Patents by Inventor AKIKO SOUMIYA

AKIKO SOUMIYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing composition, production method of the same, polishing method, and manufacturing method of semiconductor substrate
    Patent number: 11339312
    Abstract: The present invention provides means capable of improving an effect of inhibiting polishing of silicon nitride. The present invention relates to a polishing composition containing a cationically modified silica particles, a non-aromatic crosslinked cyclic compound having an organic acid group or a group of a salt thereof, and water.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: May 24, 2022
    Assignee: FUJIMI INCORPORATED
    Inventor: Akiko Soumiya
  • POLISHING COMPOSITION, PRODUCTION METHOD OF THE SAME, POLISHING METHOD AND A MANUFACTURING METHOD OF A SEMICONDUCTOR SUBSTRATE
    Publication number: 20210301174
    Abstract: The present invention is to provide means for polishing an object to be polished containing titanium nitride at a high polishing speed. The present invention relates to a polishing composition containing silica particles and a polishing accelerator, wherein the polishing accelerator is a compound having an aromatic heterocyclic ring and an OH group or a group of a salt thereof directly bonded to the aromatic heterocyclic ring, or a compound having an aromatic hydrocarbon ring, an OH group or a group of a salt thereof directly bonded to the aromatic hydrocarbon ring, and a COOH group or a group of a salt thereof directly bonded to the aromatic hydrocarbon ring, and the polishing composition is used for polishing an object to be polished containing titanium nitride.
    Type: Application
    Filed: March 10, 2021
    Publication date: September 30, 2021
    Inventor: Akiko SOUMIYA
  • POLISHING COMPOSITION, PRODUCTION METHOD OF THE SAME, POLISHING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE
    Publication number: 20210301176
    Abstract: The present invention provides means capable of improving an effect of inhibiting polishing of silicon nitride. The present invention relates to a polishing composition containing a cationically modified silica particles, a non-aromatic crosslinked cyclic compound having an organic acid group or a group of a salt thereof, and water.
    Type: Application
    Filed: March 22, 2021
    Publication date: September 30, 2021
    Applicant: FUJIMI INCORPORATED
    Inventor: Akiko SOUMIYA
  • POLISHING COMPOSITION AND POLISHING METHOD
    Publication number: 20200303198
    Abstract: A polishing composition according to the present invention contains: silica particles; a polishing speed adjusting agent for an object to be polished containing a silicon material having silicon-silicon bonding; and a biocide. The biocide includes a carbon atom, a hydrogen atom, and an oxygen atom.
    Type: Application
    Filed: March 9, 2020
    Publication date: September 24, 2020
    Applicant: FUJIMI INCORPORATED
    Inventors: YUSUKE KADOHASHI, YOSHIHIRO IZAWA, AKIKO SOUMIYA