Patents by Inventor Akio IKEYA

Akio IKEYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11126176
    Abstract: A vehicle control apparatus can continue a control function against abnormality in operation of an arithmetic processor and in the power supply voltage, and capable of improving reliability. Where there is no abnormality, the autonomous travel control unit and an auxiliary control unit calculate control instruction values for automatic driving control, and validate a CAN communication circuit of autonomous travel control units while invalidating a CAN communication circuit of the auxiliary control unit. Where an abnormality occurs in the autonomous travel control unit and not the auxiliary control unit, the CAN communication circuit of the autonomous travel control unit is invalidated and the CAN communication circuit of the auxiliary control unit is validated. Where the auxiliary control unit has no abnormality when the autonomous travel control unit has an abnormality during automatic driving control thereof, seamless automatic driving control with substantially no time lag continues.
    Type: Grant
    Filed: July 4, 2017
    Date of Patent: September 21, 2021
    Assignee: HITACHI AUTOMOTTVE SYSTEMS, LTD.
    Inventors: Hideyuki Sakamoto, Akio Ikeya, Masayuki Kawabata, Hirotaka Amo
  • Publication number: 20190179310
    Abstract: Provided is a vehicle control apparatus capable of continuing a control function against abnormality in operation of an arithmetic processor and abnormality in the power supply voltage and capable of improving reliability. In a case where there is no abnormality in a main CPU 11b and a main CPU 12b of an autonomous travel control unit 11 and an auxiliary control unit 12, the autonomous travel control unit 11 and the auxiliary control unit 12 calculate control instruction values for automatic driving control, validate a CAN communication circuit 11c of the autonomous travel control units 11 while invalidating a CAN communication circuit 12c of the auxiliary control unit 12. In a case where abnormality occurs in the autonomous travel control unit 11 and there is no abnormality in the auxiliary control unit 12, the CAN communication circuit 11c of the autonomous travel control unit 11 is invalidated and the CAN communication circuit 12c of the auxiliary control unit 12 is validated.
    Type: Application
    Filed: July 4, 2017
    Publication date: June 13, 2019
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Hideyuki SAKAMOTO, Akio IKEYA, Masayuki KAWABATA, Hirotaka AMO
  • Patent number: 9836429
    Abstract: The present invention aims to improve the signal transmission characteristics by shortening the length of the detour path of the return current. The present invention comprises a return current transmission path relative to a signal transmission path for transmitting signals. The signal transmission path includes a signal pad formed on a circuit board surface layer, and signal through-holes formed on the circuit board surface layer and a circuit board inner layer and connected to the signal pad. The return current transmission path includes a ground pad formed on the circuit board surface layer, and a plurality of ground through-holes formed on the circuit board surface layer and the circuit board inner layer and connected to the ground pad and a ground layer of the circuit board inner layer. Each of the ground through-holes is arranged by being separated on either side of the ground pad.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: December 5, 2017
    Assignee: HITACHI, LTD.
    Inventors: Nobuhiko Wakayama, Akio Ikeya
  • Publication number: 20150370748
    Abstract: The present invention aims to improve the signal transmission characteristics by shortening the length of the detour path of the return current. The present invention comprises a return current transmission path relative to a signal transmission path for transmitting signals. The signal transmission path includes a signal pad formed on a circuit board surface layer, and signal through-holes formed on the circuit board surface layer and a circuit board inner layer and connected to the signal pad. The return current transmission path includes a ground pad formed on the circuit board surface layer, and a plurality of ground through-holes formed on the circuit board surface layer and the circuit board inner layer and connected to the ground pad and a ground layer of the circuit board inner layer. Each of the ground through-holes is arranged by being separated on either side of the ground pad.
    Type: Application
    Filed: November 6, 2013
    Publication date: December 24, 2015
    Applicant: Hitachi, Ltd.
    Inventors: Nobuhiko WAKAYAMA, Akio IKEYA
  • Patent number: 9024196
    Abstract: There is provided a printed circuit board having a differential signal transmission line composed of non-skew-adjusting portions and skew-adjusting portions. The non-skew-adjusting portion consists of parallel conductive traces spaced apart by a spacing. The skew-adjusting portion consists of a pair of meander traces for the skew adjustment. The skew-adjusting portion include convex transmission line segments and concave transmission line segments. The convex transmission line segment has parallel traces having a differential trace pair spacing greater than the differential trace pair spacing in the non-skew-adjusting portion. The concave transmission line segment has parallel traces having a differential trace pair spacing smaller than the differential trace pair spacing in the non-skew-adjusting portion.
    Type: Grant
    Filed: January 6, 2011
    Date of Patent: May 5, 2015
    Assignee: Hitachi, Ltd.
    Inventors: Masanao Yoneya, Kazunori Nakajima, Naohiro Sezaki, Kenji Kashiwagi, Akio Ikeya
  • Patent number: 8745275
    Abstract: A blade server apparatus including a plurality of server modules, a backplane for mounting the plurality of server modules thereon, and an SMP coupling device having wiring lines to SMP couple the plurality of server modules. Each of the server modules has one or more processors controlled by firmware and a module manager for managing its own server module, the module manager has an ID determiner for informing each processor of a processor ID, each processor has a processing unit and an SMP virtual connecting unit for instructing ones of wiring lines of the SMP coupling device through which a packet received from the processing unit is to be transmitted, and an ID converter for converting the processor ID and informing it to the SMP virtual connecting unit is provided within the firmware.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: June 3, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Akio Ikeya, Takashi Aoyagi, Kenji Kashiwagi, Naohiro Sezaki, Kazunori Nakajima
  • Publication number: 20120054469
    Abstract: A blade server apparatus including a plurality of server modules, a backplane for mounting the plurality of server modules thereon, and an SMP coupling device having wiring lines to SMP couple the plurality of server modules. Each of the server modules has one or more processors controlled by firmware and a module manager for managing its own server module, the module manager has an ID determiner for informing each processor of a processor ID, each processor has a processing unit and an SMP virtual connecting unit for instructing ones of wiring lines of the SMP coupling device through which a packet received from the processing unit is to be transmitted, and an ID converter for converting the processor ID and informing it to the virtual connecting unit is provided within the firmware.
    Type: Application
    Filed: August 15, 2011
    Publication date: March 1, 2012
    Inventors: AKIO IKEYA, Takashi Aoyagi, Kenji Kashiwagi, Naohiro Sezaki, Kazunori Nakajima
  • Publication number: 20110203834
    Abstract: There is provided a printed circuit board having a differential signal transmission line composed of non-skew-adjusting portions and skew-adjusting portions. The non-skew-adjusting portion consists of parallel conductive traces spaced apart by a spacing. The skew-adjusting portion consists of a pair of meander traces for the skew adjustment. The skew-adjusting portion include convex transmission line segments and concave transmission line segments. The convex transmission line segment has parallel traces having a differential trace pair spacing greater than the differential trace pair spacing in the non-skew-adjusting portion. The concave transmission line segment has parallel traces having a differential trace pair spacing smaller than the differential trace pair spacing in the non-skew-adjusting portion.
    Type: Application
    Filed: January 6, 2011
    Publication date: August 25, 2011
    Applicant: HITACHI, LTD.
    Inventors: Masanao YONEYA, Kazunori NAKAJIMA, Naohiro SEZAKI, Kenji KASHIWAGI, Akio IKEYA