Patents by Inventor Akimasa Yajima

Akimasa Yajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8278249
    Abstract: Disclosed is a composition for forming a thick oxide superconductor film, the oxide being an RE-BA—Cu based oxide, wherein RE is at least one element selected from the group consisting of Y, Nd, Sm, Gd, Eu, Yb, Pr, and Ho. The composition contains an RE salt of a keto acid having 4 to 8 carbon atoms as an RE component, barium trifluoroacetate as a Ba component, at least one copper salt selected from the group consisting of a copper salt of a branched saturated aliphatic carboxylic acid having 6 to 16 carbon atoms and a copper salt of an alicyclic carboxylic acid having 6 to 16 carbon atoms as a Cu component, and an organic solvent dissolving these metal salt components. In the composition, the RE to Ba to Cu molar ratio is 1:1.3 to 2.2:2.4 to 3.6 and the content of the organic solvent is 25% to 80% by weight.
    Type: Grant
    Filed: January 6, 2010
    Date of Patent: October 2, 2012
    Assignee: Adeka Corporation
    Inventors: Tomotaka Goto, Atsuya Yoshinaka, Akimasa Yajima
  • Publication number: 20110237440
    Abstract: Disclosed is a composition for forming a thick oxide superconductor film, the oxide being an RE-BA-Cu based oxide, wherein RE is at least one element selected from the group consisting of Y, Nd, Sm, Gd, Eu, Yb, Pr, and Ho. The composition contains an RE salt of a keto acid having 4 to 8 carbon atoms as an RE component, barium trifluoroacetate as a Ba component, at least one copper salt selected from the group consisting of a copper salt of a branched saturated aliphatic carboxylic acid having 6 to 16 carbon atoms and a copper salt of an alicyclic carboxylic acid having 6 to 16 carbon atoms as a Cu component, and an organic solvent dissolving these metal salt components. In the composition, the RE to Ba to Cu molar ratio is 1:1.3 to 2.2:2.4 to 3.
    Type: Application
    Filed: January 6, 2010
    Publication date: September 29, 2011
    Applicant: ADEKA CORPORATION
    Inventors: Tomotaka Goto, Atsuya Yoshinaka, Akimasa Yajima
  • Patent number: 7237565
    Abstract: A fluid feeding apparatus capable of excluding the outer environmental influences in feeding a fluid susceptible to contamination, decomposition or denaturation on contact with the outer environment. The includes comprises at least one liquid source container, a cleaning and/or diluting liquid container, a waste liquid collection container, an inert gas feed pipe A, an inert gas feed pipe B, an evacuation pipe connecting to a vacuum source, and a fluid feed pipe for introducing the fluid to a process. The source container has two pipes. The first pipe has valves arranged therein at positions nearer to and farther from the source container, respectively. The second pipe has two valves arranged therein at positions nearer to and farther from the container, respectively. The path between the valves 1 and 4 and the path between the valves 2 and 5 are connected via a connecting pipe C having a valve 3.
    Type: Grant
    Filed: October 6, 2004
    Date of Patent: July 3, 2007
    Assignees: Adeka Engineering & Construction Co., Ltd, Asahi Denka Co., Ltd
    Inventors: Akira Hioki, Satoshi Nakagawa, Akimasa Yajima
  • Publication number: 20050087135
    Abstract: A fluid feeding apparatus capable of excluding the outer environmental influences in feeding a fluid susceptible to contamination, decomposition or denaturation on contact with the outer environment. The includes comprises at least one liquid source container, a cleaning and/or diluting liquid container, a waste liquid collection container, an inert gas feed pipe A, an inert gas feed pipe B, an evacuation pipe connecting to a vacuum source, and a fluid feed pipe for introducing the fluid to a process. The source container has two pipes. The first pipe has valves arranged therein at positions nearer to and farther from the source container, respectively. The second pipe has two valves arranged therein at positions nearer to and farther from the container, respectively. The path between the valves 1 and 4 and the path between the valves 2 and 5 are connected via a connecting pipe C having a valve 3.
    Type: Application
    Filed: October 6, 2004
    Publication date: April 28, 2005
    Applicants: ADEKA ENGINEERING & CONSTRUCTION CO., LTD., ASAHI DENKA CO., LTD.
    Inventors: Akira Hioki, Satoshi Nakagawa, Akimasa Yajima