Abstract: An adhesive layer is formed by cross-linking an adhesive composition containing: a polyester resin that is a copolymer of a polycarboxylic acid and a polyalcohol; a cross-linking agent; and at least one cross-linking catalyst selected from the group consisting of an organic zirconium compound, an organic iron compound, and an organic aluminum compound, the adhesive layer having a gel fraction of 40% or more after being retained at a temperature of 85° C. and a relative humidity of 85% for 300 hours, and having a 180° peel adhesive strength of 100 mN/20 mm or more with respect to a PMMA film.

Abstract: An optical stack includes: a first optical sheet having a first principal face with a concavo-convex structure and a second principal face at an opposite side from the first principal face; and an adhesive layer that is disposed on the first principal face of the first optical sheet. The concavo-convex structure includes a plurality of dents and flat portions between adjacent ones of the plurality of dents. A surface of the adhesive layer and the first principal face of the first optical sheet together define an internal space within each of the plurality of dents. Each of the plurality of dents satisfies 0.10?(C?A)/C 1.00 and 0.75?(C?A)/(C?B), where A is a maximum height value of the adhesive layer existing in that dent; B is a minimum height value of the adhesive layer existing in that dent; and C is a depth of that dent.

Abstract: A bonding method for providing an adhesive layer and a curing agent layer between a first adherend and a second adherend to bond the first adherend and the second adherend in which: the adhesive layer contains an epoxy resin as a main component and is cured by an effect of the curing agent layer; a curing agent contained in the curing agent layer is a polymerization catalyst type curing agent; and a thickness A (m) of the adhesive layer before curing and the application amount B (kg/m2) of the curing agent contained in the curing agent layer satisfy 5<B/A<900.

Abstract: A bonding sheet (X) of the present invention includes a matrix resin, a plurality of solder particles, and a plurality of flux particles, and has a sheet thickness T. In the bonding sheet (X), a particle size D50 of the solder particles is 12 ?m or less, a particle size D50 of the flux particles is 30 ?m or less, and a ratio of a particle size D90 of the solder particles and a particle size D90 of the flux particles to the sheet thickness T is 0.95 or less.

Abstract: An optical-fiber-embedding sheet which is a strip-shaped sheet material containing an optical fiber to be used as a sensor and is configured of a base material and an adhesive layer formed thereover which is to be bonded to a placement object where the optical fiber is to be placed, the optical fiber having been embedded in the adhesive layer. The optical fiber is placed by applying a primer, which is for curing the adhesive layer by a chemical reaction with the adhesive layer, to a placement object for the optical fiber and thereafter applying the optical-fiber-embedding sheet to the portion of the placement object to which the primer has been applied.

Abstract: An adhesive composition layer is made from an adhesive composition that includes: a polymer including a copolymer of at least one (meth)acrylate monomer and at least one copolymerizable functional group-containing monomer selected from the group consisting of hydroxyl group-containing copolymerizable monomers, carboxyl group-containing copolymerizable monomers, and nitrogen-containing vinyl monomers; and a curable resin. The adhesive composition layer has a 23° C. initial tensile modulus of elasticity of 0.35 MPa or more and yet 8.00 MPa or less before curing the curable resin in the adhesive composition, and a 23° C. initial tensile modulus of elasticity of 1.00 MPa or more after curing the curable resin in the adhesive composition.

Abstract: An adhesive layer (20a) has a creep deformation rate when a stress of 10000 Pa is applied at 50° C. for 1 second is 10% or less, and a creep deformation rate when a stress of 10000 Pa is applied at 50° C. for 30 minutes is 16% or less, in a creep test using a rotational rheometer, and has a 180° peel adhesive strength of 10 mN/20 mm or more with respect to a PMMA film.

Abstract: The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin portion.

Abstract: The invention relates to a curable adhesive sheet which has an adhesive layer formed from an adhesive composition containing an epoxy resin, a latent curing agent and a gelling agent and in which the latent curing agent has a reaction initiation temperature of 45° C. or higher and 120° C. or lower.

Abstract: The invention relates to a resin composition containing an epoxy resin and a latent curing agent in which the epoxy resin contains an aliphatic epoxy resin containing a hydroxyl group and having a water dissolution rate of 65% or more and in which the latent curing agent has a reaction initiation temperature of 45° C. or higher and 120° C. or lower.

Abstract: A stickable-curable adhesive sheet bonds a deformation/conversion device to an adherend. The stickable-curable adhesive sheet contains a stickable-curable adhesive component and a curing component curing the stickable-curable adhesive component. The stickable-curable adhesive component has pressure-sensitive adhesiveness before curing and the initial tensile elastic modulus at 25° C. of the stickable-curable adhesive sheet after curing is 5×108 Pa or more.

Abstract: The present invention relates to novel and excellent small-molecule-compounds that specifically antagonize BMP signal pathways, and these compounds can be used to modulate cell growth, differentiation, proliferation, and apoptosis, and thus can be used to treat diseases or pathological symptoms related to BMP signal pathway including inflammation, cardiovascular diseases, hematopoietic diseases, cancer, osteodystrophia, or the like, particularly, fibrodysplasia ossificans progressiva, and the present invention relates to provision of a pharmaceutical and pharmacological agent used for specifically antagonizing the BMP signal pathways and acting on the BMP signal pathways in the prevention and treatment or experimental application since the compounds can be beneficial for regulating cell differentiation and/or cell proliferation.

Abstract: An automatic analysis apparatus of an embodiment includes a holder, a first dispenser, a second dispenser, a detector, a memory, and processing circuitry. The holder movably holds a plurality of reaction vessels. The first dispenser dispenses an analyte into each of the reaction vessels. The second dispenser dispenses a reagent into the reaction vessel. The detector detects light transmitted through the reaction vessel. The memory stores a test order. The processing circuitry controls the holder, the first dispenser, and the second dispenser based on the test order. The processing circuitry determines one of the reaction vessels to be used for measuring the analyte based on the test order, and performs control to collect characteristic data from another of the reaction vessels not used for measuring the analyte while the analyte is measured.

Abstract: Provided are a polyester-based pressure-sensitive adhesive composition having high wetting ability and superior adherability and light peelability, and a pressure-sensitive adhesive sheet produced with such a pressure-sensitive adhesive composition. The polyester-based pressure-sensitive adhesive composition includes a polyester obtained by polycondensation of a difunctional or polyfunctional carboxylic acid and a diol; a fatty acid ester; and a crosslinking agent, wherein the polyester has a weight average molecular weight of 8,500 to 50,000, and the fatty acid ester has no additional functional group and has a molecular weight of 200 to 700. The polyester-based pressure-sensitive adhesive composition contains 10 to 150 parts by weight of the fatty acid ester based on 100 parts by weight of the polyester.

Abstract: An object of the present invention is to provide an electrically debondable composition for forming an electrically debondable adhesive layer suitable for suppressing corrosion of a metal adherend surface. The present invention further provides an adhesive sheet having the electrically debondable adhesive layer, and an adhered body including the adhesive sheet. An electrically debondable composition of the present invention includes a polymer, an ionic liquid, and at least one additive selected from the group consisting of a carbodiimide compound, an adsorptive inhibitor and a chelate-forming metal deactivator.

Abstract: The present invention relates to novel and excellent small-molecule-corn pounds that specifically antagonize BMP signal pathways, and these compounds can be used to modulate cell growth, differentiation, proliferation, and apoptosis, and thus can be used to treat diseases or pathological symptoms related to BMP signal pathway including inflammation, cardiovascular diseases, hematopoietic diseases, cancer, osteodystrophia, or the like, particularly, fibrodysplasia ossificans progressiva, and the present invention relates to provision of a pharmaceutical and pharmacological agent used for specifically antagonizing the BMP signal pathways and acting on the BMP signal pathways in the prevention and treatment or experimental application since the compounds can be beneficial for regulating cell differentiation and/or cell proliferation.

Abstract: A pressure-sensitive adhesive of the invention include a (meth)acryl-based polymer obtained by polymerization of a monomer component including 19 to 99.5% by weight of an alkyl (meth)acrylate having a branched alkyl group of 10 to 24 carbon atoms at an ester end. The pressure-sensitive adhesive has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant.

Abstract: The purpose of the present invention is to provide: a polyester-based pressure-sensitive adhesive layer, for which a pressure-sensitive adhesive composition (pressure-sensitive adhesive solution) without any acrylic pressure-sensitive adhesive or the like which needs a large amount of an organic solvent and is difficult to apply thickly; to provide a polyester-based pressure-sensitive adhesive layer that is friendly to the global environment, can be applied thickly, has a high level of cost effectiveness and workability, and also has a high level of adhesion, retention, and repulsion resistance; and to provide a pressure-sensitive adhesive tape or double-sided pressure-sensitive adhesive tape having such a pressure-sensitive adhesive layer.

Abstract: A surface-modified thermoplastic resin in which sufficient bonding strength is applied to a thermoplastic resin and a method thereof are provided. A bonded structure capable of exhibiting sufficient bonding strength and a method thereof are provided. A thermal transfer surface-modifying sheet that can be preferably used in the method for manufacturing a surface-modified thermoplastic resin is provided. A thermoplastic resin with a thermal transfer surface-modifying sheet including the thermal transfer surface-modifying sheet is provided. The method for manufacturing a surface-modified thermoplastic resin, in which an easy adherence layer is laminated on a thermoplastic resin having a melting point of T° C., the method includes: providing the easy adherence layer on at least a part of a surface of the thermoplastic resin; and performing heat welding at a temperature equal to or higher than (T?50)° C.