Abstract: A method for forming a bump on, for instance, an electrode of a semiconductor device out of a wire comprising the steps of forming a ball at the end of the bonding wire, pressing the ball against the electrode, and separating the ball from the wire by cutting the wire by a pair of cutters that advance toward each other along the diameter of the wire. The cut surface of the ball or the bump can be flattened by the cutters that presses the cut surface.

Abstract: A bonding apparatus for semiconductor devices, etc., including a bonding stage which places chips, etc. thereon, a bonding tool which press-bonds leads to the chips, etc., and a wire brush which is next to the bonding stage so as to clean the bonding tool. The wire brush is attached to the upper surface of a brush-rotating plate which is rotatable about its axis, and the brush-rotating plate is rotary-driven by a motor. A complete cleaning of all the side surfaces as well as the undersurface of the bonding tool is accomplished by bringing the bonding tool into contact with portions of the wire brush which are off the center of the rotating wire brush.

Abstract: In a method for bonding inner leads arranged along a square opening of a tab tape to a semiconductor device, the inner leads of a pair of inner lead rows that face each other are bonded first to the semiconductor device and then a bonding tool is rotated 90 degrees so that inner leads of another pair of inner lead rows are bonded. An ultrasonic bonding apparatus that uses such a method includes a rotary shaft that has the bonding tool at the bottom and is rotated 90 degrees (or any desired angle) via rollers that are mounted eccentrically on the rotary shaft. When the rollers are moved back and forth via a cylinder assembly, the rotary shaft that is eccentric with the rollers is rotated and rotated back 90 degrees, thus making it possible to perform the bonding of inner leads arranged along the square opening of a tab tape by restraining the horn only twice.

Abstract: An apparatus for connecting or bonding leads of solid-state devices to lead frames, etc. in which a solid-state device punched out of a film carrier by a punch is first picked up and held by a suction-adhesion head. A raising and lowering arm is then driven longitudinally and laterally so that the suction-adhesion head with the solid-state device thereon is moved to a position over a first bonding station. Then, the raising and lowering arm is lowered via a vertical driving mechanism, and the solid-state device held by the suction-adhesion head is pressed against a specified lead frame. A first bonding tool is lowered and simultaneously bonds the leads on two opposite sides of the solid-state device to the lead frame. Then, the first bonding tool is raised, and the suction-adhesion head is raised and moves back to a position over the punch.