Abstract: An IC fault analysis system which is capable of accurately correlating mask layout data and/or net listing data associated with CAD (computer aided design) data developed in the IC design and an image obtained by a non-contact type tester such as an electron beam tester.

Abstract: The object of the invention is to provide an IC analysis system having a charged particle beam apparatus in which the operability and picture quality have been enhanced and the measurement method of a device under test. In the IC analysis system, stop signal generating means in which the stop signal stimulates the acquisition of image data is added to a test pattern generator and acquisition completion signal generating means which releases the stopping state on completing the acquisition of image data and which resumes the test pattern updating operation is added to the charged particle beam apparatus. Furthermore, by adding mode select means to the charged particle beam apparatus, a clearer potential contrast image can be obtained.

Abstract: A stop pattern setting part 203 is provided which permits setting therein a plurality of patterns for stopping the test pattern updating operation of a test pattern generator 210, and upon each generation of the test patterns set in the stop pattern setting part 203, the test pattern generator 210 is stopped from the pattern updating operation. Each time the test pattern stops, a stop signal is applied to an electron beam probe system 300, causing it to start an image data acquiring operation. Upon completion of the image data acquisition, a write completion signal generating part 308 generates a write completion signal, which is applied to the test pattern generator 210 to cause it to resume the pattern updating operation. By applying different test patterns to a device under test alternately with each other and displaying image data of the difference between resulting pieces of image data, a potential contrast image can be improved.

Abstract: An IC test system analyzes a defective part in the inside of an IC chip. The IC test system irradiates an ion beam on the surface of the IC under test and displays a potential contrast image of wiring conductors under the surface of the IC device. The IC test system has improved operability and image quality as well as a capability of specifying a defective part of the IC under test. A stop pattern setting part is provided for setting a plurality of patterns to suspend a renewal operation of pattern generation in a test pattern generator. Whenever this stop pattern occurs, a pattern renewal action of the test pattern generator is stopped and repeatedly generates the stop pattern while an ion beam tester acquires image data. When the acquisition of the image data completes, the test pattern generator resumes the pattern renewal action. Different test patterns are alternatively applied to the IC under test and the resulting image data is either added or subtracted to improve an image quality.

Abstract: A stop pattern setting part 203 is provided which permits setting therein a plurality of patterns for stopping the test pattern updating operation of a test pattern generator 210, and upon each generation of the test patters set in the stop pattern setting part 203, the test pattern generator 210 is stopped from the pattern updating operation. Each time the test pattern stops, a stop signal is applied to an electron beam probe system 300, causing it to start an image data acquiring operation. Upon completion of the image data acquisition, a write completion signal generating part 308 generates a write completion signal, which is applied to the test pattern generator 210 to cause it to resume the pattern updating operation. By applying different test patterns to a device under test alternately with each other and displaying image data of the difference between resulting pieces of image data, a potential contrast image can be improved.

Abstract: A stop pattern setting part 203 is provided which permits setting therein a plurality of patterns for stopping the test pattern updating operation of a test pattern generator 210, and upon each generation of the test patterns set in the stop pattern setting part 203, the test pattern generator 210 is stopped from the pattern updating operation. Each time the test pattern stops, a stop signal is applied to an electron beam probe system 300, causing it to start an image data acquiring operation. Upon completion of the image data acquisition, a write completion signal generating part 308 generates a write completion signal, which is applied to the test pattern generator 210 to cause it to resume the pa-tern updating operation. By applying different test patterns to a device under test alternately with each other and displaying image data of the difference between resulting pieces of image data, a potential contrast image can be improved.