Patents by Inventor Akira Kanesige

Akira Kanesige has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4808113
    Abstract: A miniaturized surface mountable connector arrangement for connecting printed circuits on a printed circuit board to another circuit member, such as flat flex cable is provided. Each circuit on the circuit board is provided with at least two spaced apart solder-bearing contact pads. A connector housing having a board engaging surface includes a plurality of stamped metal terminals each having a pair of depending solder contact projections at least one of which depends from board engaging surface. The connector is positioned on the circuit board so that the contact projections engage the contact pads. Upon reflow of the solder material a balanced shock resistant mechanical attachment and electrical connection of the connector to the circuit board is provided. No additional mounting structures are required so the arrangement occupies less board surface area. The arrangement is well suited for robotic assembly operations.
    Type: Grant
    Filed: January 28, 1988
    Date of Patent: February 28, 1989
    Assignee: Molex Incorporated
    Inventors: Akira Kanesige, Masashi Seto