Abstract: The present invention provides a novel linker compound which minimizes any nonspecific hydrophobic interactions and is capable of easily adjusting the length to a disulfide group subjected to metal bond to thereby enable effective formation of a metal-sulfur bond; novel ligand conjugate and ligand carrier, and a process for producing them. The linker compound is of a structure represented by the following general formula (1) where a, b, d, e are independently an integer of 0 to 6. X has a structure serving as a multi-branched structure moiety including three or more hydrocarbon derivative chains, wherein the hydrocarbon derivative chains each include an aromatic amino group at an end thereof, and may or may not include a carbon-nitrogen bond in a main chain thereof. The ligand conjugate includes the linker compound having a sugar molecule introduced therein.

Abstract: The objective of the present invention is to provide a polycarbosilane having excellent solubility in common organic solvents and a method for production thereof. The polycarbosilane of the present invention is a polymer which is represented by the following general formula (1) and has an oxetanyl group in a side chain. R1 is an alkyl group having no oxetanyl groups, aryl group having no oxetanyl groups, or an organic group having an oxetanyl group, R2 is an organic group having an oxetanyl group, R3 is an alkylene group, an arylene group, or an aralkylene group, and n is an integer of 5 to 200.

Abstract: The objective of the present invention is to provide a polycarbosilane having excellent solubility in common organic solvents and a method for production thereof. The polycarbosilane of the present invention is a polymer which is represented by the following general formula (1) and has an oxetanyl group in a side chain. R1 is an alkyl group having no oxetanyl groups, aryl group having no oxetanyl groups, or an organic group having an oxetanyl group, R2 is an organic group having an oxetanyl group, R3 is an alkylene group, an arylene group, or an aralkylene group, and n is an integer of 5 to 200.

Abstract: A linker compound has a structure represented by general formula (1) below, where n is an integer of 1 to 6, and X has a structure serving as a multi-branched structure moiety including three or four hydrocarbon derivative chains each having an aromatic amino group at an end and a carbon-nitrogen bond in a backbone.

Abstract: The present invention provides a novel linker compound which minimizes any nonspecific hydrophobic interactions and is capable of easily adjusting the length to a disulfide group subjected to metal bond to thereby enable effective formation of a metal-sulfur bond; novel ligand conjugate and ligand carrier, and a process for producing them. The linker compound is of a structure represented by the following general formula (1) where a, b, d, e are independently an integer of 0 to 6. X has a structure serving as a multi-branched structure moiety including three or more hydrocarbon derivative chains, wherein the hydrocarbon derivative chains each include an aromatic amino group at an end thereof, and may or may not include a carbon-nitrogen bond in a main chain thereof. The ligand conjugate includes the linker compound having a sugar molecule introduced therein.

Abstract: A versatile linker compound has a structure represented by following general formula (1), wherein Y has a structure represented by O or NH, and X has a structure serving as a multi-branched moiety including four hydrocarbon derivative chains each of which has an aromatic amino group at an end thereof, and may or may not have a carbon-nitrogen bond in a backbone thereof. With the versatile linker compound, sugar molecules can be two-dimensionally arranged on a surface of a protein-analyzing supporter with high reproducibility. Also, a ligand includes the versatile linker compound and a sugar molecule introduced thereinto.

Abstract: A linker compound has a structure represented by general formula (1) below, where n is an integer of 1 to 6, and X has a structure serving as a multi-branched structure moiety including three or four hydrocarbon derivative chains each having an aromatic amino group at an end and a carbon-nitrogen bond in a backbone. A ligand includes the linker compound and a sugar introduced into the linker compound.

Abstract: A versatile linker compound has a structure represented by following general formula (1), wherein Y has a structure represented by O or NH, and X has a structure serving as a multi-branched moiety including four hydrocarbon derivative chains each of which has an aromatic amino group at an end thereof, and may or may not have a carbon-nitrogen bond in a backbone thereof. With the versatile linker compound, sugar molecules can be two-dimensionally arranged on a surface of a protein-analyzing supporter with high reproducibility. Also, a ligand includes the versatile linker compound and a sugar molecule introduced thereinto.

Abstract: A positive-working radiation-sensitive resin composition showing a good throughput upon production of semiconductors or the like and less process dependence of dimensional accuracy as well as having high sensitivity and high resolution, and being able to form a pattern with good shape and a high aspect ratio.

Abstract: The positive-working radiation sensitive resin composition which has high sensitivity, high resolution and no residues in development and ability to form a pattern having a good profile. The positive-working radiation sensitive resin composition contains a mixed radiation sensitive novolak resin comprising the mixture of 1,2-naphthoquinonediazide-4-sulfonic acid ester of an alkali soluble novolak resin and 1,2-naphthoquinonediazide-5-sulfonic acid ester of an alkali soluble novolak resin, wherein the ratio by weight of the 1,2-naphthoquinonediazide-4-sulfonyl group and 1,2-naphthoquinonediazide-5-sulfonyl group ranges from 5:95 to 20:80.

Abstract: Radiation-sensitive resin composition having excellent and well-balanced various properties required for photoresist, such as sensitivity, pattern profile and heat resistance. The radiation-sensitive resin composition comprises an alkali-soluble resin and a photosensitizer having a quinonediazide group. The alkali-soluble resin is a phenol novolak resin which is treated by a thin film distillation method to selectively remove monomer and dimer. The novolak resin treated by thin film distillation method preferably shows the following ratio in area in its profile in gel permeation chromatography with a detector at 280 nm: B2/B1≧0.95; C2/(A2+B2+C2)≦0.060 wherein A1 is a high-molecular region, B1 is a middle-molecular region, and C1 is a monomer/dimer region before the treatment of the starting novolak resin, and A2, B2 and C2 are the corresponding counterparts after the treatment of the novolak resin.