Abstract: This invention relates to a testing method for a head IC which makes it possible to simplify checking of the head. The head IC is installed on a head suspension, and probes are placed on terminals of the head suspension to check electric characteristics of the head IC. With this invention, contact of the probes for checking the head IC when the head IC has been installed, but before installing the head, becomes easier.

Abstract: In the present invention, an intermediate member having a hardness different than that of a pivot is provided. According to this structure, the pivot is in contact with the intermediate member, and rubs the intermediate member to control the sliding of the pivot. Since the intermediate member has a different hardness than the pivot, these elements can better bear the acceleration of a head suspension in high speed operation. Moreover, generation of dust can be controlled and reliability can also be improved.

Abstract: This invention relates to a head suspension with a head IC and makes it possible to simplify checking of the head IC and reduce the cost of the head suspension. A first connection terminal 21 that electrically connects to the head 4; a second connection terminal 22 that connects to external circuits; third and fourth connection terminals 23, 24 that electrically connect to the head IC 20, which processes the electrical signal from the head; a first conductive path 28 that connects the first connection terminal 21 with the third connection terminal 23; a second conductive path 26 that connects the second connection terminal 22 with the fourth connection terminal 24; and a measurement terminal 25 that is located between the second connection terminal 22 and fourth connection terminal 24 are formed on the head suspension 9. With this invention, contact of the probes for checking the head IC when the head IC has been installed before installing the head becomes easier.

Abstract: This invention relates to a head suspension with a head IC and makes it possible to simplify checking of the head IC and reduce the cost of the head suspension. A first connection terminal 21 that electrically connects to the head 4; a second connection terminal 22 that connects to external circuits; third and fourth connection terminals 23, 24 that electrically connect to the head IC 20, which processes the electrical signal from the head; a first conductive path 28 that connects the first connection terminal 21 with the third connection terminal 23; a second conductive path 26 that connects the second connection terminal 22 with the fourth connection terminal 24; and a measurement terminal 25 that is located between the second connection terminal 22 and fourth connection terminal 24 are formed on the head suspension 9. With this invention, contact of the probes for checking the head IC when the head IC has been installed before installing the head becomes easier.

Abstract: In the present invention, an intermediate member having a hardness different than that of a pivot is provided. According to this structure, the pivot is in contact with the intermediate member, and rubs the intermediate member to control the sliding of the pivot. Since the intermediate member has a different hardness than the pivot, these elements can better bear the acceleration of a head suspension in high speed operation. Moreover, generation of dust can be controlled and reliability can also be improved.

Abstract: In the present invention, an intermediate member having a hardness different than that of a pivot is provided. According to this structure, the pivot is in contact with the intermediate member, and rubs the intermediate member to control the sliding of the pivot. Since the intermediate member has a different hardness than the pivot, these elements can better bear the acceleration of a head suspension in high speed operation. Moreover, generation of dust can be controlled and reliability can also be improved.

Abstract: A head slider and head IC are mounted on a head suspension, the head IC being mounted on a head IC mounting surface. One or more through holes are provided on the head IC mounting surface of the head suspension and the head IC is mounted by injecting a bonding agent between the mounting surface and the head IC through the through holes. The bonding agent is evenly distributed beneath the head IC, so that the head suspension is well balanced.

Abstract: This invention relates to a head suspension with a head IC and makes it possible to simplify checking of the head IC and reduce the cost of the head suspension. A first connection terminal 21 that electrically connects to the head 4; a second connection terminal 22 that connects to external circuits; third and fourth connection terminals 23, 24 that electrically connect to the head IC 20, which processes the electrical signal from the head; a first conductive path 28 that connects the first connection terminal 21 with the third connection terminal 23; a second conductive path 26 that connects the second connection terminal 22 with the fourth connection terminal 24; and a measurement terminal 25 that is located between the second connection terminal 22 and fourth connection terminal 24 are formed on the head suspension 9. With this invention, contact of the probes for checking the head IC when the head IC has been installed before installing the head becomes easier.