Patents by Inventor Akiko Seki
Akiko Seki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11869834Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.Type: GrantFiled: May 7, 2021Date of Patent: January 9, 2024Assignee: TDK CORPORATIONInventors: Takashi Daitoku, Susumu Taniguchi, Akiko Seki, Atsushi Sato, Yuhei Horikawa, Makoto Orikasa, Hisayuki Abe
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Publication number: 20240008183Abstract: A mounting board includes: an electronic component including at least a pair of first terminals; and a circuit board including at least a pair of second terminals. The first terminals and the second terminals are electrically joined by a joining material containing a metal element, the electronic component and the joining material are disposed within a wall made of an insulator, a lower surface of the electronic component is lower than an upper surface of the wall, and when long sides of a region surrounded by the wall have a dimension d1 and long sides of the electronic component have a dimension d2, a value of (dimension d1?dimension d2) is 10 ?m or less.Type: ApplicationFiled: November 15, 2021Publication date: January 4, 2024Applicant: TDK CORPORATIONInventors: Kiryu IKEBE, Tomohisa MITOSE, Akiko SEKI, Susumu TANIGUCHI, Hisayuki ABE
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Publication number: 20230395766Abstract: A mounting board includes an electronic component having at least a pair of first terminals, and a circuit board having at least a pair of second terminals. The first terminal and the second terminal are bonded to each other by a bonding material. The first terminal, the second terminal, and the bonding material are disposed inside a recessed portion formed in a resin layer such that the periphery thereof is surrounded by the resin layer. When a total thickness of the first terminal, the second terminal, and the bonding material is a dimension h1, the dimension h1 is 1 ?m to 20 ?m. When a width of the first terminal is a dimension d1 and a width of the recessed portion of the resin layer is a dimension d2, a value of (dimension d2—dimension d1) is 10 ?m or smaller.Type: ApplicationFiled: October 14, 2021Publication date: December 7, 2023Applicant: TDK CORPORATIONInventors: Tomohisa MITOSE, Kenichi KAWABATA, Susumu TANIGUCHI, Akiko SEKI
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Patent number: 11410855Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.Type: GrantFiled: August 19, 2020Date of Patent: August 9, 2022Assignee: TDK CORPORATIONInventors: Takashi Daitoku, Susumu Taniguchi, Akiko Seki, Atsushi Sato, Yuhei Horikawa, Makoto Orikasa, Hisayuki Abe
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Publication number: 20210265256Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.Type: ApplicationFiled: May 7, 2021Publication date: August 26, 2021Applicant: TDK CORPORATIONInventors: Takashi DAITOKU, Susumu TANIGUCHI, Akiko SEKI, Atsushi SATO, Yuhei HORIKAWA, Makoto ORIKASA, Hisayuki ABE
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Patent number: 11031330Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.Type: GrantFiled: March 6, 2020Date of Patent: June 8, 2021Assignee: TDK CORPORATIONInventors: Takashi Daitoku, Susumu Taniguchi, Akiko Seki, Atsushi Sato, Yuhei Horikawa, Makoto Orikasa, Hisayuki Abe
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Patent number: 10867898Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.Type: GrantFiled: July 18, 2018Date of Patent: December 15, 2020Assignee: TDK CORPORATIONInventors: Takashi Daitoku, Susumu Taniguchi, Akiko Seki, Atsushi Sato, Yuhei Horikawa, Makoto Orikasa, Hisayuki Abe
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Publication number: 20200381266Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.Type: ApplicationFiled: August 19, 2020Publication date: December 3, 2020Applicant: TDK CORPORATIONInventors: Takashi DAITOKU, Susumu TANIGUCHI, Akiko SEKI, Atsushi SATO, Yuhei HORIKAWA, Makoto ORIKASA, Hisayuki ABE
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Patent number: 10784122Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.Type: GrantFiled: July 18, 2018Date of Patent: September 22, 2020Assignee: TDK CORPORATIONInventors: Takashi Daitoku, Susumu Taniguchi, Akiko Seki, Atsushi Sato, Yuhei Horikawa, Makoto Orikasa, Hisayuki Abe
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Publication number: 20200211951Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.Type: ApplicationFiled: March 6, 2020Publication date: July 2, 2020Applicant: TDK CORPORATIONInventors: Takashi DAITOKU, Susumu TANIGUCHI, Akiko SEKI, Atsushi SATO, Yuhei HORIKAWA, Makoto ORIKASA, Hisayuki ABE
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Publication number: 20190043736Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.Type: ApplicationFiled: July 18, 2018Publication date: February 7, 2019Applicant: TDK CORPORATIONInventors: Takashi DAITOKU, Susumu TANIGUCHI, Akiko SEKI, Atsushi SATO, Yuhei HORIKAWA, Makoto ORIKASA, Hisayuki ABE
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Publication number: 20190035719Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.Type: ApplicationFiled: July 18, 2018Publication date: January 31, 2019Applicant: TDK CORPORATIONInventors: Takashi DAITOKU, Susumu TANIGUCHI, Akiko SEKI, Atsushi SATO, Yuhei HORIKAWA, Makoto ORIKASA, Hisayuki ABE
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Publication number: 20070250854Abstract: A view controller for controlling view is described on meta data and a view history (log) of a viewer recorded at the reception side is used to judge whether the condition of the view controller is satisfied. When the condition is satisfied, the view of the received content is permitted. Moreover, the view controller controls not only the view history (log) of the viewer stored before the content is received but also the view of another content during or after the content view. Thus, it is possible to perform view control to enforce the content right information and reflect the intention of the content creator.Type: ApplicationFiled: March 4, 2005Publication date: October 25, 2007Applicants: NIPPON TELEVISION NETWORK CORPORATION, WASEDA UNIVERSITYInventors: Satoshi Miyabayashi, Joji Urano, Kiyoyuki Doi, Tomonori Kato, Wataru Kameyama, Taihei Daikoku, Kazuki Hosono, Akiko Seki