Patents by Inventor Akira Kitashima

Akira Kitashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laser bonding method and laser bonding device
    Patent number: 11413705
    Abstract: A resin pipe 30 and a resin member 31 are fixed to a setting portion 5 provided on the front side of a base 6, and a timing pulley 13 which is provided on the back side of the base 6 and to which a light emission unit 3 is attached is rotated. As a result, the light emission unit 3 applies laser light 20 to a junction 32 between the resin pipe 30 and the resin member 31 while revolving around the junction 32. This makes it easy to fuse and join the entire outer circumferential surface of the resin pipe 30 with the entire inner circumferential surface of the resin member 31, which are variously shaped and sized.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: August 16, 2022
    Assignee: NICHIRIN CO., LTD.
    Inventors: Akira Kitashima, Takao Maeda
  • LASER BONDING METHOD AND LASER BONDING DEVICE
    Publication number: 20220040794
    Abstract: A resin pipe 30 and a resin member 31 are fixed to a setting portion 5 provided on the front side of a base 6, and a timing pulley 13 which is provided on the back side of the base 6 and to which a light emission unit 3 is attached is rotated. As a result, the light emission unit 3 applies laser light 20 to a junction 32 between the resin pipe 30 and the resin member 31 while revolving around the junction 32. This makes it easy to fuse and join the entire outer circumferential surface of the resin pipe 30 with the entire inner circumferential surface of the resin member 31, which are variously shaped and sized.
    Type: Application
    Filed: February 21, 2020
    Publication date: February 10, 2022
    Applicant: NICHIRIN CO., LTD.
    Inventors: Akira Kitashima, Takao Maeda