Abstract: Provided is a semiconductor device including: a substrate containing a semiconductor material; an electrode provided on a substrate surface of the substrate, the electrode containing a metal material; and a mixed member provided on the substrate surface to be in contact with the electrode, the mixed member containing the semiconductor material and the metal material, in which a portion of the substrate surface is exposed at an end of the substrate.

Abstract: Provided is a semiconductor device including: a substrate containing a semiconductor material; an electrode provided on a substrate surface of the substrate, the electrode containing a metal material; and a mixed member provided on the substrate surface to be in contact with the electrode, the mixed member containing the semiconductor material and the metal material, in which a portion of the substrate surface is exposed at an end of the substrate.

Abstract: According to an embodiment, a semiconductor device includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type, a first insulating layer, and a first insulating region. The second semiconductor region is provided on the first semiconductor region. The first insulating layer is provided around at least a portion of the first semiconductor region and at least a portion of the second semiconductor region. The first insulating layer contacts the second semiconductor region. The first insulating region is provided around at least a portion of the first insulating layer.

Abstract: According to an embodiment, a semiconductor device includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type, a first insulating layer, and a first insulating region. The second semiconductor region is provided on the first semiconductor region. The first insulating layer is provided around at least a portion of the first semiconductor region and at least a portion of the second semiconductor region. The first insulating layer contacts the second semiconductor region. The first insulating region is provided around at least a portion of the first insulating layer.

Abstract: A case molded article is molded by injecting resin into a molding space formed in an in-mold decoration die; meanwhile, foil is joined to the surface of the case molded article. After that, the foil is peeled off from the surface of the case molded article while leaving a pattern layer at least on the upper ends of the corners of the rising wall on the case molded article. Subsequently, the foil is peeled off from the surface of the case molded article while leaving the pattern layer at other points where the foil is joined to the surface of the case molded article.

Abstract: A method of inspecting a semiconductor device includes attaching an inspection tool on a back surface of a semiconductor substrate including the semiconductor device, the inspection tool including a sheet and a holding frame, the sheet being larger than the semiconductor substrate and being provided with an opening in a center portion of the sheet, the opening being smaller than the semiconductor substrate, the holding frame holding an outer periphery of the sheet, and a supporting substrate being attached on a front surface of the semiconductor substrate, removing the supporting substrate attached on the front surface of the semiconductor substrate, and measuring electrical characteristics of the semiconductor device.

Abstract: A case molded article is molded by injecting resin into a molding space formed in an in-mold decoration die; meanwhile, foil is joined to the surface of the case molded article. After that, the foil is peeled off from the surface of the case molded article while leaving a pattern layer at least on the upper ends of the corners of the rising wall on the case molded article. Subsequently, the foil is peeled off from the surface of the case molded article while leaving the pattern layer at other points where the foil is joined to the surface of the case molded article.

Abstract: An aspect of one embodiment, there is provided a supporting substrate, including a first supporting substrate, an outer diameter being larger than a diameter of a semiconductor substrate and an inner diameter being smaller than the diameter of the semiconductor substrate, and a second supporting substrate, an outer diameter being smaller than the inner diameter of the first supporting substrate.

Abstract: An aspect of the present embodiment, there is provided a method of fabricating a semiconductor device, including curving a semiconductor substrate onto which a protection tape is bonded, and removing the protection tape in a state where the semiconductor substrate is curved.

Abstract: An aspect of one embodiment, there is provided a method of inspecting a semiconductor device, attaching an inspection tool on a back surface of a semiconductor substrate, the inspection tool including a sheet and a holding frame, the sheet being larger than the semiconductor substrate and being provided an opening in a center portion of the sheet, the opening being smaller than the semiconductor substrate, the holding frame holding an outer periphery of the sheet, a supporting substrate being attached on a front surface of the semiconductor substrate, removing the supporting substrate attached on the front surface of the semiconductor substrate, and inspecting electrical characteristics of the semiconductor substrate.

Abstract: A multi-band antenna apparatus comprises a first conductor and a second conductor arranged with a specific interval and a feeder which feeds power to the first conductor and the second conductor, and the first conductor is divided by a slit.

Abstract: A multi-band antenna apparatus comprises a first conductor and a second conductor arranged with a specific interval and a feeder which feeds power to the first conductor and the second conductor, and the first conductor is divided by a slit.

Abstract: A compact cash register comprises a first member for freely adjusting the visual angle of the same. The first member is connected to a second member of a casing of the compact cash register so as to provide in order to adjust the visual angle of the cash register. The first member comprises a ball biased continuously by a spring. The second member includes a cavity formed on the surface of a cover of the casing. The connection between the first member and the second member allows the compact cash register to be supported obliquely. The connection may be formed as a ratchet mechanism, a pivotal mechanism and the like. The casing comprises at least two compartments each containing the compact cash register and cash, the two compartments being adjacent to each other.