Abstract: A coating film forming apparatus includes a carry-in/out section in which a substrate is carried in and carried out; a periphery coating module configured to form a ring-shaped coating film by supplying a coating liquid along a periphery of the substrate based on a processing parameter for controlling a coating state by the coating film; an imaging module configured to image the substrate on which the ring-shaped coating film is formed; a transfer mechanism configured to transfer the substrate; and a controller configured to output a control signal to perform a process of forming the ring-shaped coating film on the substrate based on the processing parameter having different values and imaging the substrate by the imaging module, and configured to determine, based on an imaging result of the substrate, a value of the processing parameter for forming the ring-shaped coating film on the substrate in the periphery coating module.

Abstract: An apparatus includes: a coating module for applying a coating liquid to each wafer and discharging a removing liquid from a nozzle toward a beveled portion of the wafer under rotation; an imaging module; and a controller for controlling: the imaging module to image outer end and rear surfaces of the wafer; obtaining a height dimension of an outer edge of a coating film with respect to an inner edge of the beveled portion based on the imaging result; determining whether or not the obtained dimension is an allowable value; if the result is negative, resetting the number of revolutions of the wafer based on the obtained dimension and a first reference data; controlling the coating module to again perform the application and removal operations; performing the determination process; and if the result is positive, storing the reset number of revolutions in a storage part.

Abstract: A treatment solution supply apparatus that supplies a treatment solution from a treatment solution supply source via a treatment solution supply pipe to a supply nozzle, includes: electrodes that are provided at the treatment solution supply pipe and apply a DC voltage to the treatment solution in the treatment solution supply pipe; a power unit that applies the DC voltage to the electrodes while freely reversing a polarity of the DC voltage; a cleaning solution supply pipe connected to the treatment solution supply pipe and configured to supply a cleaning solution from a cleaning solution supply source to the treatment solution supply pipe; and a waste solution pipe that drains the cleaning solution passed through a position of the treatment solution supply pipe where the electrodes are provided.

Abstract: A treatment solution supply apparatus that supplies a treatment solution from a treatment solution supply source via a treatment solution supply pipe to a supply nozzle, includes: electrodes that are provided at the treatment solution supply pipe and apply a DC voltage to the treatment solution in the treatment solution supply pipe; a power unit that applies the DC voltage to the electrodes while freely reversing a polarity of the DC voltage; a cleaning solution supply pipe connected to the treatment solution supply pipe and configured to supply a cleaning solution from a cleaning solution supply source to the treatment solution supply pipe; and a waste solution pipe that drains the cleaning solution passed through a position of the treatment solution supply pipe where the electrodes are provided.