Patents by Inventor Akira Miyama

Akira Miyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978357
    Abstract: Disclosed is an ulcer model used to practice a procedure including hemorrhage arrest, the ulcer model including a model main body which includes upper and lower surfaces facing each other and a tubular simulated blood vessel path provided between the upper surface and the lower surface and having an inlet opening and an outlet opening. The upper surface includes a ring-shaped raised surface that rises in a thickness direction of the model main body and a simulated ulcer surface that is a recessed bottom surface surrounded by the raised surface. The simulated blood vessel path extends from a part other than the upper surface of the surfaces of the model main body to the simulated ulcer surface or an area in the vicinity of the inside thereof.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: May 7, 2024
    Assignees: Denka Company Limited, Tohoku University
    Inventors: Akira Miyama, Toru Arai, Takashi Sasaki, Takeshi Kanno, Yularo Arata, Atsushi Masamune
  • Patent number: 11965096
    Abstract: [Problem] To provide a resin composition that can lead to a biological model, which has a softness and provides a sensation of needle insertion close to those of human blood vessels and/or skin, and a biological model using the same. [Solution] A resin composition containing, with respect to 100 parts by mass of a component (A) hydrogenated block copolymer having a MFR (temperature 230° C., load 2.16 kg) of 1 g/10 min or less: 350 parts by mass or more and 1000 parts by mass or less of a component (B) oil; and 0.01 parts by mass or more and less than 150 parts by mass of a component (C) lubricant. The component (B) oil preferably has a kinematic viscosity of 0.1-100 mm2/s at 37.8° C. or 40° C.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: April 23, 2024
    Assignee: DENKA COMPANY LIMITED
    Inventors: Akira Miyama, Mutsumi Matsumoto
  • Publication number: 20220392373
    Abstract: A mucosal tissue model which, by being provided with a simulated blood vessel and/or a pseudo abdominal cavity layer, reproduces hemorrhages and/or perforations that become problems in actual resections and dissections better than conventional organ models.
    Type: Application
    Filed: December 22, 2020
    Publication date: December 8, 2022
    Applicants: DENKA COMPANY LIMITED, TOHOKU UNIVERSITY
    Inventors: Mutsumi MATSUMOTO, Akira MIYAMA, Takeshi KANNO, Yutaro ARATA, Atsushi MASAMUNE
  • Patent number: 11472955
    Abstract: [Problem] To provide a softer resin material that can be highly filled with an oil and that has almost no seepage (bleed-out) of oil. Additionally, to provide a biological model that is easy to handle and that has a softness and mechanical properties closer to those of organs and a texture close to that of organs. [Solution] A resin composition containing 100 parts by mass of component (A), a hydrogenated block copolymer having an MFR (measured at a temperature of 230° C. and with a load of 2.16 kg) of 1 g/10 min or less; more than 1000 parts by mass and at most 2000 parts by mass of component (B), an oil; and at least 10 parts by mass and at most 120 parts by mass of component (C), a polyolefin resin having a specific surface area of 0.01 to 30 m2/g.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: October 18, 2022
    Assignee: Denka Company Limited
    Inventors: Takashi Sasaki, Akira Miyama, Toru Arai
  • Publication number: 20210340378
    Abstract: [Problem] To provide a resin composition that can lead to a biological model, which has a softness and provides a sensation of needle insertion close to those of human blood vessels and/or skin, and a biological model using the same. [Solution] A resin composition containing, with respect to 100 parts by mass of a component (A) hydrogenated block copolymer having a MFR (temperature 230° C., load 2.16 kg) of 1 g/10 min or less: 350 parts by mass or more and 1000 parts by mass or less of a component (B) oil; and 0.01 parts by mass or more and less than 150 parts by mass of a component (C) lubricant. The component (B) oil preferably has a kinematic viscosity of 0.1-100 mm2/s at 37.8° C. or 40° C.
    Type: Application
    Filed: October 25, 2019
    Publication date: November 4, 2021
    Inventors: Akira MIYAMA, Mutsumi MATSUMOTO
  • Publication number: 20210330865
    Abstract: An artificial blood vessel that gives a sensation of needle insertion upon puncturing and a needle thread passability resembling those of blood vessels of animals including humans, and that has high liquid leakage preventability includes two or more layers which contain a component (A) hydrogenated block copolymer and a component (B) oil, at least one of the layers further containing a component (C) lubricant. It is preferable that the artificial blood vessel has a first peak load value of 0.01 N or more and 1.2 N or less upon needle penetration by puncturing at a speed of 1000 mm/min. under the condition of 23° C.±1° C. using a universal testing machine.
    Type: Application
    Filed: October 25, 2019
    Publication date: October 28, 2021
    Applicant: DENKA COMPANY LIMITED
    Inventors: Akira MIYAMA, Mutsumi MATSUMOTO
  • Publication number: 20210246314
    Abstract: [Problem] To provide electroconductive resin compositions that accommodate energy devices and have excellent preservability, and molded articles thereof. [Solution] An electroconductive resin composition and a molded article thereof, the composition containing components: (A) a hydrogenated styrene-based thermoplastic elastomer having an MFR (measured at a temperature of 230° C. and a load of 2.16 kg) of 1 g/10 min or less, at 100 parts by mass; and (B) an oil at 100-1,000 parts by mass; the composition further containing components: (C) a copolymer of a hydrophobic polymer and a hydrophilic polymer, the copolymer having an MFR (measured at 190° C. and a load of 2.16 kg) of 8 g/10 min or more; and (D) an ionic liquid.
    Type: Application
    Filed: August 29, 2019
    Publication date: August 12, 2021
    Inventors: Mutsumi MATSUMOTO, Akira MIYAMA
  • Patent number: 10836897
    Abstract: [Problem] To provide a thermoplastic resin composition for use in an organ model, wherein said composition has a softness closer to that of an organ, a high mechanical strength, and a texture close to an organ, exhibits excellent durability, and can be handled easily. [Solution] A resin composition for an organ model, said composition containing, as component (A), 100 parts by mass of a hydrogenated block copolymer having an MFR (measured at a temperature of 230° C. and a load of 2.16 kg) of 1 g/10 min. or less, and an oil as component (B). Moreover, the composition may also contain a cross copolymer as component (C), a polypropylene resin as component (D), and a filler as component (E).
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: November 17, 2020
    Assignee: DENKA COMPANY LIMITED
    Inventors: Akira Miyama, Yoshihiko Tsujimura, Toru Arai
  • Publication number: 20200160751
    Abstract: Disclosed is an ulcer model used to practice a procedure including hemorrhage arrest, the ulcer model including a model main body which includes upper and lower surfaces facing each other and a tubular simulated blood vessel path provided between the upper surface and the lower surface and having an inlet opening and an outlet opening. The upper surface includes a ring-shaped raised surface that rises in a thickness direction of the model main body and a simulated ulcer surface that is a recessed bottom surface surrounded by the raised surface. The simulated blood vessel path extends from a part other than the upper surface of the surfaces of the model main body to the simulated ulcer surface or an area in the vicinity of the inside thereof.
    Type: Application
    Filed: June 28, 2018
    Publication date: May 21, 2020
    Inventors: Akira MIYAMA, Toru ARAI, Takashi SASAKI
  • Patent number: 10629326
    Abstract: By using CNF excellent in dispersibility, conductivity, and crystallinity, a conductive polymer material having high conductivity even with a low CNF content and a shaped article thereof and a conductive polymer material with a less CNF content for same conductivity and a shaped article thereof are provided. A conductive polymer material with high conductivity is produced by using carbon nanofiber with a median diameter D50 value from 0.1 to 8 ?m, powder resistivity of 0.03 ?cm or less measured under a load of 9.8 MPa, and D/G from 0.5 to 1.3.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: April 21, 2020
    Assignee: Denka Company Limited
    Inventors: Hitoshi Kaneko, Toru Arai, Yoko Horikoshi, Ayumu Tsukamoto, Akira Miyama
  • Publication number: 20180244912
    Abstract: [Problem] To provide a thermoplastic resin composition for use in an organ model, wherein said composition has a softness closer to that of an organ, a high mechanical strength, and a texture close to an organ, exhibits excellent durability, and can be handled easily. [Solution] A resin composition for an organ model, said composition containing, as component (A), 100 parts by mass of a hydrogenated block copolymer having an MFR (measured at a temperature of 230° C. and a load of 2.16 kg) of 1 g/10 min. or less, and an oil as component (B). Moreover, the composition may also contain a cross copolymer as component (C), a polypropylene resin as component (D), and a filler as component (E).
    Type: Application
    Filed: August 17, 2016
    Publication date: August 30, 2018
    Inventors: Akira Miyama, Yoshihiko TSUJIMURA, Toru Arai
  • Publication number: 20170365372
    Abstract: By using CNF excellent in dispersibility, conductivity, and crystallinity, a conductive polymer material having high conductivity even with a low CNF content and a shaped article thereof and a conductive polymer material with a less CNF content for same conductivity and a shaped article thereof are provided. A conductive polymer material with high conductivity is produced by using carbon nanofiber with a median diameter D50 value from 0.1 to 8 ?m, powder resistivity of 0.03 ?cm or less measured under a load of 9.8 MPa, and D/G from 0.5 to 1.3.
    Type: Application
    Filed: August 6, 2015
    Publication date: December 21, 2017
    Applicant: Denka Company Limited
    Inventors: Hitoshi Kaneko, Toru Arai, Yoko Horikoshi, Ayumu Tsukamoto, Akira Miyama
  • Patent number: 8722831
    Abstract: To provide a novel cross copolymer and resin composition which are improved in heat resistance and compatibility over conventional ethylene/aromatic vinyl compound copolymers and which have low crystallinity, are excellent in softness, transparency and compatibility and show mechanical properties similar to soft vinyl chloride resins, as compared with conventional cross copolymers.
    Type: Grant
    Filed: May 29, 2007
    Date of Patent: May 13, 2014
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Toru Arai, Masaru Hasegawa, Ayumu Tsukamoto, Akira Miyama, Shigeru Suzuki
  • Patent number: 8461264
    Abstract: Disclosed is a thermoplastic resin composition comprising a cross-copolymer which meets specific requirements; and a polyphenylene ether resin, wherein the cross-copolymer is contained in an amount of 5 to 95 mass % and the polyphenylene ether resin is contained in an amount of 95 to 5 mass %. The thermoplastic resin composition has excellent heat resistant, excellent softness, excellent flexibility, excellent stretching properties, and excellent scratch-abrasion resistance.
    Type: Grant
    Filed: April 14, 2009
    Date of Patent: June 11, 2013
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Toru Arai, Masaru Hasegawa, Akira Miyama, Kunihiko Konishi, Shigeru Suzuki
  • Publication number: 20110040038
    Abstract: Disclosed is a thermoplastic resin composition comprising a cross-copolymer which meets specific requirements; and a polyphenylene ether resin, wherein the cross-copolymer is contained in an amount of 5 to 95 mass % and the polyphenylene ether resin is contained in an amount of 95 to 5 mass %. The thermoplastic resin composition has excellent heat resistant, excellent softness, excellent flexibility, excellent stretching properties, and excellent scratch-abrasion resistance.
    Type: Application
    Filed: April 14, 2009
    Publication date: February 17, 2011
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Toru Arai, Masaru Hasegawa, Akira Miyama, Kunihiko Konishi, Shigeru Suzuki
  • Publication number: 20090263604
    Abstract: To provide a novel cross copolymer and resin composition which are improved in heat resistance and compatibility over conventional ethylene/aromatic vinyl compound copolymers and which have low crystallinity, are excellent in softness, transparency and compatibility and show mechanical properties similar to soft vinyl chloride resins, as compared with conventional cross copolymers.
    Type: Application
    Filed: May 29, 2007
    Publication date: October 22, 2009
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Toru Arai, Masaru Hasegawa, Ayumu Tsukamoto, Akira Miyama, Shigeru Suzuki
  • Publication number: 20090202824
    Abstract: Provided are a tape substrate having excellent oil resistance as well as balanced properties of flexibility, a hand cutting property and heat resistance, and an adhesive tape using the tape substrate. The tape substrate contains an ethylene-aromatic vinyl compound copolymer with an isotactic stereoregularity. Furthermore, the ethylene-aromatic vinyl compound copolymer is one having an alternating structure of ethylene and the aromatic vinyl compound represented by the formula (1) below, and an isotactic diad index m of Ph (an aromatic group) in the structure of the copolymer being more than 0.75: where Ph is an aromatic group and xa is the number of repeating units and an integer of at least 2.
    Type: Application
    Filed: May 22, 2007
    Publication date: August 13, 2009
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Mizuki Hasumi, Seiji Saita, Masaru Hasegawa, Shigeru Suzuki, Akira Miyama, Ayumu Tsukamoto, Toru Arai