Patents by Inventor Akira Mita

Akira Mita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9130253
    Abstract: A waveguide includes a waveguide body which is hollow inside and made from a shape-retentive material, and a conductive inner coating layer which is electrically conductive and provided on an inner surface of the waveguide body. The waveguide uses an inner space of the conductive inner coating layer as a transmission path to transmit electromagnetic waves as signals. Two electric wires provided along the outer surface of the waveguide body serve respectively as a power line and a ground line to transmit electric power.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: September 8, 2015
    Assignee: YAZAKI CORPORATION
    Inventors: Akira Mita, Masaaki Okada, Takuo Matsumoto, Takashi Gohara
  • Patent number: 8642572
    Abstract: A method for administering ECyd to a patient that realizes a continuous therapy without expressing peripheral neurotoxicity caused by ECyd and that exhibits an excellent therapeutic effect and prolongs patient survival. An antitumor agent containing ECyd or a salt thereof and a method of administering it to a cancer patient through continuous intravenous administration at a dose of 1.30 to 8.56 mg/m2 in terms of ECyd, for each administration period of 2 to 336 hours.
    Type: Grant
    Filed: April 4, 2008
    Date of Patent: February 4, 2014
    Assignee: Taiho Pharmaceutical Co., Ltd.
    Inventors: Hiromi Kazuno, Katsuhisa Koizumi, Akira Mita
  • Publication number: 20130307645
    Abstract: A waveguide includes a waveguide body which is hollow inside and made from a shape-retentive material, and a conductive inner coating layer which is electrically conductive and provided on an inner surface of the waveguide body. The waveguide uses an inner space of the conductive inner coating layer as a transmission path to transmit electromagnetic waves as signals. Two electric wires provided along the outer surface of the waveguide body serve respectively as a power line and a ground line to transmit electric power.
    Type: Application
    Filed: May 17, 2013
    Publication date: November 21, 2013
    Applicant: YAZAKI CORPORATION
    Inventors: Akira MITA, Masaaki OKADA, Takuo MATSUMOTO, Takashi GOHARA
  • Patent number: 7799783
    Abstract: The present invention relates to a method for treating a cancer comprising orally administering a composition containing ?,?,?-trifluorothymidine (FTD) and 5-chloro-6-(1-(2-iminopyrrolidinyl)methyl)uracil hydrochloride in a molar ratio of 1:0.5 at a dose of 20 to 80 mg/m2/day in terms of FTD in 2 to 4 divided portions per to patients in need of the treatment.
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: September 21, 2010
    Assignee: Taiho Pharmaceutical Co., Ltd.
    Inventors: Tomohiro Emura, Akira Mita
  • Publication number: 20100120709
    Abstract: To provide a method for administering ECyd to a patient, which realizes a continuous therapy without expressing peripheral neurotoxicity caused by ECyd and which exhibits an excellent therapeutic effect with ensuring prolongation of the survival of the patient. The invention provides an antitumor agent containing ECyd or a salt thereof, which is administered to a cancer patient through continuous intravenous administration at a dose of 1.30 to 8.56 mg/m2 as reduced to ECyd, for each administration period of 2 to 336 hours.
    Type: Application
    Filed: April 4, 2008
    Publication date: May 13, 2010
    Applicant: TAIHO PHARMACEUTICAL CO., LTD.
    Inventors: Hiromi Kazuno, Katsuhisa Koizumi, Akira Mita
  • Publication number: 20060167031
    Abstract: The present invention relates to a method for treating a cancer comprising orally administering a composition containing ?,?,?-trifluorothymidine (FTD) and 5-chloro-6-(1-(2-iminopyrrolidinyl)methyl)uracil hydrochloride in a molar ratio of 1:0.5 at a dose of 20 to 80 mg/m2/day in terms of FTD in 2 to 4 divided portions per to patients in need of the treatment.
    Type: Application
    Filed: January 26, 2005
    Publication date: July 27, 2006
    Applicant: TAIHO PHARMACEUTICAL CO., LTD.
    Inventors: Tomohiro Emura, Akira Mita
  • Patent number: 6984787
    Abstract: In a shield-processing structure of a shielded cable 1, the shielded cable 1 and an earth cable 2 are held between two resin members 3 and 3, and ultrasonic vibration is applied to the resin members 3 and 3 while exerting a compressive force between the resin members 3 and 3, thereby forming a shield-processed portion. A shielded cable-receiving groove 15 and an earth cable-receiving groove 16 are formed in a joint surface 3a of each of the resin members 3 and 3, and earth cable-holding projections 17 are formed on each of the joint surfaces 3a, and is disposed adjacent to the shielded cable-receiving groove 15, and projects into the earth cable-receiving groove 16. Opposite end portions 17a and 17a of a distal end surface of each of the earth cable-holding projections 17 are higher than a central portion 17b thereof.
    Type: Grant
    Filed: July 12, 2004
    Date of Patent: January 10, 2006
    Assignee: Yazaki Corporation
    Inventors: Akira Mita, Tetsuro Ide
  • Patent number: 6940020
    Abstract: In a shielded structure of a flat shielding electric wire, the flat shielding electric wire includes a plurality of shielding cores, an inner insulating sheathe covering each of the plurality of shielding cores, a conductive covering member covering the inner insulating sheathes, and a first outer insulating sheathe covering the conductive covering member. A pair of resin members sandwiches the flat shielding electric wire therebetween. A coating electric wire is provided between the flat shielding electric wire and one of the pair of resin members. The coating electric wire includes a conductive wire and a second outer insulating sheathe covering the conductive wire. The first outer insulating sheathe and the second outer insulating sheathe are fused by ultrasonic excitation so that the conductive wire is electrically connected to a part of the conductive covering member.
    Type: Grant
    Filed: April 24, 2002
    Date of Patent: September 6, 2005
    Assignee: Yazaki Corporation
    Inventors: Tetsuro Ide, Akira Mita
  • Patent number: 6881897
    Abstract: In a shielding structure of a shielding electric wire in which the shielding electric wire and a ground wire are interposed between two resin members, and a compressive force is caused to act on the resin members and an ultrasonic wave is simultaneously applied to fuse the resin portions, thereby forming a shielded portion, a protruded portion 20 is provided on one of junction faces of the two resin members and a hole 21 including a protrusion inserting portion 21a for inserting the protruded portion 20 and a resin inflow portion 21b provided in an inner position from the protrusion inserting portion 21a and having a smaller width than a width of the protrusion inserting portion 21a is provided on the other junction face, and step faces at both sides on a boundary between the protrusion inserting portion 21a and the resin inflow portion 21b in the hole 21 are formed to be a pair of inclined faces 21c and 21c.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: April 19, 2005
    Assignee: Yazaki Corporation
    Inventors: Akira Mita, Tetsuro Ide
  • Publication number: 20050056452
    Abstract: In a shield-processing structure of a shielded cable 1, the shielded cable 1 and an earth cable 2 are held between two resin members 3 and 3, and ultrasonic vibration is applied to the resin members 3 and 3 while exerting a compressive force between the resin members 3 and 3, thereby forming a shield-processed portion. A shielded cable-receiving groove 15 and an earth cable-receiving groove 16 are formed in a joint surface 3a of each of the resin members 3 and 3, and earth cable-holding projections 17 are formed on each of the joint surfaces 3a, and is disposed adjacent to the shielded cable-receiving groove 15, and projects into the earth cable-receiving groove 16. Opposite end portions 17a and 17a of a distal end surface of each of the earth cable-holding projections 17 are higher than a central portion 17b thereof.
    Type: Application
    Filed: July 12, 2004
    Publication date: March 17, 2005
    Inventors: Akira Mita, Tetsuro Ide
  • Patent number: 6844499
    Abstract: A connecting method of connecting covered wires with each other and recessed resinous tips used in the method are provided. In the method, it is executed at the first step to put a connecting part constituted by a shield wire and a ground wire between a first resin tip and a second resin tip. The first resin tips has, around the connecting part, first recessed parts for accommodating the molten cover of the shield wire and second recessed parts for accommodating the molten cover of the ground wire. The second resin tip has second recessed parts formed for accommodating the molten cover of the ground wire.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: January 18, 2005
    Assignee: Yazaki Corporation
    Inventors: Tetsuro Ide, Akira Mita
  • Publication number: 20050006128
    Abstract: In a shielding structure of a shielding electric wire in which the shielding electric wire and a ground wire are interposed between two resin members, and a compressive force is caused to act on the resin members and an ultrasonic wave is simultaneously applied to fuse the resin portions, thereby forming a shielded portion, a protruded portion 20 is provided on one of junction faces of the two resin members and a hole 21 including a protrusion inserting portion 21a for inserting the protruded portion 20 and a resin inflow portion 21b provided in an inner position from the protrusion inserting portion 21a and having a smaller width than a width of the protrusion inserting portion 21a is provided on the other junction face, and step faces at both sides on a boundary between the protrusion inserting portion 21a and the resin inflow portion 21b in the hole 21 are formed to be a pair of inclined faces 21c and 21c.
    Type: Application
    Filed: July 9, 2004
    Publication date: January 13, 2005
    Inventors: Akira Mita, Tetsuro Ide
  • Patent number: 6831230
    Abstract: The shield processing structure for a flat shielded cable includes: a flat shielded cable including two shielded cores, a drain wire, an aluminum foil shield member for covering the two shielded cores and the drain wire, and an insulating outer jacket for covering the aluminum foil shield member; and resin members for clamping the flat shielded cable with joining surfaces. The flat shielded cable is clamped between the pair of resin members, and a grounding wire is interposed between the flat shielded cable and the resin member. In this state, ultrasonic vibration are applied across the pair of resin members, whereby at least insulating outer jackets are melted and scattered, and a conductor of the grounding wire, on the one hand, and the grounding wire-use contact portion of aluminum foil shield member and the drain wire are brought into contact with each other.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: December 14, 2004
    Assignee: Yazaki Corporation
    Inventors: Tetsuro Ide, Akira Mita
  • Patent number: 6674007
    Abstract: A plurality of shielded core wires has a first diameter. A conductive cover member covers the shielded core wires. A first insulating sheath covers the conductive cover member. A pair of resin members, each formed with a groove having a semi-ellipsoidal shape are thermally integrated with each other for forming an ellipsoidal through hole while accommodating the first insulating sheath therein. A major axis length of a cross section of the ellipsoidal through hole is substantially identical with a length obtained by adding each first diameter, twice a thickness of the conductive cover member and twice a thickness of the first insulating sheath. A minor axis length of a cross section of the ellipsoidal through hole is substantially identical with by adding the first diameter, twice the thickness of the conductive cover member and twice the thickness of the first insulating sheath.
    Type: Grant
    Filed: April 24, 2002
    Date of Patent: January 6, 2004
    Assignee: Yazaki Corporation
    Inventors: Tetsuro Ide, Akira Mita, Nobuyuki Asakura
  • Patent number: 6657126
    Abstract: In at least one shielded core wire, a first conductive core wire is covered with a first insulating sheath. A conductive foil covers the at least one shielded core wire. A second insulating sheath covers the conductive foil. In a branch wire, a second conductive core wire is covered with a third insulating sheath. A part of the second insulating sheath and a part of the third insulating sheath are thermally fused so that the conductive foil and the second conductive core wire are electrically connected.
    Type: Grant
    Filed: April 24, 2002
    Date of Patent: December 2, 2003
    Assignee: Yazaki Corporation
    Inventors: Tetsuro Ide, Akira Mita, Nobuyuki Asakura
  • Publication number: 20030213610
    Abstract: The shield processing structure for a flat shielded cable includes: a flat shielded cable including two shielded cores, a drain wire, an aluminum foil shield member for covering the two shielded cores and the drain wire, and an insulating outer jacket for covering the aluminum foil shield member; and resin members for clamping the flat shielded cable with joining surfaces. The flat shielded cable is clamped between the pair of resin members, and a grounding wire is interposed between the flat shielded cable and the resin member. In this state, ultrasonic vibration are applied across the pair of resin members, whereby at least insulating outer jackets are melted and scattered, and a conductor of the grounding wire, on the one hand, and the grounding wire-use contact portion of aluminum foil shield member and the drain wire are brought into contact with each other.
    Type: Application
    Filed: June 10, 2003
    Publication date: November 20, 2003
    Applicant: YAZAKI CORPORATION
    Inventors: Tetsuro Ide, Akira Mita
  • Patent number: 6598293
    Abstract: A connecting method of connecting covered wires with each other and recessed resinous tips used in the method are provided. In the method, it is executed at the first step to put a connecting part constituted by a shield wire and a ground wire between a first resin tip and a second resin tip. The first resin tip has, around the connecting part, first recessed parts for accommodating the molten cover of the shield wire and second recessed parts for accommodating the molten cover of the ground wire. The second resin tip has second recessed parts formed for accommodating the molten cover of the ground wire.
    Type: Grant
    Filed: June 22, 2000
    Date of Patent: July 29, 2003
    Assignee: Yazaki Corporation
    Inventors: Tetsuro Ide, Akira Mita
  • Publication number: 20030102145
    Abstract: A connecting method of connecting covered wires with each other and recessed resinous tips used in the method are provided. In the method, it is executed at the first step to put a connecting part constituted by a shield wire W1 and a ground wire W2 between a first resin tip 31 and a second resin tip 41. The upper resin tips 31 has, around the connecting part, first recessed parts 39a, 39b for accommodating the molten cover 7a of the shield wire W1 and second recessed parts 37a, 37b for accommodating the molten cover 9a of the ground wire W2. While, the lower resin tip 41 has second recessed parts 47a, 47b formed for accommodating the molten cover 9a of the ground wire W2.
    Type: Application
    Filed: January 16, 2003
    Publication date: June 5, 2003
    Applicant: Yazaki Corporation
    Inventors: Tetsuro Ide, Akira Mita
  • Publication number: 20030098173
    Abstract: The shield processing structure for a flat shielded cable includes: a flat shielded cable including two shielded cores, a drain wire, an aluminum foil shield member for covering the two shielded cores and the drain wire, and an insulating outer jacket for covering the aluminum foil shield member; and resin members for clamping the flat shielded cable with joining surfaces. The flat shielded cable is clamped between the pair of resin members, and a grounding wire is interposed between the flat shielded cable and the resin member. In this state, ultrasonic vibration are applied across the pair of resin members, whereby at least insulating outer jackets are melted and scattered, and a conductor of the grounding wire, on the one hand, and the grounding wire-use contact portion of aluminum foil shield member and the drain wire are brought into contact with each other.
    Type: Application
    Filed: November 22, 2002
    Publication date: May 29, 2003
    Applicant: YAZAKI CORPORATION
    Inventors: Tetsuro Ide, Akira Mita
  • Patent number: RE46284
    Abstract: The present invention relates to a method for treating a cancer comprising orally administering a composition containing ?,?,?-trifluorothymidine (FTD) and 5-chloro-6-(1-(2-iminopyrrolidinyl)methyl)uracil hydrochloride in a molar ratio of 1:0.5 at a dose of 20 to 80 mg/m2/day in terms of FTD in 2 to 4 divided portions per to patients in need of the treatment.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: January 24, 2017
    Assignee: TAIHO PHARMACEUTICAL CO., LTD.
    Inventors: Tomohiro Emura, Akira Mita