Patents by Inventor Akihisa Murata
Akihisa Murata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220063012Abstract: The present invention enables even a beginner to acquire the technique easily and perform suitable spot welding, and achieves improved workability, improved welding quality, improved productivity, and the like.Type: ApplicationFiled: December 23, 2019Publication date: March 3, 2022Applicant: MURATA WELDING LABORATORIES, INCORPORATEDInventors: Akihisa MURATA, Tadasuke MURATA, Manabu TANAKA
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Publication number: 20210179893Abstract: A pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer having an adhesive strength reducible by an adhesive strength-reducing action. For example, the pressure-sensitive adhesive layer is a thermally releasable pressure-sensitive adhesive layer (11), and the adhesive strength-reducing action is heating of the pressure-sensitive adhesive layer (11). This pressure-sensitive adhesive sheet for build stage use is suitable for allowing an object to be formed over a build stage of an additive manufacturing apparatus to be attached to the build stage during building up, and to be readily detached from the build stage after building up. An additive manufacturing apparatus can employ the pressure-sensitive adhesive sheet for build stage use and includes a build stage, and adhesive strength-reducing means for performing an adhesive strength-reducing action to a pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet for build stage use affixed to the stage.Type: ApplicationFiled: March 7, 2017Publication date: June 17, 2021Applicant: Nitto Denko CorporationInventors: Yoshiko OGINO, Yutaka TOSAKI, Michiro KAWANISHI, Kiichiro MATSUSHITA, Akiko NONAKA, Akihisa MURATA
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Publication number: 20200009789Abstract: Provided is a build mat to which a 3D print sticks well and from which the 3D print is easily separated. The build mat provided by this invention comprises a substrate and a surface layer provided to the first face of the substrate. The build mat has a peel strength of 1.5 N/18 mm or greater and 10 N/18 mm or less, determined by peeling the mat from polylactic acid (PLA) placed on the surface layer; and it is constituted so that the surface layer remains on the PLA in the peel strength measurement.Type: ApplicationFiled: February 27, 2018Publication date: January 9, 2020Applicant: NITTO DENKO CORPORATIONInventors: Yoshiko OGINO, Kiichiro MATSUSHITA, Akihisa MURATA, Tsunaki KITAHARA, Akiko NONAKA
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Patent number: 10219054Abstract: A protective member for an acoustic component includes a sound-transmissive sheet composed of an elastomer. The protective member for an acoustic component may further include an adhesive layer disposed on an edge region of the sound-transmissive sheet. The sound-transmissive sheet in the protective member may have waterproofness, and may be used with a waterproof case.Type: GrantFiled: May 24, 2013Date of Patent: February 26, 2019Assignee: NITTO DENKO CORPORATIONInventors: Yuichi Abe, Akihisa Murata
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Patent number: 9597745Abstract: The constricting nozzle of the present invention includes (i) a cylindrical nozzle body disposed around the forward end of the tungsten electrode rod concentrically with the tungsten electrode rod and defines an annular high-speed gas passage between the nozzle body and the outer peripheral surface of the forward end of the tungsten electrode rod, (ii) a plurality of positioning projections that are protrudently formed on the inner peripheral surface of the nozzle body with predetermined intervals in the circumferential direction and that are arranged along the longitudinal direction of the nozzle body to hold the tungsten electrode rod in the center position of the nozzle body, and (iii) a plurality of gas-flow regulating grooves formed between the positioning projections and that extend in parallel in the longitudinal direction of the nozzle body and regulate the shielding gas (G) flowing through the high-speed gas passage.Type: GrantFiled: December 31, 2012Date of Patent: March 21, 2017Assignee: Akihisa MurataInventor: Akihisa Murata
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Publication number: 20150146905Abstract: A protective member (1) of the present invention for an acoustic component includes a sound-transmissive sheet (11) composed of an elastomer. The protective member (1) for an acoustic component may further include an adhesive layer (12) disposed on an edge region of the sound-transmissive sheet (11).Type: ApplicationFiled: May 24, 2013Publication date: May 28, 2015Inventors: Yuichi Abe, Akihisa Murata
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Publication number: 20130330546Abstract: A heat-peelable adhesive sheet is provided which includes a thermally expansive pressure-sensitive adhesive layer that contains thermally expansive microspheres and the coloring agent and that is provided on one side or both sides of the substrate, or a thermally expansive pressure-sensitive adhesive layer that contains thermally expansive microspheres and is provided on one side or both sides of the substrate through a colored intermediate layer, and which has a total light transmittance of 50% or more.Type: ApplicationFiled: March 1, 2012Publication date: December 12, 2013Applicant: NITTO DENKO CORPORATIONInventors: Yoshihito Takami, Daisuke Shimokawa, Akihisa Murata
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Publication number: 20130277337Abstract: The constricting nozzle of the present invention includes (i) a cylindrical nozzle body disposed around the forward end of the tungsten electrode rod concentrically with the tungsten electrode rod and defines an annular high-speed gas passage between the nozzle body and the outer peripheral surface of the forward end of the tungsten electrode rod, (ii) a plurality of positioning projections that are protrudently formed on the inner peripheral surface of the nozzle body with predetermined intervals in the circumferential direction and that are arranged along the longitudinal direction of the nozzle body to hold the tungsten electrode rod in the center position of the nozzle body, and (iii) a plurality of gas-flow regulating grooves formed between the positioning projections and that extend in parallel in the longitudinal direction of the nozzle body and regulate the shielding gas (G) flowing through the high-speed gas passage.Type: ApplicationFiled: December 31, 2012Publication date: October 24, 2013Inventor: Akihisa Murata
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Publication number: 20130260120Abstract: There are provided a base material-less double-sided pressure-sensitive adhesive sheet without warping due to shrinkage of a base material after heat treatment, and having good peelability in heat peeling, and a method for manufacturing electronic parts or semiconductors by using the pressure-sensitive adhesive sheet. A heat-peelable pressure-sensitive adhesive sheet which is a base material-less double-sided pressure-sensitive adhesive sheet including a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres and a pressure-sensitive adhesive layer different from the heat-expandable pressure-sensitive adhesive layer and laminated thereon, wherein the pressure-sensitive adhesive layer has a higher elastic modulus than the heat-expandable pressure-sensitive adhesive layer.Type: ApplicationFiled: March 26, 2013Publication date: October 3, 2013Applicant: NITTO DENKO CORPORATIONInventors: Takamasa HIRAYAMA, Akihisa MURATA, Daisuke SHIMOKAWA
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Patent number: 8524007Abstract: A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 ?m or less and a maximum height Rz of 1.0 ?m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.Type: GrantFiled: December 23, 2010Date of Patent: September 3, 2013Assignee: Nitto Denko CorporationInventors: Daisuke Uenda, Yukio Arimitsu, Yoshio Terada, Yasuhiro Amano, Akihisa Murata
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Patent number: 8475600Abstract: A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 ?m or less and a maximum height Rz of 1.0 ?m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.Type: GrantFiled: October 12, 2006Date of Patent: July 2, 2013Assignee: Nitto Denko CorporationInventors: Daisuke Uenda, Yukio Arimitsu, Yoshio Terada, Yasuhiro Amano, Akihisa Murata
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Patent number: 8436481Abstract: The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step.Type: GrantFiled: December 21, 2010Date of Patent: May 7, 2013Assignee: Nitto Denko CorporationInventors: Shinji Hoshino, Yukio Arimitsu, Kazuyuki Kiuchi, Akihisa Murata
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Patent number: 8409884Abstract: The process for producing an organic EL panel according to the present invention is a process for producing an organic electroluminescent panel by forming an organic electroluminescent element on an ultrathin glass plate by vacuum deposition method, including forming electrodes on the ultrathin glass plate, by temporarily fixing the ultrathin glass plate to a supporting plate via a double-sided adhesive tape having a thermal release adhesive layer formed at least on one face of the base material layer, containing heat-expandable microspheres that start expansion and/or foaming at temperature higher than the vacuum deposition temperature.Type: GrantFiled: June 30, 2009Date of Patent: April 2, 2013Assignee: Nitto Denko CorporationInventors: Takamasa Hirayama, Akihisa Murata, Yukio Arimitsu, Takashi Yamaoka, Masaaki Sato
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Publication number: 20110151625Abstract: The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step.Type: ApplicationFiled: December 21, 2010Publication date: June 23, 2011Applicant: NITTO DENKO CORPORATIONInventors: Shinji HOSHINO, Yukio ARIMITSU, Kazuyuki KIUCHI, Akihisa MURATA
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Publication number: 20110124136Abstract: Provided is a process for producing an organic EL panel by using an ultrathin glass plate, in which the ultrathin glass plate is not “fractured” or “cut” in the production process, the organic EL element is formed reliably when formed by vacuum deposition, and recovered without damage after the production process, and there is no need for installing an additional step of cleaning the rear face of the ultrathin glass plate.Type: ApplicationFiled: June 30, 2009Publication date: May 26, 2011Applicant: NITTO DENKO CORPORATIONInventors: Takamasa Hirayama, Akihisa Murata, Yukio Arimitsu, Takashi Yamaoka, Masaaki Sato
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Publication number: 20110088721Abstract: A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 ?m or less and a maximum height Rz of 1.0 ?m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.Type: ApplicationFiled: December 23, 2010Publication date: April 21, 2011Applicant: NITTO DENKO CORPORATIONInventors: Daisuke Uenda, Yukio Arimitsu, Yoshio Terada, Yasuhiro Amano, Akihisa Murata
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Patent number: 7811647Abstract: Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer due to pressurization in a pressing process and can be easily peeled off from the processed article. The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate and containing a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a shear modulus (23° C.) in an unfoamed state of 7×106 Pa or more. The heat-expandable pressure-sensitive adhesive layer preferably has a shear modulus (95° C.) in an unfoamed state of less than 7×106 Pa. The foaming agent in the heat-expandable pressure-sensitive adhesive layer preferably has a foam initiating temperature higher than 80° C.Type: GrantFiled: February 18, 2005Date of Patent: October 12, 2010Assignee: Nitto Denko CorporationInventors: Yukio Arimitsu, Akihisa Murata, Tomoko Kishimoto
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Patent number: 7718257Abstract: A heat-peelable pressure-sensitive adhesive sheet comprises: a base material; and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres, the thermo-expandable pressure-sensitive adhesive layer having a surface to be adhered to an adherend, wherein the surface of the thermo-expandable pressure-sensitive adhesive layer before subjecting to heating has a centerline average roughness of greater than 0.4 ?m, and has a convex portion resulting from the thermo-expandable microspheres.Type: GrantFiled: November 7, 2001Date of Patent: May 18, 2010Assignee: Nitto Denko CorporationInventors: Akihisa Murata, Toshiyuki Oshima, Yukio Arimitsu, Kazuyuki Kiuchi
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Publication number: 20090263153Abstract: There are provided a transfer member provided with a cleaning function, which have excellent foreign matter removing performance and transfer performance, and which can remove foreign matters having a predetermined particle diameter with especially high efficiency. The transfer member provided with a cleaning function includes a transfer member and the cleaning layer provided on at least one surface of the transfer member. The cleaning layer has a microasperity shape having an arithmetic average roughness Ra of 0.05 ?m or less and a maximum height Rz of 1.0 ?m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2.Type: ApplicationFiled: October 12, 2006Publication date: October 22, 2009Applicant: NITTO DENKO CORPORATIONInventors: Daisuke Uenda, Yukio Arimitsu, Yoshio Terada, Yasuhiro Amano, Akihisa Murata
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Publication number: 20080019078Abstract: Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer due to pressurization in a pressing process and can be easily peeled off from the processed article. The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate and containing a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a shear modulus (23° C.) in an unfoamed state of 7×106 Pa or more. The heat-expandable pressure-sensitive adhesive layer preferably has a shear modulus (95° C.) in an unfoamed state of less than 7×106 Pa. The foaming agent in the heat-expandable pressure-sensitive adhesive layer preferably has a foam initiating temperature higher than 80° C.Type: ApplicationFiled: February 18, 2005Publication date: January 24, 2008Applicant: NITTO DENKO CORPORATIONInventors: Yukio Arimitsu, Akihisa Murata, Tomoko Kishimoto