Patents by Inventor Akio Suzumura

Akio Suzumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060093578
    Abstract: A method of treating multiple sclerosis including administering Interferon-? and a phosphodiesterase inhibitor in combination in a therapeutically effective amount.
    Type: Application
    Filed: November 4, 2005
    Publication date: May 4, 2006
    Applicant: Kyorin Pharmaceutical Co., Ltd.
    Inventor: Akio Suzumura
  • Patent number: 6889890
    Abstract: When a diamond is brazed to a metal substrate, while obtaining a stable joining strength, a joined interface of the diamond is not eroded to provide a good joint with a beautiful view. A brazing-filler material containing at least one selected from a group consisting of gold and silver, and copper as principal components, and further containing 0.001 to 5 mass % of vanadium is used. Preferably, a vanadium content is not more than 2.0 mass %, and more preferably not more than 0.5 mass %. Using this brazing-filler material, unidirectional solidification is performed from a side of diamond to form vanadium carbide in a joined interface in a shape of islands, and thereby an interface having a beautiful view with stable joining strength can be obtained. In addition, strong joining is possible also by a usual solidification method.
    Type: Grant
    Filed: October 2, 2002
    Date of Patent: May 10, 2005
    Assignee: Hohoemi Brains, Inc.
    Inventors: Takahisa Yamazaki, Akio Suzumura
  • Publication number: 20030080177
    Abstract: When a diamond is brazed to a metal substrate, while obtaining a stable joining strength, a joined interface of the diamond is not eroded to provide a good joint with a beautiful view. A brazing-filler material containing at least one selected from a group consisting of gold and silver, and copper as principal components, and further containing 0.001 to 5 mass % of vanadium is used. Preferably, a vanadium content is not more than 2.0 mass %, and more preferably not more than 0.5 mass %. Using this brazing-filler material, unidirectional solidification is performed from a side of diamond to form vanadium carbide in a joined interface in a shape of islands, and thereby an interface having a beautiful view with stable joining strength can be obtained. In addition, strong joining is possible also by a usual solidification method.
    Type: Application
    Filed: October 2, 2002
    Publication date: May 1, 2003
    Inventors: Takahisa Yamazaki, Akio Suzumura