Patents by Inventor Akinobu Makino
Akinobu Makino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7845721Abstract: A movable headrest provided on a seat back of a seat mounted in a vehicle and capable of changing a position from a normal position to an emergency position, the headrest including a headrest support supported by the seat back and having a guide section, a rotary support member pivotally supported by the headrest support and rotatable between a first position corresponding to the normal position and a second position corresponding to the emergency position, and a headrest body pivotally supported by the rotary support member and having a headrest body support which moves along the guide section, whereby as the rotary support member rotates relative to the headrest support, the position of the headrest body relative to the headrest support changes while the headrest body support moves along the guide section.Type: GrantFiled: January 30, 2008Date of Patent: December 7, 2010Assignee: Inoac CorporationInventors: Kazuyasu Maeda, Akinobu Makino, Asato Matsuura, Ken Tatematsu
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Patent number: 7495880Abstract: A circuit board includes: an input terminal for inputting a signal from an external circuit; a first land and a second land; and an electrostatic-charge absorbing conductor for absorbing an electrostatic charge. The first land is electrically connected to the input terminal. The second land is separated from the first land by a predetermined distance therebetween. A distance between the electrostatic-charge absorbing conductor and the first land is shorter than a distance between the first land and the second land. In the circuit board, the electrostatic charge is effectively absorbed into the electrostatic-charge absorbing conductor through the first land so that the electrostatic charge is prevented from negatively affecting on electric parts on the board.Type: GrantFiled: October 26, 2005Date of Patent: February 24, 2009Assignee: DENSO CorporationInventors: Akinobu Makino, Tsuneo Watanabe
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Publication number: 20080191522Abstract: A movable headrest provided on a seat back of a seat mounted in a vehicle and capable of changing a position from a normal position to an emergency position, the headrest including a headrest support supported by the seat back and having a guide section, a rotary support member pivotally supported by the headrest support and rotatable between a first position corresponding to the normal position and a second position corresponding to the emergency position, and a headrest body pivotally supported by the rotary support member and having a headrest body support which moves along the guide section, whereby as the rotary support member rotates relative to the headrest support, the position of the headrest body relative to the headrest support changes while the headrest body support moves along the guide section.Type: ApplicationFiled: January 30, 2008Publication date: August 14, 2008Inventors: Kazuyasu Maeda, Akinobu Makino, Asato Matsuura, Ken Tatematsu
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Publication number: 20060087821Abstract: A circuit board includes: an input terminal for inputting a signal from an external circuit; a first land and a second land; and an electrostatic-charge absorbing conductor for absorbing an electrostatic charge. The first land is electrically connected to the input terminal. The second land is separated from the first land by a predetermined distance therebetween. A distance between the electrostatic-charge absorbing conductor and the first land is shorter than a distance between the first land and the second land. In the circuit board, the electrostatic charge is effectively absorbed into the electrostatic-charge absorbing conductor through the first land so that the electrostatic charge is prevented from negatively affecting on electric parts on the board.Type: ApplicationFiled: October 26, 2005Publication date: April 27, 2006Applicant: DENSO CORPORATIONInventors: Akinobu Makino, Tsuneo Watanabe
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Patent number: 7031165Abstract: An electronic control device having a high heat dissipating ability includes a printed board secured to an enclosure and interposed between a case and a cover with screws passing through the printed board. Thermally conductive thin film layers made of copper foil are formed in parallel on a mount face and an opposite mount face of the printed board and inside the printed board so as to be thermally separated from each other. A protrusion is provided on the cover and protrudes beyond a bottom part of the cover toward the position where an electronic component is mounted. A flexible, semi-solid thermally conductive material is placed between an end face of the protrusion and the opposite mount face of the printed board corresponding to the position where the electronic component is mounted to be in contact with the end face and the opposite mount face.Type: GrantFiled: July 1, 2004Date of Patent: April 18, 2006Assignee: Denso CorporationInventors: Toru Itabashi, Akinobu Makino
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Publication number: 20040233640Abstract: An electronic control device having a high heat dissipating ability includes a printed board secured to an enclosure and interposed between a case and a cover with screws passing through the printed board. Thermally conductive thin film layers made of copper foil are formed in parallel on a mount face and an opposite mount face of the printed board and inside the printed board so as to be thermally separated from each other. A protrusion is provided on the cover and protrudes beyond a bottom part of the cover toward the position where an electronic component is mounted. A flexible, semi-solid thermally conductive material is placed between an end face of the protrusion and the opposite mount face of the printed board corresponding to the position where the electronic component is mounted to be in contact with the end face and the opposite mount face.Type: ApplicationFiled: July 1, 2004Publication date: November 25, 2004Inventors: Toru Itabashi, Akinobu Makino
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Patent number: 6816377Abstract: An electronic control device having a high heat dissipating ability includes a printed board secured to an enclosure and interposed between a case and a cover with screws passing through the printed board. Thermally conductive thin film layers made of copper foil are formed in parallel on a mount face and an opposite mount face of the printed board and inside the printed board so as to be thermally separated from each other. A protrusion is provided on the cover and protrudes beyond a bottom part of the cover toward the position where an electronic component is mounted. A flexible, semi-solid thermally conductive material is placed between an end face of the protrusion and the opposite mount face of the printed board corresponding to the position where the electronic component is mounted to be in contact with the end face and the opposite mount face.Type: GrantFiled: March 21, 2003Date of Patent: November 9, 2004Assignee: Denso CorporationInventors: Toru Itabashi, Akinobu Makino
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Publication number: 20030184969Abstract: An electronic control device having a high heat dissipating ability includes a printed board secured to an enclosure and interposed between a case and a cover with screws passing through the printed board. Thermally conductive thin film layers made of copper foil are formed in parallel on a mount face and an opposite mount face of the printed board and inside the printed board so as to be thermally separated from each other. A protrusion is provided on the cover and protrudes beyond a bottom part of the cover toward the position where an electronic component is mounted. A flexible, semi-solid thermally conductive material is placed between an end face of the protrusion and the opposite mount face of the printed board corresponding to the position where the electronic component is mounted to be in contact with the end face and the opposite mount face.Type: ApplicationFiled: March 21, 2003Publication date: October 2, 2003Inventors: Toru Itabashi, Akinobu Makino
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Patent number: 6628523Abstract: A casing for an electronic control unit is composed of an upper case having a bottom opening and a bottom plate closing the bottom opening. The upper case is so formed that plural upper cases are easily stacked up and picked up one by one by an automated vacuum sucker. The sidewalls of the upper case facing each other are slanted, and a fringe portion is formed at a bottom end of each slanted sidewall. A U-shaped portion or a protrusion is formed on the fringe portion to prevent the upper case from sticking to another upper case when plural upper cases are vertically stacked up.Type: GrantFiled: December 28, 2001Date of Patent: September 30, 2003Assignee: Denso CorporationInventors: Toshiki Kobayashi, Hajime Katsuro, Mitsuo Takahashi, Toru Murowaki, Toshio Fujimura, Akinobu Makino
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Publication number: 20020105787Abstract: A casing for an electronic control unit is composed of an upper case having a bottom opening and a bottom plate closing the bottom opening. The upper case is so formed that plural upper cases are easily stacked up and picked up one by one by an automated vacuum sucker. The sidewalls of the upper case facing each other are slanted, and a fringe portion is formed at a bottom end of each slanted sidewall. A U-shaped portion or a protrusion is formed on the fringe portion to prevent the upper case from sticking to another upper case when plural upper cases are vertically stacked up.Type: ApplicationFiled: December 28, 2001Publication date: August 8, 2002Inventors: Toshiki Kobayashi, Hajime Katsuro, Mitsuo Takahashi, Toru Murowaki, Toshio Fujimura, Akinobu Makino