Patents by Inventor Akira Katsumata

Akira Katsumata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060174013
    Abstract: In a data transfer method for transfer of data by a first information processing terminal device to a second information processing terminal device connected to the first information processing terminal device via a signal line, the first information processing terminal device calculates a maximum required time according to the amount of data for transfer and transfer performance information relating to the connection of the first information processing terminal device with the second information processing terminal device; upon initiating the data transfer processing, the first information processing terminal device continuously confirms that the data transfer processing is in state of execution from the time of initiation of the data transfer processing until the maximum required time has elapsed; and if, when the maximum required time has elapsed, the data transfer processing initiated is confirmed to be continuing, the first information processing terminal device forcibly ends the data transfer processing
    Type: Application
    Filed: September 28, 2005
    Publication date: August 3, 2006
    Applicant: Fujitsu Limited
    Inventors: Akira Katsumata, Masaki Okuda
  • Patent number: 7025623
    Abstract: An adapter for a memory card having a frame metal fitting to which an end portion of the card is inserted, whereby the card is detachably fitted, and a resin-molded body core assembled in the frame metal fitting by insertion, wherein an entire thickness of the adapter being approx. the same as that of the card, the frame metal fitting having a pair of holding portions in an approx. C shape in both end portions on the side of the card attached to hold both sides of the card, a hook portion between a pair of the holding portions being detachably engaged with the end portion of the card by spring force to prevent the card from coming off, a caulking projection fixing the core by caulking to the core, and an insulative coating film formed on the outer surface of the frame metal fitting.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: April 11, 2006
    Assignees: Sanwa Denki Kogyo Co., Ltd., Renesas Technology Corp.
    Inventors: Akira Katsumata, Hirotaka Nishizawa, Kenji Osawa
  • Patent number: 6875631
    Abstract: A CF card (1) comprises: a casing constituted by two panel plates (2, 2) and a frame (3); and a printed wiring board (4) accommodated in the casing. A plurality of claw-like engaging parts (5) are provided to the peripheries of the panel plates (2). When the CF card (1) is assembled, the engaging parts (5) of the first panel plate (2) are inserted into through holes of a long groove (8) provided in the frame (3) and then the printed wiring board (4) is mounted on the panel plate (2) located at the inside of the frame (3). Thereafter, the engaging parts (5) of the second panel plate (2) are inserted into the through holes of the long groove (8) from the surface located in the opposite side of the frame (3). There are two types of engaging parts (5): one having lances and the other having holes. Inside the through holes, the lances of the engaging parts (5) of one panel plate (2) are inserted into the holes of the engaging parts (5) of the other panel plate (2).
    Type: Grant
    Filed: February 10, 2003
    Date of Patent: April 5, 2005
    Assignees: Renesas Technology Corp., Hitachi ULSI Systems Co., Ltd., Sanwa Denki Kogyo Co., Ltd.
    Inventors: Hirotaka Nishizawa, Hideki Tanaka, Yuichiro Yamada, Tomoaki Kudaishi, Akira Katsumata
  • Publication number: 20040235353
    Abstract: An adapter for a memory card having a frame metal fitting to which an end portion of the card is inserted, whereby the card is detachably fitted, and a resin-molded body core assembled in the frame metal fitting by insertion, wherein an entire thickness of the adapter being approx. the same as that of the card, the frame metal fitting having a pair of holding portions in an approx. C shape in both end portions on the side of the card attached to hold both sides of the card, a hook portion between a pair of the holding portions being detachably engaged with the end portion of the card by spring force to prevent the card from coming off, a caulking projection fixing the core by caulking to the core, and an insulative coating film formed on the outer surface of the frame metal fitting.
    Type: Application
    Filed: March 31, 2004
    Publication date: November 25, 2004
    Inventors: Akira Katsumata, Hirotaka Nishizawa, Kenji Osawa
  • Patent number: 6759754
    Abstract: A CF card (1) comprises: a casing constituted by two panel plates (2, 2) and a frame (3); and a printed wiring board (4) accommodated in the casing. A plurality of claw-like engaging parts (5) are provided to the peripheries of the panel plates (2). When the CF card (1) is assembled, the engaging parts (5) of the first panel plate (2) are inserted into through holes of a long groove (8) provided in the frame (3) and then the printed wiring board (4) is mounted on the panel plate (2) located at the inside of the frame (3). Thereafter, the engaging parts (5) of the second panel plate (2) are inserted into the through holes of the long groove (8) from the surface located in the opposite side of the frame (3). There are two types of engaging parts (5): one having lances and the other having holes. Inside the through holes, the lances of the engaging parts (5) of one panel plate (2) are inserted into the holes of the engaging parts (5) of the other panel plate (2).
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: July 6, 2004
    Assignees: Renesas Technology Corp., Hitachi ULSI Systems Co., Ltd., Sanwa Denki Kogyo Co., Ltd.
    Inventors: Hirotaka Nishizawa, Hideki Tanaka, Yuichiro Yamada, Tomoaki Kudaishi, Akira Katsumata
  • Publication number: 20030115748
    Abstract: A CF card (1) comprises: a casing constituted by two panel plates (2, 2) and a frame (3); and a printed wiring board (4) accommodated in the casing. A plurality of claw-like engaging parts (5) are provided to the peripheries of the panel plates (2). When the CF card (1) is assembled, the engaging parts (5) of the first panel plate (2) are inserted into through holes of a long groove (8) provided in the frame (3) and then the printed wiring board (4) is mounted on the panel plate (2) located at the inside of the frame (3). Thereafter, the engaging parts (5) of the second panel plate (2) are inserted into the through holes of the long groove (8) from the surface located in the opposite side of the frame (3). There are two types of engaging parts (5): one having lances and the other having holes. Inside the through holes, the lances of the engaging parts (5) of one panel plate (2) are inserted into the holes of the engaging parts (5) of the other panel plate (2).
    Type: Application
    Filed: February 10, 2003
    Publication date: June 26, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Hirotaka Nishizawa, Hideki Tanaka, Yuichiro Yamada, Tomoaki Kudaishi, Akira Katsumata
  • Patent number: 6117183
    Abstract: Disclosed is an interactive CAD apparatus for logic circuit packaging design, wherein provisions are made to display delay times in real time when a component is being moved, so that error-contributing components and interconnections can be easily identified and the optimum position can be easily determined.
    Type: Grant
    Filed: August 26, 1997
    Date of Patent: September 12, 2000
    Assignee: Fujitsu Limited
    Inventors: Mieko Teranishi, Yoshiyuki Iwakura, Masaharu Nishimura, Akira Katsumata, Masato Ariyama
  • Patent number: 5729467
    Abstract: A routing preprocessing unit properly rearranges routing conditions beforehand with respect to parts in which physical conditions in terms of assembling or packaging in an original circuit are changeable. A feedback section feeds pin assignment data back to an assembling or a packaging design system for high-order hierarchy parts in the original circuit and thus changes a pin assignment through a design of the high-order hierarchy parts themselves. An automatic routing unit specifically designs high-density wiring patterns without using a via. A routing layer allocating section collects part-to-part route bundles bearing such a positional relationship as to cause no intersection and no overlap on the basis of routing data and allocates the route bundle to the same routing layer on a multilayer routing board including a plurality of routing layers. A routing order determining section determines a routing order of the route bundle.
    Type: Grant
    Filed: May 15, 1995
    Date of Patent: March 17, 1998
    Assignee: Fujitsu Limited
    Inventors: Akira Katsumata, Toshiyasu Sakata
  • Patent number: 5644500
    Abstract: This invention is directed to a method and apparatus to find out an optimum solution in automatic routing or automatic placement with certainty and at a high-speed to improve a routing rate, and to realize automatic routing in a high-density. To these end, a routing approach is selected in a conversational mode while routing efficiency is consulted to compose routing processing procedure so as to generate a routing program. Besides, component placement processing procedures designated according to placement control information are combined to generate the placement program. A straight line between component pins adjacent to each other is defined as a chord, a wave for maze method routing is generated from a start point toward an end point of a routing path and propagated between the chords adjacent to each other.
    Type: Grant
    Filed: July 1, 1996
    Date of Patent: July 1, 1997
    Assignee: Fujitsu Limited
    Inventors: Hiroshi Miura, Masato Ariyama, Kazuyuki Iida, Kazufumi Iwahara, Mitsunobu Okano, Hiroyuki Orihara, Akira Katsumata, Toshiyasu Sakata, Masaharu Nishimura, Hirofumi Hamamura, Naoki Murakami, Mitsuru Yasuda, Yasuhiro Yamashita, Ryouji Yamada, Atsushi Yamane
  • Patent number: 5507651
    Abstract: A film circuit connector in which respective conductive tracks in film contact areas on front, mating faces are pressed together into electrical connection between side walls of a metal channel-section receptacle spring and a compressible elastomeric plug spring which engage respective rear faces of the films, the compressible plug spring providing a counter-force to the receptacle spring force, accommodating any variations in receptacle spring force arising longitudinally thereof, ensuring constant contact force between all tracks. Tabs for anchoring and grounding the receptacle spring to the circuit board are struck out and bent down from opposite walls of the receptacle spring, enabling electrical shielding of contact areas. Linking portions of conductive tracks connecting the mating contact portions on the front face of the film to board connecting portions, are formed on the rear face of the film for electrical and mechanical protection and may be insulated on all sides.
    Type: Grant
    Filed: August 1, 1994
    Date of Patent: April 16, 1996
    Assignee: Kel Corporation
    Inventors: Mitsuho Tanaka, Akira Katsumata, Hiroshi Arisaka
  • Patent number: 5316486
    Abstract: A film circuit connector in which respective conductive tracks in film contact areas on front, mating faces are pressed together into electrical connection between side walls of a metal channel-section receptacle spring and a compressible elastomeric plug spring which engage respective rear faces of the films, the compressible plug spring providing a counter-force to the receptacle spring force, accommodating any variations in receptacle spring force arising longitudinally thereof, ensuring constant contact force between all tracks. Tabs for anchoring and grounding the receptacle spring to the circuit board are struck out and bent down from opposite walls of the receptacle spring, enabling electrical shielding of contact areas. Linking portions of conductive tracks connecting the mating contact portions on the front face of the film to board connecting portions, are formed on the rear face of the film for electrical and mechanical protection and may be insulated on all sides.
    Type: Grant
    Filed: June 16, 1992
    Date of Patent: May 31, 1994
    Assignee: KEL Corporation
    Inventors: Mitsuho Tanaka, Akira Katsumata, Hiroshi Arisaka
  • Patent number: 5216583
    Abstract: A device for mounting a flat package on a circuit board, comprises a rectangular base frame attached to the circuit board, a rectangular clamping frame and a cover frame for releasable locking engagement with the base frame for retaining the clamping frame in pressing engagement with a flat package mounted on the circuit board within the base frame. The clamping frame has recesses formed in respective corners and lands forming stop surfaces with elastic strip locating grooves formed on opposite sides thereof. Further elastic strip locating grooves and elastic strip anchoring grooves of constricted cross-sectional size, extend along a lower, clamping face and on the undersides of the lugs. The base frame has contact guiding wall surfaces extending downwardly and inwardly from respective corners thereof for retaining the flat package contacts in precise alignment with respect pads of the circuit board.
    Type: Grant
    Filed: July 16, 1991
    Date of Patent: June 1, 1993
    Assignee: Kel Corporation
    Inventor: Akira Katsumata
  • Patent number: 5156553
    Abstract: A film circuit connector assembly comprises matable housing assemblies each including an outer insulating housing receiving a film circuit supporting member carrying a film circuit with a mating contact area therein extending away from a mating face along a film circuit supporting wall with a circuit board engaging area of the film circuit extending out from a base of the housing assembly. A cylindrical spring is mounted in a recess extending along at least one film supporting wall in engagement with a rear face of a contact area pressing the contact areas of the mating connectors together. In one example, the housing assembly clamps free ends of the film circuit conductors in resiliently deformed condition into engagement with the circuit board.
    Type: Grant
    Filed: April 22, 1991
    Date of Patent: October 20, 1992
    Assignee: Kel Corporation
    Inventors: Akira Katsumata, Hiroshi Arisaka
  • Patent number: 5096440
    Abstract: Respective opposite ends of an insulating housing body of a surface mount connector are integrally formed with pairs of opposed, resilient, L-shaped arms, aligned with respective recesses extending under a board engaging face and embracing respective anchoring portions of respective retaining plates with a solder tab of each retaining plate received in a respective recess. Free ends of the arms extend towards each other in spaced apart relation defining between them an inspection window through which a reflow solder join between the solder tab and a dummy pad on the circuit board can be seen and checked from above the board.
    Type: Grant
    Filed: May 10, 1991
    Date of Patent: March 17, 1992
    Assignee: Kel Corporation
    Inventor: Akira Katsumata
  • Patent number: 4531792
    Abstract: In an IC connector for connecting lead terminals of an IC package of the dual in-line type to terminals of a circuit board, first grooves and first projections are formed on two surfaces of a slide body. The main body has two walls each of which has a surface which has a plurality of second grooves and which opposes at least one surface of the slide body. One end of each connecting terminal is inserted in each second groove. The other end of each connecting terminal extends through each second groove to be connected to a predetermined terminal of the circuit board. The slide body is supported by a supporting means such that the slide body may be movable between a first position and a second position along the direction of arrangement of the second grooves. When the slide body is in the first position, the first and second grooves define gaps therebetween into which or from which the lead terminals may be inserted or removed.
    Type: Grant
    Filed: January 19, 1983
    Date of Patent: July 30, 1985
    Assignee: Kel Corporation
    Inventors: Akiyoshi Oshitani, Akira Katsumata