Patents by Inventor Akimasa Hori

Akimasa Hori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Disc wafer inspecting device and inspecting method
    Patent number: 8107064
    Abstract: An inspecting device and an inspecting method enabling better precision inspection for a processing region formed on a surface of a semiconductor wafer or other disc wafer are provided.
    Type: Grant
    Filed: August 9, 2007
    Date of Patent: January 31, 2012
    Assignee: Shibaura Mechatronics Corporation
    Inventors: Yoshinori Hayashi, Takeki Kogawa, Hideki Mori, Akimasa Hori
  • DISC WAFER INSPECTING DEVICE AND INSPECTING METHOD
    Publication number: 20100177953
    Abstract: [Problem] An inspecting device and an inspecting method enabling better precision inspection for a processing region formed on a surface of a semiconductor wafer or other disc wafer are provided.
    Type: Application
    Filed: August 9, 2007
    Publication date: July 15, 2010
    Applicant: Shibaura Mechatronics Corporation
    Inventors: Yoshinori Hayashi, Takeki Kogawa, Hideki Mori, Akimasa Hori