Abstract: Experimental device machining is performed according to plan information including first type information indicating a first type condition of the experimental device machining and second type information indicating a second type condition of the experimental device machining. Third type information indicating a third type result and fourth type information indicating a fourth type result are acquired. Extended plan information is acquired in which a uniformity of extended second type information and extended third type information is equal to or greater than a threshold value. Extended third type information indicating a third type result and extended fourth type information indicating a fourth type result are acquired by performing the experimental device machining according to the extended plan information. An extended first relationship is derived that is a relationship between extended first type information, the extended second type information, and the extended third type information.

Abstract: An information processing method includes: creating a first table; calculating a first response surface using the first table in which an object variable is recorded, the object variable acquired when experimental conditions of a first control factor is fixed to a first level value; adding the experimental conditions of the first control factor in which the first level value is set to the first table when the first response surface does not include a target value related to the object variable; creating a second table by adding a plurality of combinations of the experimental conditions for each of the plurality of control factors in which a first plurality of level values are set and the first control factor in which a second plurality of level values are set to the first table; calculating a second response surface including the target value using the second table; and outputting the second response surface.

Abstract: An information processing method includes: creating a first table by an experimental design method, calculating a first response surface using the first table, setting a fourth level value for a first control factor when the first response surface does not include a target value related to an object variable for the first control factor, creating a second table by the experimental design method by deleting at least one combination of the experimental conditions which include one level value for the first control factor from the first table and adding at least one combination of the experimental conditions based on the plurality of level values including the fourth level value and without including the one level value for the first control factor, calculating a second response surface including the target value using the second table, and outputting the second response surface.

Abstract: An experiment of processing a device is performed to acquire type 1 information and type 2 information indicating processing conditions, and type 3 information and type 4 information indicating results of the processing, derive a first relation between the type 1 information, the type 2 information, and the type 3 information, and a second relation between the type 1 information, the type 2 information, and the type 4 information, and generate and output a model that estimates the type 4 information indicating a result of the processing by using the first relation and the second relation with the type 2 information and the type 3 information that are measured during the processing as inputs.

Abstract: A plurality of solar cells are arranged in a first direction and each provided with first and second electrodes on a one main surface side thereof. A wiring member includes a conductive layer and a resin sheet supporting the conductive layer, the conductive layer electrically connecting the first electrode of one of the solar cells adjacent to each other in the first direction to the second electrode of another one of the solar cells. An adhesive layer bonds the wiring member to each of the solar cells. The wiring member includes a first bonded portion bonded to the one solar cell via the adhesive layer, a second bonded portion bonded to the other solar cell via the adhesive layer, and a connection portion connecting the first bonded portion and the second bonded portion together, and an opening is provided in the conductive layer in the connection portion.

Abstract: A long-side frame piece has a cylindrical portion. The cylindrical portion is formed from one side end along the direction in which the long-side frame piece extends to the other side end. The cylindrical portion has threaded holes. The threaded holes are provided inside a through hole. Screws are inserted in the threaded holes. A short-side frame piece has a plate-shaped portion. The plate-shaped portion covers the end of the cylindrical portion in the direction in which the long-side frame piece extends Openings are formed in the plate-shaped portion, through which pass the screws inserted in the threaded holes. The plate-shaped portion has a cutout exposing a portion of the module body from a first surface toward a second surface, formed closer to a first direction side than the threaded holes of the through hole.

Abstract: A long-side frame piece has a cylindrical portion. The cylindrical portion is formed from one side end along the direction in which the long-side frame piece extends to the other side end. The cylindrical portion has threaded holes. The threaded holes are provided inside a through hole. Screws are inserted in the threaded holes. A short-side frame piece has a plate-shaped portion. The plate-shaped portion covers the end of the cylindrical portion in the direction in which the long-side frame piece extends. Openings are formed in the plate-shaped portion, through which pass the screws inserted in the threaded holes. The plate-shaped portion has a cutout exposing a portion of the module body from a first surface toward a second surface, formed closer to a first direction side than the threaded holes of the through hole.

Abstract: A long-side frame piece has a cylindrical portion. The cylindrical portion is formed from one side end along the direction in which the long-side frame piece extends to the other side end. The cylindrical portion has threaded holes. The threaded holes are provided inside a through hole. Screws are inserted in the threaded holes. A short-side frame piece has a plate-shaped portion. The plate-shaped portion covers the end of the cylindrical portion in the direction in which the long-side frame piece extends. Openings are formed in the plate-shaped portion, through which pass the screws inserted in the threaded holes. The plate-shaped portion has a cutout exposing a portion of the module body from a first surface toward a second surface, formed closer to a first direction side than the threaded holes of the through hole.

Abstract: A plurality of solar cells are arranged in a first direction and each provided with first and second electrodes on a one main surface side thereof. A wiring member includes a conductive layer and a resin sheet supporting the conductive layer, the conductive layer electrically connecting the first electrode of one of the solar cells adjacent to each other in the first direction to the second electrode of another one of the solar cells. An adhesive layer bonds the wiring member to each of the solar cells. The wiring member includes a first bonded portion bonded to the one solar cell via the adhesive layer, a second bonded portion bonded to the other solar cell via the adhesive layer, and a connection portion connecting the first bonded portion and the second bonded portion together, and an opening is provided in the conductive layer in the connection portion.

Abstract: Disclosed is a method for manufacturing an organic EL display, which comprises: a step of preparing an organic EL panel that comprises a substrate and organic EL elements arranged as a matrix on the substrate, wherein each organic EL element has a pixel electrode arranged on the substrate, an organic layer arranged on the pixel electrode, a transparent counter electrode arranged on the organic layer, a protective layer arranged on the transparent counter electrode, and a color filter arranged on the protective layer, and a defect portion present in the organic layer in each organic EL element is detected; a step of destroying a region of the transparent counter electrode positioned above the defect portion by irradiating the region with laser light through the color filter; and a step wherein a region of the color filter positioned above the defect portion is removed.

Abstract: There are provided an organic electro-luminescence device with filters and a method for repairing the same which are capable of reducing variations in conditions for leak-light transmission during leak-light detection and conditions for transmission of laser light used for repairing, depending on respective types of filters.

Abstract: Provided is an organic EL display manufacturing method which has: a step wherein an organic EL panel having a substrate and organic EL elements arranged in matrix on the substrate is prepared, and each organic EL element is permitted to have a pixel electrode disposed on the substrate, an organic layer disposed on the pixel electrode, a transparent counter electrode disposed on the organic layer, a sealing layer disposed on the transparent counter electrode, and a color filter disposed on the sealing layer; a step of detecting a defective portion on the organic layer in the organic EL element; and a step of breaking the transparent counter electrode in a region on the defective portion of the transparent counter electrode by irradiating the region on the defective portion with a laser beam. The laser beam is radiated by being tilted with respect to the normal line on the display surface of the organic EL panel.

Abstract: Provided is a layered electronic circuit device capable of realizing high-density/high-function mounting, easily inspecting and repairing the respective constituent elements, and improving the electronic connection characteristic. The layered electronic circuit device includes a first circuit substrate (101) and a second circuit substrate (102) which are arranged in parallel such that their substrate surfaces are opposed to each other. The peripheral portion of the first circuit substrate (101) and the peripheral portion of the second circuit substrate (102) are connected to each other by connection members (10a to 10d) having a wiring member (103) and a thermal hardening anisotropic conductive sheet (107), thereby performing electric connection.

Abstract: Disclosed is a method for manufacturing an organic EL display, which comprises: a step of preparing an organic EL panel that comprises a substrate and organic EL elements arranged as a matrix on the substrate, wherein each organic EL element has a pixel electrode arranged on the substrate, an organic layer arranged on the pixel electrode, a transparent counter electrode arranged on the organic layer, a protective layer arranged on the transparent counter electrode, and a color filter arranged on the protective layer, and a defect portion present in the organic layer in each organic EL element is detected; a step of destroying a region of the transparent counter electrode positioned above the defect portion by irradiating the region with laser light through the color filter; and a step wherein a region of the color filter positioned above the defect portion is removed.

Abstract: Provided is an organic EL display manufacturing method which has: a step wherein an organic EL panel having a substrate and organic EL elements arranged in matrix on the substrate is prepared, and each organic EL element is permitted to have a pixel electrode disposed on the substrate, an organic layer disposed on the pixel electrode, a transparent counter electrode disposed on the organic layer, a sealing layer disposed on the transparent counter electrode, and a color filter disposed on the sealing layer; a step of detecting a defective portion on the organic layer in the organic EL element; and a step of breaking the transparent counter electrode in a region on the defective portion of the transparent counter electrode by irradiating the region on the defective portion with a laser beam. The laser beam is radiated by being tilted with respect to the normal line on the display surface of the organic EL panel.

Abstract: There are provided an organic electro-luminescence device with filters and a method for repairing the same which are capable of reducing variations in conditions for leak-light transmission during leak-light detection and conditions for transmission of laser light used for repairing, depending on respective types of filters.

Abstract: To provide a stacked mounting structure in which the number of semiconductor chips that can be stacked is greater than conventionally, as well as a method for fabricating the same, each semiconductor chip has electrodes provided at least at one end in the stacked mounting structure, and a board holding the semiconductor chips at the one end is folded with at least two of the semiconductor chips being stacked so as to at least partially overlap with each other.

Abstract: A stacked structure of semiconductor chips includes plural stacked semiconductor chips and plural tabular holding members which hold the respective semiconductor chips.

Abstract: Provided is a layered electronic circuit device capable of realizing high-density/high-function mounting, easily inspecting and repairing the respective constituent elements, and improving the electronic connection characteristic. The layered electronic circuit device includes a first circuit substrate (101) and a second circuit substrate (102) which are arranged in parallel such that their substrate surfaces are opposed to each other. The peripheral portion of the first circuit substrate (101) and the peripheral portion of the second circuit substrate (102) are connected to each other by connection members (10a to 10d) having a wiring member (103) and a thermal hardening anisotropic conductive sheet (107), thereby performing electric connection.

Abstract: There is provided a semiconductor chip mounting substrate including a substrate on which a mounting region for mounting a semiconductor chip and a connection region for interlayer connection of the semiconductor chip are formed, and a plurality of alignment marks for alignment at the time of stacking which are provided around or in the connection region on the substrate, wherein a reinforcing member as a reinforcing region for reinforcing a portion between the plurality of alignment marks is provided on the substrate.