Abstract: Provided is a chemical-mechanical polishing composition comprising an abrasive, a basic component, at least one compound selected from the group consisting of a quaternary polyammonium salt, a quaternary ammonium salt having 6 or more carbon atoms, and an alkylated polymer having an amide structure, and an aqueous carrier; a rinse composition comprising the at least one compound and an aqueous carrier, as well as a method of chemically-mechanically polishing a substrate, and a method of rinsing a substrate, in which the respective compositions are used.

Abstract: Provided is a chemical-mechanical polishing composition including an abrasive, a basic component, a polyoxyalkylene alkyl ether represented by the formula (i) RO-(AO)n—H, wherein R is a linear or branched C1 to C15 alkyl group, A is an alkylene group selected from the group consisting of an ethylene group, a propylene group, and a combination thereof, and n represents average addition mol numbers of AO and is 2 to 30, and an aqueous carrier, a rinse composition including the polyoxyalkylene alkyl ether and an aqueous carrier, and a substrate chemical-mechanical polishing method and a rinsing method in which these are used.

Abstract: A chemical mechanical polishing composition for polishing a silicon wafer comprises, consists essentially of, or consists of a water based liquid carrier, colloidal silica particles dispersed in the liquid carrier, about 0.01 weight percent to about 2 weight percent of a dipolar aprotic solvent at point of use, and a pH in a range from about 8 to about 12. A method for polishing a silicon wafer may include contacting the wafer with the above described polishing composition, moving the polishing composition relative to the wafer, and abrading the wafer to remove silicon from the wafer and thereby polish the wafer.

Abstract: Provided is a chemical-mechanical polishing composition including an abrasive, a basic component, a polyoxyalkylene alkyl ether represented by the formula (i) RO-(AO)n—H, wherein R is a linear or branched C1 to C15 alkyl group, A is an alkylene group selected from the group consisting of an ethylene group, a propylene group, and a combination thereof, and n represents average addition mol numbers of AO and is 2 to 30, and an aqueous carrier, a rinse composition including the polyoxyalkylene alkyl ether and an aqueous carrier, and a substrate chemical-mechanical polishing method and a rinsing method in which these are used.