Abstract: A manufacturing method of a semiconductor device includes: forming a plurality of element structures in a form of matrix on a first surface of a semiconductor wafer; forming a crack extending in a thickness direction of the semiconductor wafer along a boundary between the element structures adjacent to each other by pressing a pressing member against a second surface of the semiconductor wafer opposite to the first surface along the boundary; and dividing the semiconductor wafer along the boundary by pressing a dividing member against the semiconductor wafer on a first surface side along the boundary.

Abstract: A foam composite with a skin formed in one shot by charging plastic powders or minute particles together with polyolefin pellets that can be cross-linked and foamed in a mold, and heating the mold while rotating. The composite absorbs almost no moisture, having satisfactory strength, being excellent as an insulating material. Further, providing a covering of a non-foaming or a slightly foaming material to the pellet of polyolefin that can be cross-linked and foamed, and conducting the forming, foamed granules as a core, and a covering of a reinforcing member for the core.

Abstract: A foam composite with a skin formed in one shot by charging plastic powders or minute particles together with polyolefin pellets that can be cross-linked and foamed in a mold, and heating the mold while rotating. The composite absorbs almost no moisture, having satisfactory strength, being excellent as an insulating material. Further, providing a covering of a non-foaming or a slightly foaming material to the pellet of polyolefin that can be cross-linked and foamed, and conducting the forming, foamed granules as a core, and a covering of a reinforcing member for the core.

Abstract: Plastic foam has excellent heat insulation properties, however, moisture absorption is causing a decrease in the heat insulation, and plastic foam has almost no mechanical strength. Therefore, a heat insulation material that absorbs almost no moisture and has satisfactory strength is desired to appear. According to the present invention, a foam composite with a skin can be formed in one shot by charging plastic powders or minute particles together with polyolefin pellets that can be cross-linked and foamed in a mold, and heating the mold while rotating. The composite absorbs almost no moisture, having satisfactory strength, being excellent as an insulating material. Further, providing a covering of a non-foaming or a slightly foaming material to the pellet of polyolefin that can be cross-linked and foamed, and conducting the forming, foamed granules of preferably 5 to 50 mm largeness as a core, and a covering of a reinforcing member with 0.05 to 0.

Abstract: Plastic foam has excellent heat insulation properties, however, moisture absorption is causing a decrease in the heat insulation, and plastic foam has almost no mechanical strength. Therefore, a heat insulation material that absorbs almost no moisture and has satisfactory strength is desired to appear. According to the present invention, a foam composite with a skin can be formed in one shot by charging plastic powders or minute particles together with polyolefin pellets that can be cross-linked and foamed in a mold, and heating the mold while rotating. The composite absorbs almost no moisture, having satisfactory strength, being excellent as an insulating material. Further, providing a covering of a non-foaming or a slightly foaming material to the pellet of polyolefin that can be cross-linked and foamed, and conducting the forming, foamed granules of preferably 5 to 50 mm largeness as a core, and a covering of a reinforcing member with 0.05 to 0.