping performance and high sound insulation performance, a vibration damping material for affording such members and a resin composition for forming the vibration damping material. The invention provides a first resin composition for vibration damping materials which contains 100 parts by weight of a chlorine-containing thermoplastic resin, and 20 to 200 parts by weight of a chlorinated paraffin having 12 to 16 carbon atoms on average. The thermoplastic resin contains preferably 20 to 70 wt. %, more preferably 30 to 70 wt. %, of chlorine. The chlorinated paraffin is preferably 30 to 70 wt. %, more preferably 35 to 65 wt. %, in chlorination degree.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: May 9, 2006
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Akihisa Miura, Hiroyuki Abe, Katsuhiko Yamaji
  • Publication number: 20030109621
    Abstract: The object of the invention is to provide sound insulating members exhibiting both high vibration damping performance and high sound insulation performance, a vibration damping material for affording such members and a resin composition for forming the vibration damping material. The invention provides a first resin composition for vibration damping materials which contains 100 parts by weight of a chlorine-containing thermoplastic resin, and 20 to 200 parts by weight of a chlorinated paraffin having 12 to 16 carbon atoms on average. The thermoplastic resin contains preferably 20 to 70 wt. %, more preferably 30 to 70 wt. %, of chlorine. The chlorinated paraffin is preferably 30 to 70 wt. %, more preferably 35 to 65 wt. %, in chlorination degree.
    Type: Application
    Filed: October 9, 2002
    Publication date: June 12, 2003
    Inventors: Akihisa Miura, Hiroyuki Abe, Katsuhiko Yamaji