Abstract: A method for manufacturing a holding tray for chip components is provided in which residual stress in the elastic member does not affect accuracy in machining of the hole and a metallic mold is not required. The method for manufacturing a holding tray for chip components having a plurality of holding holes includes the steps of preparing a hard substrate including a frame portion, a flat board portion unitarily formed with the inner peripheral surfaces of the frame portion, and a plurality of through-holes formed on the flat board portion; forming an elastic member in a region surrounded by the frame portion of the hard substrate to cure it; and making therethrough holding holes smaller than the through-holes by means of laser machining at positions corresponding to those of the through-holes on the elastic member after curing of the elastic member.

Abstract: A PTC (positive temperature coefficient) thermistor heating apparatus includes two or more heating blocks, each heating block including a PTC thermistor and radiating elements disposed in contact with at least two surfaces of the PTC thermistor; an elastic element disposed between the heating blocks; and insulating elements for holding portions of the radiating elements at the ends of the heating blocks; wherein the heating blocks are biased from each other by an elastic force of the elastic element.