Abstract: A carrier is carried between a receiving stage (21) (or a delivery stage (22)) by a movable table (24). Each of the stages is provided with a cut-away area (30) extending from one end of the stage to a predetermined position at which the carrier is placed on the stage and allowing the movable table (24) to move vertically therethrough. The movable table (24) is moved under the stage to a position directly below the carrier mounted on the stage, is raised through the cut-away area (30) to lift up the carrier, and is moved away from the stage together with the carrier. A sensing device (10) incorporated into the movable table (24) inspects the condition of wafers contained in the carrier while the movable table (24) is being moved to the position directly below the carrier placed on the stage.

Abstract: A substrate arraying method, a substrate arraying device and a small-sized processing apparatus commonly includes a step of taking 26 sheets of wafers W out of one carrier C at regular intervals of L, a step of taking 26 sheets of wafers W out of another carrier C at regular intervals of L and a step of respectively inserting the 26 sheets of wafers W taken out of the latter carrier C between the 26 sheets of wafers W taken out of the former carrier C to form a group of wafers 100 where 52 sheets of wafers W are arranged at regular intervals of L/2 which is substantially half of the intervals of L. Consequently, it is possible to complete the stable formation of substrates group in a short time.

Abstract: A substrate transporting device and method 19 transports a plurality of wafers W standing upright in a row, from a previous process, i.e., a cleaning process. A substrate holder 40 is carried by a transporting device 50 arranged outside a drying chamber 20. The substrate holder 40 receives the wafers W from the substrate transporting device 19 while maintaining a posture of the wafers W. The transporting device 50 lowers the substrate holder 40 and sequentially moves it into the drying chamber 20 through an unloading and loading port 21 above the drying chamber 20. Thereafter, the substrate holder 40 is fixed to a rotor 30. After closing the unloading and loading port 21 with a lid body 25, the rotor 30 is rotated. In this way, moisture sticking to surfaces of the wafers W is eliminated.

Abstract: A substrate transporting and processing system generally comprises: a supply section of a carrier 1 for housing therein wafers W to be processed, in a horizontal state; a discharge section of the carrier 1; a wafer unloading arm 14 for unloading the wafers W from said carrier 1; a wafer loading arm 16 for loading the wafers W into the carrier 1; an attitude changing unit 40 for changing the attitude of the wafers W between a horizontal state and a vertical state; a processing section 3 for suitably processing the wafers W; and a wafer transport arm 56 for delivering the wafers W between the attitude changing unit 40 and the processing section 3 and for transporting the wafers W into and from the processing section.