Patents by Inventor Akinori NII
Akinori NII has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240071908Abstract: A semiconductor device includes an interlayer insulating film, and a wiring of an uppermost layer arranged on the interlayer insulating film, wherein the wiring includes a seed layer arranged on the interlayer insulating film and a wiring body portion arranged on the seed layer, wherein a constituent material of the wiring body portion is copper or a copper alloy, and wherein a trench is formed in an upper surface of the interlayer insulating film along an outer edge of the interlayer insulating film in a plan view.Type: ApplicationFiled: August 23, 2023Publication date: February 29, 2024Applicant: ROHM CO., LTD.Inventors: Shoji TAKEI, Akinori NII
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Publication number: 20230238317Abstract: There is provided a semiconductor device including: a lead frame including a first opening portion; a resin filled in the first opening portion; and a semiconductor element electrically connected to the lead frame, wherein a side wall surface of the lead frame in the first opening portion has a larger average surface roughness than an upper surface of the lead frame.Type: ApplicationFiled: April 3, 2023Publication date: July 27, 2023Inventors: Bin ZHANG, Akinori NII, Taro NISHIOKA
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Patent number: 11652040Abstract: There is provided a semiconductor device including: a lead frame including a first opening portion; a resin filled in the first opening portion; and a semiconductor element electrically connected to the lead frame, wherein a side wall surface of the lead frame in the first opening portion has a larger average surface roughness than an upper surface of the lead frame.Type: GrantFiled: May 5, 2020Date of Patent: May 16, 2023Assignee: ROHM CO., LTD.Inventors: Bin Zhang, Akinori Nii, Taro Nishioka
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Publication number: 20230110154Abstract: A semiconductor device includes a semiconductor element, a conducting member, a conductive bonding material, a resin member and a first barrier layer. The semiconductor element includes an element first surface and an element second surface facing away from each other in a thickness direction, with the element first surface provided with an electrode. The conducting member includes an obverse surface facing the element first surface and a reverse surface facing away from the obverse surface. The conductive bonding material is disposed between the electrode and the obverse surface of the conducting member. The resin member covers at least a portion of the conducting member, the semiconductor element and the conductive bonding material. The first barrier layer is disposed between the electrode and the conductive bonding material to prevent a reaction between the electrode and the conductive bonding material.Type: ApplicationFiled: March 18, 2021Publication date: April 13, 2023Inventors: Bin ZHANG, Kenji FUJII, Akinori NII
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Publication number: 20230090494Abstract: A semiconductor device includes a conductor, a semiconductor element, and a bonding layer. The conductor has obverse surfaces and reverse surfaces facing away from each other in a thickness direction. The semiconductor element has a body layer and electrodes projecting toward the obverse surfaces from a side of the body layer that opposes the obverse surfaces in the thickness direction. The bonding layer bonds the obverse surfaces and the electrodes. Each electrode has a base portion in contact with the body layer and a columnar portion projecting from the base portion and in contact with the bonding layer. The electrodes include a first electrode and a second electrode located closer to the periphery of the body layer than is the first electrode as viewed in the thickness direction. The second electrode is larger in area of the columnar portion than the first electrode, as viewed in the thickness direction.Type: ApplicationFiled: February 17, 2021Publication date: March 23, 2023Inventors: Kenji FUJII, Akinori NII
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Publication number: 20230080548Abstract: Provided is an electronic apparatus including an electronic part, a resin member that covers the electronic part, and a plurality of leads each electrically connected to the electronic part, the resin member including a first resin side surface facing one side in a first direction orthogonal to a thickness direction of the resin member, the plurality of leads including a plurality of first side exposed portions arranged along the first resin side surface, each of the plurality of first side exposed portions being exposed from the first resin side surface, each of the plurality of first side exposed portions including a first tapered portion becoming narrower toward the first resin side surface as viewed in the thickness direction, the first tapered portion including a first front surface that faces the same direction as the first resin side surface in the first direction and is flush with the first resin side surface.Type: ApplicationFiled: September 12, 2022Publication date: March 16, 2023Inventors: Shinya Hikita, Kenji Fujii, Akinori Nii, Bin Zhang, Hiroaki Aoyama
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Publication number: 20220157758Abstract: Provided is a semiconductor device including a conductive member including a main surface facing one side in a thickness direction; a semiconductor element including a plurality of pads facing the main surface of the conductive member; and a plurality of electrodes protruding from the plurality of pads toward the other side in the thickness direction. The conductive member includes a plurality of recessed portions recessed from the main surface toward the other side in the thickness direction. The semiconductor device further includes a bonding layer that is conductive and that is arranged in each of the plurality of recessed portions. The plurality of electrodes are separately inserted into the plurality of recessed portions. The conductive member and the plurality of electrodes are bonded through the bonding layers.Type: ApplicationFiled: November 10, 2021Publication date: May 19, 2022Inventors: Yosui Futamura, Akinori Nii
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Patent number: 10903129Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.Type: GrantFiled: May 23, 2019Date of Patent: January 26, 2021Assignee: ROHM CO., LTDInventors: Motoharu Haga, Kaoru Yasuda, Akinori Nii, Yuto Nishiyama
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Publication number: 20200365505Abstract: There is provided a semiconductor device including: a lead frame including a first opening portion; a resin filled in the first opening portion; and a semiconductor element electrically connected to the lead frame, wherein a side wall surface of the lead frame in the first opening portion has a larger average surface roughness than an upper surface of the lead frame.Type: ApplicationFiled: May 5, 2020Publication date: November 19, 2020Inventors: Bin ZHANG, Akinori NII, Taro NISHIOKA
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Publication number: 20190279915Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.Type: ApplicationFiled: May 23, 2019Publication date: September 12, 2019Inventors: Motoharu HAGA, Kaoru YASUDA, Akinori NII, Yuto NISHIYAMA
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Patent number: 10332815Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.Type: GrantFiled: June 1, 2017Date of Patent: June 25, 2019Assignee: ROHM CO., LTD.Inventors: Motoharu Haga, Kaoru Yasuda, Akinori Nii, Yuto Nishiyama
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Publication number: 20170271225Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.Type: ApplicationFiled: June 1, 2017Publication date: September 21, 2017Inventors: Motoharu HAGA, Kaoru YASUDA, Akinori NII, Yuto NISHIYAMA
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Patent number: 9698068Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.Type: GrantFiled: July 8, 2015Date of Patent: July 4, 2017Assignee: ROHM CO., LTD.Inventors: Motoharu Haga, Kaoru Yasuda, Akinori Nii, Yuto Nishiyama
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Publication number: 20160013149Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.Type: ApplicationFiled: July 8, 2015Publication date: January 14, 2016Inventors: Motoharu HAGA, Kaoru YASUDA, Akinori NII, Yuto NISHIYAMA
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Patent number: D852765Type: GrantFiled: April 17, 2018Date of Patent: July 2, 2019Assignee: ROHM CO., LTD.Inventor: Akinori Nii
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Patent number: D853343Type: GrantFiled: April 17, 2018Date of Patent: July 9, 2019Assignee: ROHM CO., LTD.Inventor: Akinori Nii
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Patent number: D856947Type: GrantFiled: April 17, 2018Date of Patent: August 20, 2019Assignee: ROHM CO., LTD.Inventor: Akinori Nii