Patents by Inventor Akio IKEYA
Akio IKEYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11126176Abstract: A vehicle control apparatus can continue a control function against abnormality in operation of an arithmetic processor and in the power supply voltage, and capable of improving reliability. Where there is no abnormality, the autonomous travel control unit and an auxiliary control unit calculate control instruction values for automatic driving control, and validate a CAN communication circuit of autonomous travel control units while invalidating a CAN communication circuit of the auxiliary control unit. Where an abnormality occurs in the autonomous travel control unit and not the auxiliary control unit, the CAN communication circuit of the autonomous travel control unit is invalidated and the CAN communication circuit of the auxiliary control unit is validated. Where the auxiliary control unit has no abnormality when the autonomous travel control unit has an abnormality during automatic driving control thereof, seamless automatic driving control with substantially no time lag continues.Type: GrantFiled: July 4, 2017Date of Patent: September 21, 2021Assignee: HITACHI AUTOMOTTVE SYSTEMS, LTD.Inventors: Hideyuki Sakamoto, Akio Ikeya, Masayuki Kawabata, Hirotaka Amo
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Publication number: 20190179310Abstract: Provided is a vehicle control apparatus capable of continuing a control function against abnormality in operation of an arithmetic processor and abnormality in the power supply voltage and capable of improving reliability. In a case where there is no abnormality in a main CPU 11b and a main CPU 12b of an autonomous travel control unit 11 and an auxiliary control unit 12, the autonomous travel control unit 11 and the auxiliary control unit 12 calculate control instruction values for automatic driving control, validate a CAN communication circuit 11c of the autonomous travel control units 11 while invalidating a CAN communication circuit 12c of the auxiliary control unit 12. In a case where abnormality occurs in the autonomous travel control unit 11 and there is no abnormality in the auxiliary control unit 12, the CAN communication circuit 11c of the autonomous travel control unit 11 is invalidated and the CAN communication circuit 12c of the auxiliary control unit 12 is validated.Type: ApplicationFiled: July 4, 2017Publication date: June 13, 2019Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.Inventors: Hideyuki SAKAMOTO, Akio IKEYA, Masayuki KAWABATA, Hirotaka AMO
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Patent number: 9836429Abstract: The present invention aims to improve the signal transmission characteristics by shortening the length of the detour path of the return current. The present invention comprises a return current transmission path relative to a signal transmission path for transmitting signals. The signal transmission path includes a signal pad formed on a circuit board surface layer, and signal through-holes formed on the circuit board surface layer and a circuit board inner layer and connected to the signal pad. The return current transmission path includes a ground pad formed on the circuit board surface layer, and a plurality of ground through-holes formed on the circuit board surface layer and the circuit board inner layer and connected to the ground pad and a ground layer of the circuit board inner layer. Each of the ground through-holes is arranged by being separated on either side of the ground pad.Type: GrantFiled: November 6, 2013Date of Patent: December 5, 2017Assignee: HITACHI, LTD.Inventors: Nobuhiko Wakayama, Akio Ikeya
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Publication number: 20150370748Abstract: The present invention aims to improve the signal transmission characteristics by shortening the length of the detour path of the return current. The present invention comprises a return current transmission path relative to a signal transmission path for transmitting signals. The signal transmission path includes a signal pad formed on a circuit board surface layer, and signal through-holes formed on the circuit board surface layer and a circuit board inner layer and connected to the signal pad. The return current transmission path includes a ground pad formed on the circuit board surface layer, and a plurality of ground through-holes formed on the circuit board surface layer and the circuit board inner layer and connected to the ground pad and a ground layer of the circuit board inner layer. Each of the ground through-holes is arranged by being separated on either side of the ground pad.Type: ApplicationFiled: November 6, 2013Publication date: December 24, 2015Applicant: Hitachi, Ltd.Inventors: Nobuhiko WAKAYAMA, Akio IKEYA
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Patent number: 9024196Abstract: There is provided a printed circuit board having a differential signal transmission line composed of non-skew-adjusting portions and skew-adjusting portions. The non-skew-adjusting portion consists of parallel conductive traces spaced apart by a spacing. The skew-adjusting portion consists of a pair of meander traces for the skew adjustment. The skew-adjusting portion include convex transmission line segments and concave transmission line segments. The convex transmission line segment has parallel traces having a differential trace pair spacing greater than the differential trace pair spacing in the non-skew-adjusting portion. The concave transmission line segment has parallel traces having a differential trace pair spacing smaller than the differential trace pair spacing in the non-skew-adjusting portion.Type: GrantFiled: January 6, 2011Date of Patent: May 5, 2015Assignee: Hitachi, Ltd.Inventors: Masanao Yoneya, Kazunori Nakajima, Naohiro Sezaki, Kenji Kashiwagi, Akio Ikeya
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Patent number: 8745275Abstract: A blade server apparatus including a plurality of server modules, a backplane for mounting the plurality of server modules thereon, and an SMP coupling device having wiring lines to SMP couple the plurality of server modules. Each of the server modules has one or more processors controlled by firmware and a module manager for managing its own server module, the module manager has an ID determiner for informing each processor of a processor ID, each processor has a processing unit and an SMP virtual connecting unit for instructing ones of wiring lines of the SMP coupling device through which a packet received from the processing unit is to be transmitted, and an ID converter for converting the processor ID and informing it to the SMP virtual connecting unit is provided within the firmware.Type: GrantFiled: August 15, 2011Date of Patent: June 3, 2014Assignee: Hitachi, Ltd.Inventors: Akio Ikeya, Takashi Aoyagi, Kenji Kashiwagi, Naohiro Sezaki, Kazunori Nakajima
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Publication number: 20120054469Abstract: A blade server apparatus including a plurality of server modules, a backplane for mounting the plurality of server modules thereon, and an SMP coupling device having wiring lines to SMP couple the plurality of server modules. Each of the server modules has one or more processors controlled by firmware and a module manager for managing its own server module, the module manager has an ID determiner for informing each processor of a processor ID, each processor has a processing unit and an SMP virtual connecting unit for instructing ones of wiring lines of the SMP coupling device through which a packet received from the processing unit is to be transmitted, and an ID converter for converting the processor ID and informing it to the virtual connecting unit is provided within the firmware.Type: ApplicationFiled: August 15, 2011Publication date: March 1, 2012Inventors: AKIO IKEYA, Takashi Aoyagi, Kenji Kashiwagi, Naohiro Sezaki, Kazunori Nakajima
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Publication number: 20110203834Abstract: There is provided a printed circuit board having a differential signal transmission line composed of non-skew-adjusting portions and skew-adjusting portions. The non-skew-adjusting portion consists of parallel conductive traces spaced apart by a spacing. The skew-adjusting portion consists of a pair of meander traces for the skew adjustment. The skew-adjusting portion include convex transmission line segments and concave transmission line segments. The convex transmission line segment has parallel traces having a differential trace pair spacing greater than the differential trace pair spacing in the non-skew-adjusting portion. The concave transmission line segment has parallel traces having a differential trace pair spacing smaller than the differential trace pair spacing in the non-skew-adjusting portion.Type: ApplicationFiled: January 6, 2011Publication date: August 25, 2011Applicant: HITACHI, LTD.Inventors: Masanao YONEYA, Kazunori NAKAJIMA, Naohiro SEZAKI, Kenji KASHIWAGI, Akio IKEYA