Abstract: Disclosed herein is an optical processing device and an optical processing method. The optical processing device comprises: a light source unit configured to emit light; and a processing unit configured to expose an object to be processed to the light emitted from the light source unit. The processing unit includes: a processing region in which the object to be processed is held and exposed to the light in an atmosphere of a processing gas; and a preparatory region through which the processing gas passes, while being exposed to the light, to move toward the processing region, the preparatory region being configured to prevent the object to be processed from being arranged thereon.

Abstract: A semiconductor device includes a first MOS transistor and a second MOS transistor of a second conductivity type. The first MOS transistor includes a first main electrode connected to a first potential and a second main electrode connected to a second potential. The second MOS transistor includes a first main electrode connected to a control electrode of the first MOS transistor and a second main electrode connected to the second potential. The control electrodes of the first and second MOS transistors are connected in common. The first and second MOS transistors are formed on a common wide bandgap semiconductor substrate. In the first MOS transistor, a main current flows in a direction perpendicular to a main surface of the wide bandgap semiconductor substrate. In the second MOS transistor, a main current flows in a direction parallel to the main surface of the wide bandgap semiconductor substrate.

Abstract: A polyamide resin composition which comprises 20 to 80 wt % of polyamide resin and 80 to 20 wt % of inorganic fibers, 85 to 15 wt % of said inorganic fiber being glass fiber and remaining 15 to 85 wt % being ground mineral fiber having an aspect ratio of 5 to 100. The composition has high strength and high modulus of elasticity and is suitable for molding. The composition provides moldings having good surfaces.

Abstract: Mould assembly for foam moulding of plastic materials, which comprises stationary and movable dies and an auxiliary die plate device between the stationary and movable dies. A gas passage is formed for introducing pressurized inert gas into the mould cavity. The auxiliary die device comprises separated inner and outer auxiliary dies both being spring biased toward the stationary die. O-ring seals are disposed between the opposite surfaces of the outer auxiliary die and the stationary and movable dies.

Abstract: This invention relates to an improved injection foam molding method in which a foamable mixture of molten synthetic polymer resin and a chemical blowing agent in unfoamed condition is injected into a gas-pressurized expandable mold having a mold section movable for expanding the mold cavity to a position in which the surface of that section is in registry to the surface of another mold section, in which process the mold is filled under conditions resisting foaming of the material prior to filling of the mold and a novel controlled time sequence effective to form a fine mold crease line is employed in releasing the gas pressure and expanding the mold to allow foaming of the mixture into conformity with the mold surface.