Patents by Inventor Akinobu Makino

Akinobu Makino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7845721
    Abstract: A movable headrest provided on a seat back of a seat mounted in a vehicle and capable of changing a position from a normal position to an emergency position, the headrest including a headrest support supported by the seat back and having a guide section, a rotary support member pivotally supported by the headrest support and rotatable between a first position corresponding to the normal position and a second position corresponding to the emergency position, and a headrest body pivotally supported by the rotary support member and having a headrest body support which moves along the guide section, whereby as the rotary support member rotates relative to the headrest support, the position of the headrest body relative to the headrest support changes while the headrest body support moves along the guide section.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: December 7, 2010
    Assignee: Inoac Corporation
    Inventors: Kazuyasu Maeda, Akinobu Makino, Asato Matsuura, Ken Tatematsu
  • Patent number: 7495880
    Abstract: A circuit board includes: an input terminal for inputting a signal from an external circuit; a first land and a second land; and an electrostatic-charge absorbing conductor for absorbing an electrostatic charge. The first land is electrically connected to the input terminal. The second land is separated from the first land by a predetermined distance therebetween. A distance between the electrostatic-charge absorbing conductor and the first land is shorter than a distance between the first land and the second land. In the circuit board, the electrostatic charge is effectively absorbed into the electrostatic-charge absorbing conductor through the first land so that the electrostatic charge is prevented from negatively affecting on electric parts on the board.
    Type: Grant
    Filed: October 26, 2005
    Date of Patent: February 24, 2009
    Assignee: DENSO Corporation
    Inventors: Akinobu Makino, Tsuneo Watanabe
  • Publication number: 20080191522
    Abstract: A movable headrest provided on a seat back of a seat mounted in a vehicle and capable of changing a position from a normal position to an emergency position, the headrest including a headrest support supported by the seat back and having a guide section, a rotary support member pivotally supported by the headrest support and rotatable between a first position corresponding to the normal position and a second position corresponding to the emergency position, and a headrest body pivotally supported by the rotary support member and having a headrest body support which moves along the guide section, whereby as the rotary support member rotates relative to the headrest support, the position of the headrest body relative to the headrest support changes while the headrest body support moves along the guide section.
    Type: Application
    Filed: January 30, 2008
    Publication date: August 14, 2008
    Inventors: Kazuyasu Maeda, Akinobu Makino, Asato Matsuura, Ken Tatematsu
  • Publication number: 20060087821
    Abstract: A circuit board includes: an input terminal for inputting a signal from an external circuit; a first land and a second land; and an electrostatic-charge absorbing conductor for absorbing an electrostatic charge. The first land is electrically connected to the input terminal. The second land is separated from the first land by a predetermined distance therebetween. A distance between the electrostatic-charge absorbing conductor and the first land is shorter than a distance between the first land and the second land. In the circuit board, the electrostatic charge is effectively absorbed into the electrostatic-charge absorbing conductor through the first land so that the electrostatic charge is prevented from negatively affecting on electric parts on the board.
    Type: Application
    Filed: October 26, 2005
    Publication date: April 27, 2006
    Applicant: DENSO CORPORATION
    Inventors: Akinobu Makino, Tsuneo Watanabe
  • Patent number: 7031165
    Abstract: An electronic control device having a high heat dissipating ability includes a printed board secured to an enclosure and interposed between a case and a cover with screws passing through the printed board. Thermally conductive thin film layers made of copper foil are formed in parallel on a mount face and an opposite mount face of the printed board and inside the printed board so as to be thermally separated from each other. A protrusion is provided on the cover and protrudes beyond a bottom part of the cover toward the position where an electronic component is mounted. A flexible, semi-solid thermally conductive material is placed between an end face of the protrusion and the opposite mount face of the printed board corresponding to the position where the electronic component is mounted to be in contact with the end face and the opposite mount face.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: April 18, 2006
    Assignee: Denso Corporation
    Inventors: Toru Itabashi, Akinobu Makino
  • Publication number: 20040233640
    Abstract: An electronic control device having a high heat dissipating ability includes a printed board secured to an enclosure and interposed between a case and a cover with screws passing through the printed board. Thermally conductive thin film layers made of copper foil are formed in parallel on a mount face and an opposite mount face of the printed board and inside the printed board so as to be thermally separated from each other. A protrusion is provided on the cover and protrudes beyond a bottom part of the cover toward the position where an electronic component is mounted. A flexible, semi-solid thermally conductive material is placed between an end face of the protrusion and the opposite mount face of the printed board corresponding to the position where the electronic component is mounted to be in contact with the end face and the opposite mount face.
    Type: Application
    Filed: July 1, 2004
    Publication date: November 25, 2004
    Inventors: Toru Itabashi, Akinobu Makino
  • Patent number: 6816377
    Abstract: An electronic control device having a high heat dissipating ability includes a printed board secured to an enclosure and interposed between a case and a cover with screws passing through the printed board. Thermally conductive thin film layers made of copper foil are formed in parallel on a mount face and an opposite mount face of the printed board and inside the printed board so as to be thermally separated from each other. A protrusion is provided on the cover and protrudes beyond a bottom part of the cover toward the position where an electronic component is mounted. A flexible, semi-solid thermally conductive material is placed between an end face of the protrusion and the opposite mount face of the printed board corresponding to the position where the electronic component is mounted to be in contact with the end face and the opposite mount face.
    Type: Grant
    Filed: March 21, 2003
    Date of Patent: November 9, 2004
    Assignee: Denso Corporation
    Inventors: Toru Itabashi, Akinobu Makino
  • Publication number: 20030184969
    Abstract: An electronic control device having a high heat dissipating ability includes a printed board secured to an enclosure and interposed between a case and a cover with screws passing through the printed board. Thermally conductive thin film layers made of copper foil are formed in parallel on a mount face and an opposite mount face of the printed board and inside the printed board so as to be thermally separated from each other. A protrusion is provided on the cover and protrudes beyond a bottom part of the cover toward the position where an electronic component is mounted. A flexible, semi-solid thermally conductive material is placed between an end face of the protrusion and the opposite mount face of the printed board corresponding to the position where the electronic component is mounted to be in contact with the end face and the opposite mount face.
    Type: Application
    Filed: March 21, 2003
    Publication date: October 2, 2003
    Inventors: Toru Itabashi, Akinobu Makino
  • Patent number: 6628523
    Abstract: A casing for an electronic control unit is composed of an upper case having a bottom opening and a bottom plate closing the bottom opening. The upper case is so formed that plural upper cases are easily stacked up and picked up one by one by an automated vacuum sucker. The sidewalls of the upper case facing each other are slanted, and a fringe portion is formed at a bottom end of each slanted sidewall. A U-shaped portion or a protrusion is formed on the fringe portion to prevent the upper case from sticking to another upper case when plural upper cases are vertically stacked up.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: September 30, 2003
    Assignee: Denso Corporation
    Inventors: Toshiki Kobayashi, Hajime Katsuro, Mitsuo Takahashi, Toru Murowaki, Toshio Fujimura, Akinobu Makino
  • Publication number: 20020105787
    Abstract: A casing for an electronic control unit is composed of an upper case having a bottom opening and a bottom plate closing the bottom opening. The upper case is so formed that plural upper cases are easily stacked up and picked up one by one by an automated vacuum sucker. The sidewalls of the upper case facing each other are slanted, and a fringe portion is formed at a bottom end of each slanted sidewall. A U-shaped portion or a protrusion is formed on the fringe portion to prevent the upper case from sticking to another upper case when plural upper cases are vertically stacked up.
    Type: Application
    Filed: December 28, 2001
    Publication date: August 8, 2002
    Inventors: Toshiki Kobayashi, Hajime Katsuro, Mitsuo Takahashi, Toru Murowaki, Toshio Fujimura, Akinobu Makino