Abstract: An electronic apparatus includes a first chassis in which a motherboard mounted with a processing device is mounted, a second chassis provided adjacent to the first chassis, a hinge device that relatively rotatably connects the first chassis to the second chassis, an electrical component that is provided in the first chassis and generates heat, a plate-shaped thermal module that is provided in the first chassis and is thermally connected to the electrical component to radiate heat, and a graphite sheet provided to extend from the first chassis to the second chassis. A connection edge portion of the first chassis is made of a heat conductive material, the thermal module is provided with a heat pipe along the connection edge portion, and the graphite sheet is thermally connected to the heat pipe and the connection edge portion by being laminated and interposed therebetween.

Abstract: An electronic apparatus includes a CPU provided in a first chassis and generating heat, a plate-shaped vapor chamber provided in the first chassis and thermally connected to the CPU to radiate heat, and two heat pipes protruding and extending from the vapor chamber at positions separated from each other. A graphite sheet that is thinner than the vapor chamber is thermally connected to the two heat pipes. A battery device having three cells is provided in the first chassis, and the heat pipe extends into a groove portion formed between the cells.

Abstract: An electronic apparatus includes: a chassis; first and second heating elements in the chassis; and a cooling module absorbing the heat. The cooling module includes: a first vapor chamber connected to the first heating element; and a second vapor chamber connected to the second heating element. The first and second vapor chambers are placed adjacent to each other with a step therebetween. The first vapor chamber has a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward the second vapor chamber to be connected to a surface of the second vapor chamber. The bridge is not provided with the closed space.

Abstract: An electronic apparatus includes: a chassis; a heat generating element provided in the chassis; and a cooling device that has a cooling fin, a heat pipe connecting the cooling fin and the heat generating element, and a pressing assembly pressing the heat pipe against the heat generating element, and is provided in the chassis. The heat pipe has: a heat absorbing section that absorbs heat generated by the heat generating element; and a thin plate section having a thickness which is smaller than that of the heat absorbing section. The pressing assembly has: a base assembly relatively fixed to the chassis; and a bridge section that is provided integrally with the base assembly and placed on a surface of the thin plate section in such a manner as to extend over the heat pipe in a width direction.

Abstract: A method of operating a fan of a computing system includes: measuring a temperature of a subcomponent of the computing system; and comparing the temperature to a temperature threshold. When the temperature is greater or equal to than the temperature threshold, the fan is controlled based on a predetermined table of fan level settings. When the temperature less than the temperature threshold, a fan speed of the fan is measured. When the fan speed is not equal to zero, the method returns to the measurement of the temperature. When the fan speed is equal to zero, the fan is controlled based on a first power determination. The first power determination includes: measuring a system power level; and comparing the system power level to a trigger threshold. When the system power level is greater than the trigger threshold, the fan is activated to a predetermined setting.

Abstract: An electronic apparatus includes a first chassis which loads a processing device, a second chassis which is coupled with the first chassis to be rotatably movable relative to each other and a vapor chamber which has a first flexile resin sheet, a second flexible resin sheet and a closed space which is formed between the first resin sheet and the second resin sheet and in which a working fluid is encapsulated, extends from the inside of the first chassis to the inside of the second chassis and transports heat that the processing device generates to the second chassis side.

Abstract: An electronic apparatus includes a first chassis having a heat generating element, a second chassis, a hinge device that connects the first chassis and the second chassis such that the first chassis and the second chassis can be rotated relative to each other between a 0-degree attitude and a 180-degree attitude, and a display provided across the first chassis and the second chassis. The hinge device has a metal hinge main body, a metal first support plate provided to be relatively movable with respect to the inner surface of the first chassis, and a metal second support plate provided to be relatively movable with respect to the inner surface of the second chassis. The electronic apparatus further includes a flexible heat conductive member in the first chassis. The heat conductive member thermally connects a heat receiving member that receives heat from a heat generating element, and the first support plate.

Abstract: A cooling module includes: a fan having a fan housing with an intake port and an exhaust port; a fin that faces the exhaust port of the fan; a heat pipe connected to a surface of the fin; and a plate-shaped vapor chamber having a first surface and a second surface, the heat pipe being connected to the first surface while straddling one edge of the vapor chamber, the second surface at the one edge being connected to the surface of the fin to be parallel with the heat pipe, so that the one edge is disposed between the heat pipe and the fin.

Abstract: A heat dissipation structure, for a semiconductor chip in which a die is provided on a surface of a substrate and an electric element is provided around the die, includes: a heat transfer plate thermally connected to a surface of the die; a liquid metal provided between the surface of the die and the heat transfer plate; and an insulating material covering the electric element. The heat transfer plate has a recessed portion in a location facing the electric element.

Abstract: An electronic apparatus includes: a heating element; and a plurality of heat pipes that is thermally connected to the heating element. Each of the heat pipes has a cross section having a rectangular shape, a heat receiving surface thermally connected to the heating element, and a side surface orthogonal to the heat receiving surface. The side surfaces of the heat pipes, which are adjacent to each other, are in surface contact with each other.

Abstract: An information processing apparatus and an information processing method capable of fulfilling an image processing function expected in a selected power control mode are provided. The information processing apparatus includes a first processor, a second processor, and a power control unit that determines one power control mode from among a plurality of stages of power control modes different in rated power, and controls power consumption of the first processor and the second processor in the determined power control mode, wherein the power control unit stops an operation of the second processor in response to the determined power control mode being a low power control mode which is a power control mode with the rated power lower than predetermined rated power.

Abstract: An electronic apparatus includes: a chassis; first and second heating elements in the chassis; and a cooling module absorbing the heat. The cooling module includes: a first vapor chamber connected to the first heating element; and a second vapor chamber connected to the second heating element. The first and second vapor chambers are placed adjacent to each other with a step therebetween. The first vapor chamber has a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward the second vapor chamber to be connected to a surface of the second vapor chamber. The bridge is not provided with the closed space.

Abstract: An information processing apparatus includes a processor that can take plural power control modes different in rated power from one another, a fan that rotates to dissipate heat generated by the processor, and a power control unit that controls the power consumption of the processor. The plural power control modes include two or more stages of dynamic control modes different in rated power from one another and a unified communication mode. The power control unit selects any one of the dynamic control modes based on an event in which a power consumption state of the processor continues for a predetermined duration or more, and when the unified communication works, the power control unit preferentially selects the unified communication mode.

Abstract: An information processing apparatus that detects processing to be executed by a processor includes: a display that displays a status of the processing to be executed by the processor; and a switching controller that switches between a first adjustment mode and a second adjustment mode in association with predetermined processing to be executed without displaying the execution status on the display. The first adjustment mode sets, as a target for selection, a first selection range including a plurality of processing power classes classified according to the magnitude of the processing power. The second adjustment mode sets, as a target for selection, a second selection range in which a first processing power class related to relatively high processing power is excluded from among the first processing power class, a second processing power class, and a third processing power class of the first selection range.

Abstract: A heat sink faces an exhaust port of a blower fan in use, and includes: a first plate-shaped portion; a second plate-shaped portion disposed in parallel with the first plate-shaped portion having a gap therebetween; a plurality of fins that stand up between the first plate-shaped portion and the second plate-shaped portion and are disposed side by side with a gap therebetween to define an air flow path between the fins, through which air flows from the exhaust port; and a protrusion that is disposed at a part of each fin including a center of the upright height, and protrudes into the air flow path.

Abstract: A cooling module reduces the number of parts and achieves weight reduction. An electronic apparatus includes: the cooling module; a chassis; first and second heating elements provided inside the chassis; and a cooling module configured to absorb heat generated by the first and second heating elements. The cooling module includes: a vapor chamber in which a sealed space is formed in a portion sandwiched between first and second metal plates and working fluid is sealed in the sealed space, the second metal plate having an outer shape larger than that of the first metal plate; a metal frame formed in a portion of the second metal plate, the portion of the second metal plate protruding from the outer shape of the first metal plate; and a heat conduction plate supported by the metal frame, the heat conduction plate containing graphene.

Abstract: An electronic apparatus includes: a chassis; a heat generating element provided in the chassis; and a cooling device that has a cooling fin, a heat pipe connecting the cooling fin and the heat generating element, and a pressing assembly pressing the heat pipe against the heat generating element, and is provided in the chassis. The heat pipe has: a heat absorbing section that absorbs heat generated by the heat generating element; and a thin plate section having a thickness which is smaller than that of the heat absorbing section. The pressing assembly has: a base assembly relatively fixed to the chassis; and a bridge section that is provided integrally with the base assembly and placed on a surface of the thin plate section in such a manner as to extend over the heat pipe in a width direction.

Abstract: An information processing apparatus includes a processor that can take plural power control modes different in rated power from one another, a fan that rotates to dissipate heat generated by the processor, and a power control unit that controls the power consumption of the processor. The plural power control modes include two or more stages of dynamic control modes different in rated power from one another and a unified communication mode. The power control unit selects any one of the dynamic control modes based on an event in which a power consumption state of the processor continues for a predetermined duration or more, and when the unified communication works, the power control unit preferentially selects the unified communication mode.

Abstract: An electronic apparatus includes a first chassis having a heat generating element, a second chassis, a hinge device that connects the first chassis and the second chassis such that the first chassis and the second chassis can be rotated relative to each other between a 0-degree attitude and a 180-degree attitude, and a display provided across the first chassis and the second chassis. The hinge device has a metal hinge main body, a metal first support plate provided to be relatively movable with respect to the inner surface of the first chassis, and a metal second support plate provided to be relatively movable with respect to the inner surface of the second chassis. The electronic apparatus further includes a flexible heat conductive member in the first chassis. The heat conductive member thermally connects a heat receiving member that receives heat from a heat generating element, and the first support plate.

Abstract: An apparatus for controlling power efficiency of an information processing device is disclosed. The apparatus includes a voltage converter that converts an input voltage into a predetermined output voltage, an information processing device that consumes power supplied by the voltage converter, a battery pack that is charged using power supplied at a predetermined charging voltage by the voltage converter, and a controller that determines the input voltage where the power supplied by the voltage converter exceeds power consumed by the information processing device and a difference between the input voltage and the predetermined charging voltage is minimized. A method and a system also perform various functions of the apparatus.