Abstract: A separation apparatus comprising a first and a second scribing portions for scribing front and rear surfaces of a first mother substrate made of a brittle material along first predetermined scribing lines previously provided on the front and rear surfaces of the first mother substrate, the first and second scribing portions being opposed to each other on an upper side and a lower side, and a holding and transferring portions for holding and transferring the first mother substrate so that the first predetermined scribing lines of the first mother substrate are located between the first and second scribing portions.

Abstract: A separation apparatus comprising a first and a second scribing devices for scribing front and rear surfaces of a first mother substrate made of a brittle material along first predetermined scribing lines previously provided on the front and rear surfaces of the first mother substrate, the first and second scribing devices being opposed to each other on an upper side and a lower side, and a holding and transferring device for holding and transferring the first mother substrate so that the first predetermined scribing lines of the first mother substrate are located between the first and second scribing devices.

Abstract: A separation apparatus comprising a first and a second scribing means for scribing front and rear surfaces of a first mother substrate made of a brittle material along first predetermined scribing lines previously provided on the front and rear surfaces of the first mother substrate, the first and second scribing means being opposed to each other on an upper side and a lower side, and a holding and transferring means for holding and transferring the first mother substrate so that the first predetermined scribing lines of the first mother substrate are located between the first and second scribing means.

Abstract: The present invention realizes a polishing apparatus capable of chamfering an end face of a large-sized substrate at a high precision for a table unit for mounting the substrate. A substrate is mounted on a table unit and is fixedly held in a predetermined reference state. A first polishing unit includes a polishing grind stone for polishing an end face of the substrate held on the table unit and substrate side edge portion supporting means for supporting the lower surface of a side edge portion of the substrate in the vicinity of the end face of the substrate to be polished by the polishing unit. The first polishing unit is moved together with the substrate side edge portion supporting means by a first polishing unit moving means along the end face of the substrate while the polishing grind stone is polishing the end face of the substrate.

Abstract: A separation apparatus comprising a first and a second scribing means for scribing front and rear surfaces of a first mother substrate made of a brittle material along first predetermined scribing lines previously provided on the front and rear surfaces of the first mother substrate, the first and second scribing means being opposed to each other on an upper side and a lower side, and a holding and transferring means for holding and transferring the first mother substrate so that the first predetermined scribing lines of the first mother substrate are located between the first and second scribing means.

Abstract: A separation apparatus comprising a first and a second scribing means for scribing front and rear surfaces of a first mother substrate made of a brittle material along first predetermined scribing lines previously provided on the front and rear surfaces of the first mother substrate, the first and second scribing means being opposed to each other on an upper side and a lower side, and a holding and transferring means for holding and transferring the first mother substrate so that the first predetermined scribing lines of the first mother substrate are located between the first and second scribing means.

Abstract: A scribe method for a brittle material substrate is a method in which a plurality of scribe lines are formed in directions intersecting with one another in a surface of the brittle material substrate, wherein at least one scribe line in a first direction is formed by a scribe means generating a high-penetration vertical crack in the brittle material substrate by applying impacts of a short period to the point on the surface of the brittle material substrate. After this, at least one scribe line of a second direction in a direction intersecting with the at least one scribe line of the first direction is formed with the scribe means by scribing without producing intersections with the scribe lines of the first direction.

Abstract: A separation apparatus comprising a first and a second scribing means for scribing front and rear surfaces of a first mother substrate made of a brittle material along first predetermined scribing lines previously provided on the front and rear surfaces of the first mother substrate, the first and second scribing means being opposed to each other on an upper side and a lower side, and a holding and transferring means for holding and transferring the first mother substrate so that the first predetermined scribing lines of the first mother substrate are located between the first and second scribing means.