Patents by Inventor Akira Baba
Akira Baba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20060115779Abstract: A overfiring air port of the present invention is to supply an incomplete combustion region with air making up for combustion-shortage, in a furnace in which the incomplete combustion region less than stoichiometric ratio is formed by a burner. Furthermore, the airport is characterized by comprising: a nozzle mechanism for injecting air including an axial velocity component of an air flow and a radial velocity component directed to a center line of the airport; and a control mechanism for controlling a ratio of these velocity components.Type: ApplicationFiled: November 3, 2005Publication date: June 1, 2006Applicant: BABCOCK-HITACHI K.K.Inventors: Kenji Yamamoto, Hirofumi Okazaki, Masayuki Taniguchi, Kazumi Yasuda, Kenji Kiyama, Takanori Yano, Akira Baba, Kenichi Ochi, Hisayuki Orita, Akihito Orii, Yuki Kamikawa, Kouji Kuramashi
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Publication number: 20060090677Abstract: An after-air nozzle capable of reducing NOx and CO and a boiler equipped with such a nozzle are provided The after-air nozzle has a vena contracta such that an outside diameter of a flow passage diminishes towards the air-jetting port which supplies air to a boiler, and a changing apparatus changes a flow passage cross-sectional area the vena contracta. A method of use of such an after-air nozzle and a boiler so equipped is also provided.Type: ApplicationFiled: November 1, 2005Publication date: May 4, 2006Applicant: BABCOCK-HITACHI K.K.Inventors: Masayuki Taniguchi, Kenji Yamamoto, Hirofumi Okazaki, Kazumi Yasuda, Kenji Kiyama, Takanori Yano, Akira Baba
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Publication number: 20050043157Abstract: An automated machine for and the method of fabricating containers made from a cardboard paperboard or corrugated paperboard blank having an inner liquid holding bag secured to the inner surface of the paperboard box. The liquid holding bag includes a spout that extends through a spout opening formed in the paperboard blank. During the fabrication process the spout is utilized to precisionally locate the liquid holding bag so that when the panel of the blank with the spout opening is folded down over the spout, the spout will be properly aligned with the spout opening thus facilitating the automatic assembly of the container. In this automatic assembly process the liquid holding bag is secured to the inner surface of the container at multiple locations such that when the container is opened into its three dimensional use configuration a passage is opened for filling the bag through the spout.Type: ApplicationFiled: July 21, 2004Publication date: February 24, 2005Inventors: Matthew Cook, Akira Baba
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Patent number: 6858804Abstract: The cable-enrolling conductive thin-film sheet 1 consists of a conductive thin film 2 and an insulated cable 3. The conductive thin film 2 has a conductor layer 4 and first and second insulating layers 5, 6. The first insulating layer 5 is laminated on one face of the conductor layer 4, while the second insulating layer 6 is laminated on the other face of the conductor layer 4. The insulated cable 3 has an electrically conductive core wire 10 and an insulating sheath 11 covering the core wire 10. The insulated cable 3 laid on the first insulating layer 5 is partially welded to the sheet 2 by ultrasonic welding to obtain the cable-enrolling conductive thin-film sheet 1. The first insulating layer 5 is welded to be secured to the sheath 11, and the conductor layer 4 is mechanically connected to the core wire 10 by the ultrasonic welding.Type: GrantFiled: November 29, 2001Date of Patent: February 22, 2005Assignee: Yazaki CorporationInventors: Kazuhiro Murakami, Yoshihiko Watanabe, Akira Baba
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Patent number: 6806417Abstract: A conductor-equipped conductive thin film sheet 1 includes a conductive thin film sheet 2 and a metallic piece 8. The conductive thin film sheet 2 is composed of a conductive layer 4 and an insulating layer 7. The metallic piece 8 is superposed on the insulating layer 7 and is partially bonded to the conductive layer 4 by ultrasonic welding. In this configuration, when the sheet is wound around an electric wire, noise can be surely dissipated. A shield harness using the conductive thin film is also disclosed.Type: GrantFiled: May 16, 2002Date of Patent: October 19, 2004Assignee: Yazaki CorporationInventors: Kazuhiro Murakami, Yoshihiko Watanabe, Akira Baba, Tomohiro Ikeda, Satoshi Saito
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Publication number: 20040180770Abstract: An automated machine for and the method of fabricating containers made from a cardboard paperboard or corrugated paperboard blank having an inner liquid holding bag secured to the inner surface of the paperboard box. The liquid holding bag includes a spout that extends through a spout opening formed in the paperboard blank. During the fabrication process the spout is utilized to precisionally locate the liquid holding bag so that when the panel of the blank with the spout opening is folded down over the spout, the spout will be properly aligned with the spout opening thus facilitating the automatic assembly of the container. In this automatic assembly process the liquid holding bag is secured to the inner surface of the container at multiple locations such that when the container is opened into its three dimensional use configuration a passage is opened for filling the bag through the spout.Type: ApplicationFiled: March 11, 2003Publication date: September 16, 2004Inventors: Matthew R. Cook, Akira Baba
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Patent number: 6594129Abstract: In a semiconductor relay system for supply a power source to a lamp load under the on/off control by a microcomputer using a semiconductor relay, a method of cutting off a circuit under an overcurrent, a first prescribed value is which is a current value higher than a rated load current for the load and a maximum current value supplied to the lamp load, and a second prescribed value is set which is a current value between said first prescribed value and said rated current value; the current value flowing through the lamp load is sampled at predetermined time intervals and comparing the current value thus sampled with the second prescribed value; and when a higher current than said first prescribed value flows through the lamp load, the current supplied to the lamp load is controlled within a prescribed range between said first prescribed value and said second prescribed value, and when the sampled current value higher that said second prescribed value is counted by a prescribed number of times, the sampled cuType: GrantFiled: September 22, 2000Date of Patent: July 15, 2003Assignee: Yazaki CorporationInventors: Akira Baba, Yoshikazu Nagashima, Kazuto Sugiyama, Yoshihiko Mine
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Patent number: 6588097Abstract: The present invention provides a multilayered ceramic substrate having high precision and high reliability in which firing shrinkage in the planar direction thereof is suppressed and densification is achieved. The multilayered ceramic substrate is manufactured by laminating base layers each composed of a non-glass type low-temperature sintering ceramic raw material powder as a main component, and shrinkage inhibiting layers each composed of a sintering-resistant powder of alumina or the like as a main component to form a green ceramic laminate, and then firing the green ceramic laminate at the sintering temperature of the low-temperature sintering ceramic raw material powder. The shrinkage inhibiting layers contain a powder which does not soften and flow at the firing shrinkage start temperature of the low-temperature sintering ceramic powder, but permeates into the spaces of the sintering-resistant powder due to softening and flowing to densify the shrinkage inhibiting layers before sintering is completed.Type: GrantFiled: August 28, 2001Date of Patent: July 8, 2003Assignee: Murata Manufacturing Co., Ltd.Inventors: Mitsuyoshi Nishide, Akira Baba
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Patent number: 6582541Abstract: In a green laminate body including a plurality of base green layers and a plurality of constraining green layers for forming a monolithic ceramic substrate by using a non-shrinking process, when the thicknesses of the base green layers differ from each other, a thicker base green layer shrinks largely during sintering, and hence, the resulting monolithic ceramic substrate may warp in some cases. In order to solve this problem, the constraining green layers, which are in contact with the main surfaces of the individual base green layers, have different thicknesses so that a relatively thicker constraining green layer is in contact with a relatively thicker base green layer, and a relatively thinner constraining green layer is in contact with a relatively thinner base green.Type: GrantFiled: April 18, 2002Date of Patent: June 24, 2003Assignee: Murata Manufacturing Co., Ltd.Inventors: Mitsuyoshi Nishide, Norio Sakai, Akira Baba
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Patent number: 6528731Abstract: A flat shield harness includes a flat harness including a plurality of first conductive cores arranged in parallel and an insulating cladding which clads the first conductive cores; a thin film sheet having a thin film conductive layer; and an electric wire including a second conductive core and a second cladding which clads the second core. The thin film sheet is wound around the outer periphery of the flat harness with its ends superposed in a width direction of the flat harness, the electric wire is superposed on the ends, and the conductive layer at the ends of the thin film sheet at the ends is bonded to the second core. In this configuration, the flat shield harness can surely dissipate externally the noise which is about to invade the core of an electric wire and suppress an increase in the cost in the wire harness to be assembled.Type: GrantFiled: November 21, 2001Date of Patent: March 4, 2003Assignee: Yazaki CorporationInventors: Kazuhiro Murakami, Kazuhiko Watanabe, Kimio Tsuchiya, Akira Baba
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Publication number: 20020170729Abstract: A conductor-equipped conductive thin film sheet 1 includes a conductive thin film sheet 2 and a metallic piece 8. The conductive thin film sheet 2 is composed of a conductive layer 4 and an insulating layer 7. The metallic piece 8 is superposed on the insulating layer 7 and is partially bonded to the conductive layer 4 by ultrasonic welding. In this configuration, when the sheet is wound around an electric wire, noise can be surely dissipated. A shield harness using the conductive thin film is also disclosed.Type: ApplicationFiled: May 16, 2002Publication date: November 21, 2002Applicant: Yazaki CorporationInventors: Kazuhiro Murakami, Yoshihiko Watanabe, Akira Baba, Tomohiro Ikeda, Satoshi Saito
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Publication number: 20020155264Abstract: In a green laminate body including a plurality of base green layers and a plurality of constraining green layers for forming a monolithic ceramic substrate by using a non-shrinking process, when the thicknesses of the base green layers differ from each other, a thicker base green layer shrinks largely during sintering, and hence, the resulting monolithic ceramic substrate may warp in some cases. In order to solve this problem, the constraining green layers, which are in contact with the main surfaces of the individual base green layers, have different thicknesses so that a relatively thicker constraining green layer is in contact with a relatively thicker base green layer, and a relatively thinner constraining green layer is in contact with a relatively thinner base green.Type: ApplicationFiled: April 18, 2002Publication date: October 24, 2002Applicant: Murata Manufacturing Co., Ltd.Inventors: Mitsuyoshi Nishide, Norio Sakai, Akira Baba
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Patent number: 6468640Abstract: In a green laminate body including a plurality of base green layers and a plurality of constraining green layers for forming a monolithic ceramic substrate by using a non-shrinking process, when the thicknesses of the base green layers differ from each other, a thicker base green layer shrinks largely during sintering, and hence, the resulting monolithic ceramic substrate may warp in some cases. In order to solve this problem, the constraining green layers, which are in contact with the main surfaces of the individual base green layers, have different thicknesses so that a relatively thicker constraining green layer is in contact with a relatively thicker base green layer, and a relatively thinner constraining green layer is in contact with a relatively thinner base green.Type: GrantFiled: April 6, 2001Date of Patent: October 22, 2002Assignee: Murata Manufacturing Co., Ltd.Inventors: Mitsuyoshi Nishide, Norio Sakai, Akira Baba
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Publication number: 20020096358Abstract: The cable-enrolling conductive thin-film sheet 1 consists of a conductive thin film 2 and an insulated cable 3. The conductive thin film 2 has a conductor layer 4 and first and second insulating layers 5, 6. The first insulating layer 5 is laminated on one face of the conductor layer 4, while the second insulating layer 6 is laminated on the other face of the conductor layer 4. The insulated cable 3 has an electrically conductive core wire 10 and an insulating sheath 11 covering the core wire 10. The insulated cable 3 laid on the first insulating layer 5 is partially welded to the sheet 2 by ultrasonic welding to obtain the cable-enrolling conductive thin-film sheet 1. The first insulating layer 5 is welded to be secured to the sheath 11, and the conductor layer 4 is mechanically connected to the core wire 10 by the ultrasonic welding.Type: ApplicationFiled: November 29, 2001Publication date: July 25, 2002Applicant: Yazaki Corporation, Tokyo, JapanInventors: Kazuhiro Murakami, Yoshihiko Watanabe, Akira Baba
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Patent number: 6400545Abstract: A fuseless DC-DC converter is provided to protect a circuit from overcurrent without involvement of a protective fuse. This is accomplished by providing a load circuit in the converter that includes a first overheat self-interruption-type semiconductor switch in series between a DC power supply and a load, and a reference circuit including a second overheat self-interruption-type semiconductor switch in parrallel with the first switch, and a reference resistor with one end connected to the source of the second switch, and the other end grounded. Also included is a comparator circuit that compares the source voltage of the first switch with a reference voltage applied to the source of the second switch, and thereby determines if the circuit has overcurrent. If overcurrent is detected, the results from the comparator circuit are used by a power supply controller to deactivate the semiconductor switch.Type: GrantFiled: February 22, 2000Date of Patent: June 4, 2002Assignee: Yazaki CorporationInventor: Akira Baba
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Publication number: 20020062979Abstract: A flat shield harness includes a flat harness including a plurality of first conductive cores arranged in parallel and an insulating cladding which clads the first conductive cores; a thin film sheet having a thin film conductive layer; and an electric wire including a second conductive core and a second cladding which clads the second core. The thin film sheet is wound around the outer periphery of the flat harness with its ends superposed in a width direction of the flat harness, the electric wire is superposed on the ends, and the conductive layer at the ends of the thin film sheet at the ends is bonded to the second core. In this configuration, the flat shield harness can surely dissipate externally the noise which is about to invade the core of an electric wire and suppress an increase in the cost in the wire harness to be assembled.Type: ApplicationFiled: November 21, 2001Publication date: May 30, 2002Applicant: Yazaki CorporationInventors: Kazuhiro Murakami, Kazuhiko Watanabe, Kimio Tsuchiya, Akira Baba
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Publication number: 20020061629Abstract: The present invention provides a multilayered ceramic substrate having high precision and high reliability in which firing shrinkage in the planar direction thereof is suppressed and densification is achieved. The multilayered ceramic substrate is manufactured by laminating base layers each composed of a non-glass type low-temperature sintering ceramic raw material powder as a main component, and shrinkage inhibiting layers each composed of a sintering-resistant powder of alumina or the like as a main component to form a green ceramic laminate, and then firing the green ceramic laminate at the sintering temperature of the low-temperature sintering ceramic raw material powder. The shrinkage inhibiting layers contain a powder which does not soften and flow at the firing shrinkage start temperature of the low-temperature sintering ceramic powder, but permeates into the spaces of the sintering-resistant powder due to softening and flowing to densify the shrinkage inhibiting layers before sintering is completed.Type: ApplicationFiled: August 28, 2001Publication date: May 23, 2002Applicant: Murata Manufacturing Co., Ltd.Inventors: Mitsuyoshi Nishide, Akira Baba
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Publication number: 20020058131Abstract: In a green laminate body including a plurality of base green layers and a plurality of constraining green layers for forming a monolithic ceramic substrate by using a non-shrinking process, when the thicknesses of the base green layers differ from each other, a thicker base green layer shrinks largely during sintering, and hence, the resulting monolithic ceramic substrate may warp in some cases. In order to solve this problem, the constraining green layers, which are in contact with the main surfaces of the individual base green layers, have different thicknesses so that a relatively thicker constraining green layer is in contact with a relatively thicker base green layer, and a relatively thinner constraining green layer is in contact with a relatively thinner base green.Type: ApplicationFiled: April 6, 2001Publication date: May 16, 2002Applicant: Murata Manufacturing Co., Ltd.Inventors: Mitsuyoshi Nishide, Norio Sakai, Akira Baba
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Patent number: 6335577Abstract: A power supply control unit of this invention has a stabilized power source by a DC/DC converter and a Zener diode for supplying selectively plural voltages and supplies a power to a current vibration type shut-off function provided switching circuit. When power supply from a power source to a low voltage load is controlled via switching by a temperature sensor incorporated FET, a reference voltage having a voltage characteristic equivalent to that of a voltage between terminals of the temperature sensor incorporated FET to which a predetermined load is connected is generated by a reference FET and a resistor. A difference between a voltage between the terminals of the temperature sensor incorporated FET and the reference voltage is detected by a comparator. Then, the ON/OFF of the temperature sensor incorporated FET is controlled depending on a difference between the voltage between the terminals and the reference voltage by a driving circuit.Type: GrantFiled: February 11, 2000Date of Patent: January 1, 2002Assignee: Yazaki CorporationInventor: Akira Baba
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Patent number: 6222709Abstract: An improved electric power supply control device for supplying electric power to a load from a battery is described. The electric power supply control device is composed of a semiconductor switch connected between the electric power source and the load in order to controlling the power supply to the load, an excessive electric current detecting circuit for detecting an excessive electric current flowing through the load, a protection circuit connected to the semiconductor switch for turning off the semiconductor switch if the excessive electric current detecting circuit detects an excessive electric current, and a control circuit for disabling the protection circuit from turning off the semiconductor switch if the rate of increase of the electric current as flowing through the load is smaller than a predetermined rate.Type: GrantFiled: February 11, 2000Date of Patent: April 24, 2001Assignee: Yazaki CorporationInventor: Akira Baba