Abstract: A coating treatment apparatus includes: a rotating and holding part; a nozzle supplying a coating solution; a moving mechanism moving the nozzle; and a control unit that controls the rotating and holding part, the nozzle, and the moving mechanism to supply the coating solution onto a central portion of the substrate and rotate the substrate at a first rotation speed, then move a supply position of the coating solution from a central position toward an eccentric position of the substrate with the substrate being rotated at a second rotation speed lower than the first rotation speed while continuing supply of the coating solution, then stop the supply of the coating solution with the rotation speed of the substrate decreased to a third rotation speed lower than the second rotation speed, and then increase the rotation speed of the substrate to be higher than the third rotation speed.

Abstract: A coating treatment apparatus includes: a rotating and holding part; a nozzle supplying a coating solution; a moving mechanism moving the nozzle; and a control unit that controls the rotating and holding part, the nozzle, and the moving mechanism to supply the coating solution onto a central portion of the substrate and rotate the substrate at a first rotation speed, then move a supply position of the coating solution from a central position toward an eccentric position of the substrate with the substrate being rotated at a second rotation speed lower than the first rotation speed while continuing supply of the coating solution, then stop the supply of the coating solution with the rotation speed of the substrate decreased to a third rotation speed lower than the second rotation speed, and then increase the rotation speed of the substrate to be higher than the third rotation speed.

Abstract: A drain port and an exhaust port arranged at the bottom of a cup surrounding a substrate holding unit. A drainage tray is arranged below the cup so as to cover the moving area of the drain port when the substrate holding unit and the cup move in X-directions and Y-directions. An exhaust unit is arranged at a position corresponding to the position of the exhaust port of the cup when the substrate holding unit is in its spin-drying position. The exhaust unit is connected to the exhaust port to suck the interior of the cup when the spin-drying of the substrate is executed. The use of a flexible tube which is always connected to the exhaust port is no longer necessary.

Abstract: A laser processing apparatus includes: a laser beam radiation part that radiates a laser beam to a target position on a substrate; a liquid supply source; a liquid supply nozzle that is connected to the liquid supply source through a liquid supply channel; a guide member for the ejected liquid; and a movement mechanism that allows a substrate holding part, and the laser beam radiation part, the guide member and the liquid supply nozzle to relatively move in a horizontal direction in a state that a center of a radiation spot of the laser beam is in a projection region on the substrate when the liquid ejection port of the liquid supply nozzle is extended in an ejection direction.

Abstract: Before applying a processing laser beam to a surface of a substrate through a film of liquid, distance M2 between a reference point on an axis of a first laser displacement meter and the surface of the substrate is measured to correct distance M1 between a lower end of an optical unit and the surface of the substrate, on the basis of distance M2, the processing laser beam is applied to the surface of the substrate, thereby cutting and removing a part of the surface of the substrate, and a depth to which the surface of the substrate has been cut and removed with the processing laser beam is measured by a second laser displacement meter.

Abstract: A notch or the like of a wafer is detected via a guide member by means of a CCD camera provided so that an optical axis is coaxial to an optical axis of a laser beam, and alignment of the wafer is carried out. Next, in a state in which liquid ejected from a main nozzle or sub-nozzles is guided by means of the guide member, a laser beam whose optical axis is provided to be coaxial to the optical axis of the CCD camera is irradiated via the guide member. In addition, a predetermined processing operation is carried out with respect to the surface while an irradiation position of the laser beam is moved in a horizontal direction. The wafer is then transported from a chuck to the outside, and then, a purge gas is supplied to a bottom face of the guide member, and the bottom face is dried.

Abstract: A laser processing apparatus comprises a laser source, a substrate-holding unit, a liquid-supplying unit, a support which has a plurality of mask patterns including a specific mask pattern for imparting a cross-sectional shape to the laser beam, and a support-driving mechanism which moves the support. The liquid-supplying unit supplies the liquid to the substrate, forming a liquid film thereon. The support-driving mechanism moves the support, aligning the specific mask pattern with an axis of the laser beam. The laser beam emitted from the laser unit passes through the specific mask pattern, acquiring a specific cross-sectional shape, and is applied to the substrate through the liquid film, illuminating.

Abstract: A drain port and an exhaust port arranged at the bottom of a cup surrounding a substrate holding unit. A drainage tray is arranged below the cup so as to cover the moving area of the drain port when the substrate holding unit and the cup move in X-directions and Y-directions. An exhaust unit is arranged at a position corresponding to the position of the exhaust port of the cup when the substrate holding unit is in its spin-drying position. The exhaust unit is connected to the exhaust port to suck the interior of the cup when the spin-drying of the substrate is executed. The use of a flexible tube which is always connected to the exhaust port is no longer necessary.

Abstract: A drain port and an exhaust port arranged at the bottom of a cup surrounding a substrate holding unit. A drainage tray is arranged below the cup so as to cover the moving area of the drain port when the substrate holding unit and the cup move in X-directions and Y-directions. An exhaust unit is arranged at a position corresponding to the position of the exhaust port of the cup when the substrate holding unit is in its spin-drying position. The exhaust unit is connected to the exhaust port to suck the interior of the cup when the spin-drying of the substrate is executed. The use of a flexible tube which is always connected to the exhaust port is no longer necessary.

Abstract: A laser processing apparatus includes: a laser beam radiation part that radiates a laser beam to a target position on a substrate; a liquid supply source; a liquid supply nozzle that is connected to the liquid supply source through a liquid supply channel; a guide member for the ejected liquid; and a movement mechanism that allows a substrate holding part, and the laser beam radiation part, the guide member and the liquid supply nozzle to relatively move in a horizontal direction in a state that a center of a radiation spot of the laser beam is in a projection region on the substrate when the liquid ejection port of the liquid supply nozzle is extended in an ejection direction.

Abstract: A drain port and an exhaust port arranged at the bottom of a cup surrounding a substrate holding unit. A drainage tray is arranged below the cup so as to cover the moving area of the drain port when the substrate holding unit and the cup move in X-directions and Y-directions. An exhaust unit is arranged at a position corresponding to the position of the exhaust port of the cup when the substrate holding unit is in its spin-drying position. The exhaust unit is connected to the exhaust port to suck the interior of the cup when the spin-drying of the substrate is executed. The use of a flexible tube which is always connected to the exhaust port is no longer necessary.

Abstract: To process a surface of a substrate by applying a laser beam to the surface, while liquid is being applied to the surface, distance between the surface of the substrate and a reference point on the axis of a laser displacement meter, distance between the surface of the substrate and the lower end an optical unit is adjusted in accordance with distance measured, and a laser beam is then applied to the surface of the substrate.

Abstract: A notch or the like of a wafer is detected via a guide member by means of a CCD camera provided so that an optical axis is coaxial to an optical axis of a laser beam, and alignment of the wafer is carried out. Next, in a state in which liquid ejected from a main nozzle or sub-nozzles is guided by means of the guide member, a laser beam whose optical axis is provided to be coaxial to the optical axis of the CCD camera is irradiated via the guide member. In addition, a predetermined processing operation is carried out with respect to the surface while an irradiation position of the laser beam is moved in a horizontal direction. The wafer is then transported from a chuck to the outside, and then, a purge gas is supplied to a bottom face of the guide member, and the bottom face is dried.

Abstract: A laser processing apparatus comprises a laser source, a substrate-holding unit, a liquid-supplying unit, a support which has a plurality of mask patterns including a specific mask pattern for imparting a cross-sectional shape to the laser beam, and a support-driving mechanism which moves the support. The liquid-supplying unit supplies the liquid to the substrate, forming a liquid film thereon. The support-driving mechanism moves the support, aligning the specific mask pattern with an axis of the laser beam. The laser beam emitted from the laser unit passes through the specific mask pattern, acquiring a specific cross-sectional shape, and is applied to the substrate through the liquid film, illuminating.

Abstract: The present invention relates to a method of supplying a developing solution to a surface of a substrate to perform developing treatment for the substrate, comprising a first step of supplying the developing solution to the surface of the substrate while a developing solution supply nozzle is moving relative to the substrate and a second step of developing the substrate for a first predetermined period of time, and the second step has the step of stirring the developing solution on the surface of the substrate after a second predetermined period of time from the completion of the first step. Because of stirring, the concentration of the developing solution on the substrate is made uniform, resulting in a rise in the uniformity of developing treatment.

Abstract: In a developing processing to apply the developing solution onto the substrate after the light exposure, a developing solution supply nozzle scans a substrate more than once while discharging the developing solution on the substrate in a band shape to coat the substrate with the developing solution. Thus, it is possible to perform a developing processing with a small variation and high uniformity of the line width.

Abstract: The present invention relates to a method of supplying a developing solution to a surface of a substrate to perform developing treatment for the substrate, comprising a first step of supplying the developing solution to the surface of the substrate while a developing solution supply nozzle is moving relative to the substrate and a second step of developing the substrate for a first predetermined period of time, and the second step has the step of stirring the developing solution on the surface of the substrate after a second predetermined period of time from the completion of the first step. Because of stirring, the concentration of the developing solution on the substrate is made uniform, resulting in a rise in the uniformity of developing treatment.

Abstract: A developing apparatus comprises a table on which is disposed a substrate having a resist coating film formed thereon, a nozzle for supplying a developing solution to the substrate disposed on the table, a liquid supplying mechanism for supplying the developing solution to the nozzle, and a moving mechanism for relatively moving the nozzle and the substrate, wherein the nozzle includes a liquid inlet port communicating with the liquid supplying mechanism, a liquid reservoir for temporarily storing the developing solution supplied from the liquid supplying mechanism through the liquid inlet port, a narrow passageway communicating with the bottom portion of the liquid reservoir to cause pressure loss of the developing solution coming from the liquid reservoir, a linear liquid discharge section having a discharge port passageway communicating with the narrow passageway, and a buffering member arranged within the discharge port passageway and in the vicinity of the outlet port of the narrow passageway, the buffer

Abstract: An exhaust gas cleaner is constituted by a first catalyst carrying an Ag component, a second catalyst carrying an Ni component or two or more of an Ni component, Ag component and Cu component, and optionally a third catalyst carrying a noble metal component alone or in combination with a base metal component. The second and third catalysts may be physically mixed to form a mixed catalyst. Another exhaust gas cleaner is constituted by a mixed catalyst of a first catalyst carrying an Ag component and a second catalyst carrying an Ni component alone or in combination with a Cu component, and a third catalyst carrying a noble metal component alone or in combination with a base metal component. Still another exhaust gas cleaner is constituted by a first catalyst carrying an Ag component, a second catalyst which is a mixture of an Ni catalyst, Ag catalyst and Cu catalyst, and optionally a third catalyst carrying a noble metal component alone or in combination with a base metal component.